Atomic Layer deposition of 2D and 3D standards for quantitative synchrotron-based composition and structural analysis methods

Bibliographic Details
Title: Atomic Layer deposition of 2D and 3D standards for quantitative synchrotron-based composition and structural analysis methods
Authors: Becker, Nicholas G., Butterworth, Anna, Sokolov, Andrey, Salome, Muriel, Sutton, Steven, Vincent, De Andrade, Westphal, Andrew, Proslier, Thomas
Publication Year: 2017
Collection: Condensed Matter
Physics (Other)
Subject Terms: Physics - Instrumentation and Detectors, Condensed Matter - Materials Science
More Details: The use of Standard Reference Materials (SRM) from the National Institute of Standards and Technology (NIST) for quantitative analysis of chemical composition using Synchrotron based X-Ray Florescence (SR-XRF) and Scanning Transmission X-Ray Microscopy (STXM) is common. These standards however can suffer from inhomogeneity in chemical composition and thickness and often require further calculations, based on sample mounting and detector geometry, to obtain quantitative results. These inhomogeneities negatively impact the reproducibility of the measurements and the quantitative measure itself. Atomic Layer Deposition (ALD) is an inexpensive, scalable deposition technique known for producing uniform, conformal films of a wide range of compounds on nearly any substrate material. These traits make it an ideal deposition method for producing films to replace the NIST standards and create SRM on a wide range of relevant 2D and 3D substrates. Utilizing Rutherford Backscattering, X-ray Reflectivity, Quartz crystal microbalance, STXM, and SR-XRF we show that ALD is capable of producing films that are homogenous over scales ranging from 100's of microns to nms
Document Type: Working Paper
Access URL: http://arxiv.org/abs/1705.08403
Accession Number: edsarx.1705.08403
Database: arXiv
More Details
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