Bibliographic Details
| Title: |
Feasibility Test of a Liquid Film Thickness Sensor on a Flexible Printed Circuit Board Using a Three-Electrode Conductance Method. |
| Authors: |
Kyu Byung Lee, Jong Rok Kim, Goon Cherl Park, Hyoung Kyu Cho |
| Source: |
Sensors (14248220); Jan2017, Vol. 17 Issue 1, p42, 14p |
| Subject Terms: |
LIQUID films, PRINTED circuits, ELECTRODES, ELECTRIC admittance, THICKNESS measurement |
| Abstract: |
Liquid film thickness measurements under temperature-varying conditions in a two-phase flow are of great importance to refining our understanding of two-phase flows. In order to overcome the limitations of the conventional electrical means of measuring the thickness of a liquid film, this study proposes a three-electrode conductance method, with the device fabricated on a flexible printed circuit board (FPCB). The three-electrode conductance method offers the advantage of applicability under conditions with varying temperatures in principle, while the FPCB has the advantage of usability on curved surfaces and in relatively high-temperature conditions in comparison with sensors based on a printed circuit board (PCB). Two types of prototype sensors were fabricated on an FPCB and the feasibility of both was confirmed in a calibration test conducted at different temperatures. With the calibrated sensor, liquid film thickness measurements were conducted via a falling liquid film flow experiment, and the working performance was tested. [ABSTRACT FROM AUTHOR] |
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| Database: |
Complementary Index |
