Bibliographic Details
Title: |
Wafer Level Hermetic Packaging for Above-IC RF MEMS: Process and Characterization International symposium on microelectronics |
Authors: |
Sillon, N., Gillot, C., Robert, P., Dahan, E., Baillin, X., Lagoutte, E. |
Source: |
PROCEEDINGS OF THE INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS. :106-106 |
Availability: |
http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN062354535&indx=1&recIds=ETOCCN062354535 |
Database: |
British Library Document Supply Centre Inside Serials & Conference Proceedings |