Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling: Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi...: C.-L. Hsieh et al.
| Title: | Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling: Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi...: C.-L. Hsieh et al. |
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| Authors: | Hsieh, Chen-Lin1, chen-lin.hsieh19@imperial.ac.uk, Coyle, Richard J.2, Gourlay, Christopher M.1 |
| Source: | Journal of Electronic Materials; Apr2025, Vol. 54 Issue 4, p2657-2671, 15p |
| Database: | Applied Science & Technology Source |
| ISSN: | 03615235 |
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| DOI: | 10.1007/s11664-025-11747-4 |
| Published in: | Journal of Electronic Materials |
| Language: | English |