Electromigration and adhesion
| Title: | Electromigration and adhesion |
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| Authors: | Lloyd, J.R., Lane, M.W., Liniger, E.G., Hu, C.-K., Shaw, T.M., Rosenberg, R. |
| Source: | IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 5(1):113-118 Mar, 2005 |
| Database: | IEEE Xplore Digital Library |
| ISSN: | 15304388 15582574 |
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| DOI: | 10.1109/TDMR.2005.846308 |
| Published in: | IEEE Transactions on Device and Materials Reliability, Device and Materials Reliability, IEEE Transactions on, IEEE Trans. Device Mater. Relib. |