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3D Integrated Laser Attach Technology on a 300-mm Monolithic CMOS Silicon Photonics Platform

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Title: 3D Integrated Laser Attach Technology on a 300-mm Monolithic CMOS Silicon Photonics Platform
Authors: Bian, Y., Ramachandran, K., Wu, Z., Hedrick, B., Dezfulian, K.K., Houghton, T., Nummy, K., Fisher, D.W., Hirokawa, T., Donegan, K., Afzal, F.O., Esopi, M., Karra, V., Lee, W.S., Sorbara, M., Lubguban, J., Cho, J.K., Cao, R., Ding, H., Chandran, S., Rakowski, M., Aboketaf, A., Krishnamurthy, S., Mills, S., Peng, B., Pepper, J., Deka, S., Feng, W., Rishton, S., Boudreau, M., Logan, D., Hickey, R., Gomes, P.C., Murray, K., Dewanjee, A., Riggs, D., Robson, N., Melville, I., Augur, R., Fox, R., Gupta, V., Yu, A., Giewont, K., Pellerin, J., Letavic, T.
Source: IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 29(3: Photon. Elec. Co-Inte. and Adv. Trans. Print.):1-19 Jun, 2023
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  Data: IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 29(3: Photon. Elec. Co-Inte. and Adv. Trans. Print.):1-19 Jun, 2023
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