Bibliographic Details
| Title: |
Three-tier chips stack with TSVs for backside illuminated image sensor/ADC/ISP |
| Authors: |
Chang, H. H., Hsiao, Z. C., Chien, C. H., Zhan, C. J., Hsin, Y. C., Tzeng, P. J., Chen, T. S., Ko, C. T., Lo, W. C., Kao, M. J. |
| Source: |
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2014. :1-6 Sep, 2014 |
| Relation: |
2014 Electronics System-Integration Technology Conference (ESTC) |
| Database: |
IEEE Xplore Digital Library |
