Intermetallic Reactions in Sn-8Zn-20In Solder Ball Grid Array Packages with Au/Ni/Cu and Ag/Cu Pads.
| Title: | Intermetallic Reactions in Sn-8Zn-20In Solder Ball Grid Array Packages with Au/Ni/Cu and Ag/Cu Pads. |
|---|---|
| Authors: | Liu, Yu-Chih, Lin, Wei-Hong, Lin, Hsiu-Jen |
| Source: | Journal of Electronic Materials; January 2006, Vol. 35 Issue 1, p147-153, 7p |
| Database: | Applied Science & Technology Source |
| ISSN: | 03615235 |
|---|---|
| DOI: | 10.1007/s11664-006-0197-7 |
| Published in: | Journal of Electronic Materials |
| Language: | English |