Comparison of Electromigration in Cu Interconnects with ALD or PVD TaN Liners
| Title: | Comparison of Electromigration in Cu Interconnects with ALD or PVD TaN Liners Atomic layer deposition application |
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| Authors: | Hu, C., Gignac, L., Liniger, E., Grunow, S., Simon, A., Liew, S. |
| Source: | ECS TRANSACTIONS. 3(15):139-146 |
| Availability: | http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN065500703&indx=1&recIds=ETOCCN065500703 |
| Database: | British Library Document Supply Centre Inside Serials & Conference Proceedings |
| ISBN: | 9781566775427 1566775426 |
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| Published in: | ECS TRANSACTIONS |
| Language: | English |