Thermal expansivity measurements below 300 K on a copper-beryllium alloy.
| Title: | Thermal expansivity measurements below 300 K on a copper-beryllium alloy. |
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| Authors: | Holtz, R. L., Swenson, C. A. |
| Source: | Journal of Applied Physics; May 1983, Vol. 54, p2844-2846, 3p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00218979 |
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| DOI: | 10.1063/1.332274 |
| Published in: | Journal of Applied Physics |
| Language: | English |