Bibliographic Details
| Title: |
Timing resolution performance of Timepix4 bump-bonded assemblies |
| Authors: |
Bolzonella, Riccardo, Alozy, Jerome Alexandre, Ballabriga, Rafael, van Beuzekom, Martin, Biesuz, Nicolò Vladi, Campbell, Michael, Cardarelli, Paolo, Cavallini, Viola, Coco, Victor, Ramusino, Angelo Cotta, Fiorini, Massimiliano, Gromov, Vladimir, Guarise, Marco, Cudie, Xavier Llopart, Okamura, Shinichi, Romolini, Gabriele, Saputi, Alessandro, Vitkovskiy, Arseniy |
| Publication Year: |
2024 |
| Collection: |
Physics (Other) |
| Subject Terms: |
Physics - Instrumentation and Detectors |
| More Details: |
The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;\mu\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole pairs in the silicon bulk in a repeatable fashion, controlling the amount, position and time of the stimulated charge signal. The timing resolution for a single pixel has been measured to $107\;\textrm{ps}$ r.m.s. for laser-stimulated signals in the silicon sensor bulk. Considering multi-pixel clusters, the measured timing resolution reached $33\;\textrm{ps}$ r.m.s. exploiting oversampling of the timing information over several pixels.
Comment: 24 pages, 31 figures, Prepared for submission to JINST |
| Document Type: |
Working Paper |
| Access URL: |
http://arxiv.org/abs/2404.15499 |
| Accession Number: |
edsarx.2404.15499 |
| Database: |
arXiv |
