Title: |
Bonding values of two contemporary ceramic inlay materials to dentin following simulated aging. |
Authors: |
Khalil, Ashraf Abdelfattah, Abdelaziz, Khalid Mohamed |
Source: |
Journal of Advanced Prosthodontics; Dec2015, Vol. 7 Issue 6, p446-453, 8p |
Subject Terms: |
INLAYS (Dentistry), DENTAL bonding, DENTAL ceramics, DENTAL resins, DENTIN |
Abstract: |
PURPOSE. To compare the push-out bond strength of feldspar and zirconia-based ceramic inlays bonded to dentin with different resin cements following simulated aging. MATERIALS AND METHODS. Occlusal cavities in 80 extracted molars were restored in 2 groups (n=40) with CAD/CAM feldspar (Vitablocs Trilux forte) (FP) and zirconia-based (Ceramill Zi) (ZR) ceramic inlays. The fabricated inlays were luted in 2 subgroups (n=20) with either etch-and-bond (RelyX Ultimate Clicker) (EB) or self-adhesive (RelyX Unicem Aplicap) (SA) resin cement. Ten inlays in each subgroup were subjected to 3,500 thermal cycles and 24,000 loading cycles, while the other 10 served as control. Horizontal 3 mm thick specimens were cut out of the restored teeth for push out bond strength testing. Bond strength data were statistically analyzed using 1-way ANOVA and Tukey's comparisons at α =.05. The mode of ceramic-cement-dentin bond failure for each specimen was also assessed. RESULTS. No statistically significant differences were noticed between FP and ZR bond strength to dentin in all subgroups (ANOVA, P=.05113). No differences were noticed between EB and SA (Tukey's, P>.05) bonded to either type of ceramics. Both adhesive and mixed modes of bond failure were dominant for non-aged inlays. Simulated aging had no significant effect on bond strength values (Tukey's, P>.05) of all ceramic-cement combinations although the adhesive mode of bond failure became more common (60-80%) in aged inlays. CONCLUSION. The suggested cement-ceramic combinations offer comparable bonding performance to dentin substrate either before or after simulated aging that seems to have no adverse effect on the achieved bond. [ABSTRACT FROM AUTHOR] |
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Database: |
Complementary Index |