Wafer Level Hermetic Packaging for Above-IC RF MEMS: Process and Characterization

Bibliographic Details
Title: Wafer Level Hermetic Packaging for Above-IC RF MEMS: Process and Characterization
International symposium on microelectronics
Authors: Sillon, N., Gillot, C., Robert, P., Dahan, E., Baillin, X., Lagoutte, E.
Source: PROCEEDINGS OF THE INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS. :106-106
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