Transferable tight-binding model for strained group IV and III-V materials and heterostructures.

Bibliographic Details
Title: Transferable tight-binding model for strained group IV and III-V materials and heterostructures.
Authors: Yaohua Tan1,2 tyhua02@gmail.com, Povolotskyi, Michael1, Kubis, Tillmann1, Boykin, Timothy B.3, Klimeck, Gerhard1
Source: Physical Review B. Jul2016, Vol. 94 Issue 4, p1-1. 1p.
Subject Terms: *GROUP 14 elements, *HETEROSTRUCTURES
People: KUBIS, Tillmann, KLIMECK, Gerhard
Abstract: It is critical to capture the effect due to strain and material interface for device level transistor modeling. We introduce a transferable sp³d5s* tight-binding model with nearest-neighbor interactions for arbitrarily strained group IV and III-V materials. The tight-binding model is parametrized with respect to hybrid functional (HSE06) calculations for varieties of strained systems. The tight-binding calculations of ultrasmall superlattices formed by group IV and group III-V materials show good agreement with the corresponding HSE06 calculations. The application of the tight-binding model to superlattices demonstrates that the transferable tight-binding model with nearest-neighbor interactions can be obtained for group IV and III-V materials. [ABSTRACT FROM AUTHOR]
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Database: Academic Search Complete
More Details
ISSN:24699950
DOI:10.1103/PhysRevB.94.045311
Published in:Physical Review B
Language:English