Reliability Aspects and Study of Copper Seed Deposition on Polyimide via Sputtering - Yojo, Leonardo Shimizu; Santos, Favero Guilherme; Pontes, Fagnaldo Braga; Dos Santos, Carlos R. P.; Hasenkamp, Willyan; Dutra e Silva, Elvio C. (2023 37th Symposium on Microelectronics Technology and Devices (SBMicro), Microelectronics Technology and Devices (SBMicro), 2023 37th Symposium on, 2023)