CNT‐Assembled Octahedron Carbon‐Encapsulated Cu3P/Cu Heterostructure by In Situ MOF‐Derived Engineering for Superior Lithium Storage: Investigations by Experimental Implementation and First‐Principles Calculation
Title: | CNT‐Assembled Octahedron Carbon‐Encapsulated Cu3P/Cu Heterostructure by In Situ MOF‐Derived Engineering for Superior Lithium Storage: Investigations by Experimental Implementation and First‐Principles Calculation |
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Authors: | Jia Lin, Chenghui Zeng, Xiaoming Lin, Chao Xu, Cheng‐Yong Su |
Source: | Advanced Science, Vol 7, Iss 14, Pp n/a-n/a (2020) |
Publisher Information: | Wiley, 2020. |
Publication Year: | 2020 |
Collection: | LCC:Science |
Subject Terms: | carbon nanotube‐assembled octahedra, copper phosphides, heterostructured anodes, lithium storage, metal–organic frameworks (MOFs), Science |
More Details: | Abstract Conspicuously, metal–organic frameworks (MOFs) serve as homogenously and periodically atom‐dispersed self‐sacrificial template for in situ engineering of hierarchical porous carbon‐encapsulated micro/nanoheterostructure materials, integrating the merits of micro/nanostructure to high‐volumetric energy storage. Copper phosphide represents a promising candidate due to its compact material density compared to commercial graphite. Herein, micro/nanostructured Cu3P/Cu encapsulated by carbon‐nanotube‐assembled hierarchical octahedral carbonaceous matrix (Cu3P/Cu@CNHO) is constructed by an in situ MOF‐derived engineering for novel anode material in LIBs, which achieves an extraordinary cycling stability (a well‐maintained gravimetric/volumetric capacity of 463.2 mAh g−1/1878.4 mAh cm−3 at 1 A g−1 up to 1600 cycles) and distinguished rate capability (an ameliorated capacity of 317.7 mAh g−1 even at 10 A g−1), together with unprecedented heat‐resistant capability (an elevated temperature of 50 °C for 1000 cycles maintaining 434.7 mAh g−1 at 0.5 A g−1). The superior electrochemical performance of Cu3P/Cu@CNHO is credited to the large specific surface area, conductive carbon matrix and metallic copper dopants, synergistic effects of the intrinsic Cu3P/Cu heterostructure, and well‐defined micro/nanostructure, facilitating a boosted electrochemical conductivity and accelerated diffusion kinetics. |
Document Type: | article |
File Description: | electronic resource |
Language: | English |
ISSN: | 2198-3844 |
Relation: | https://doaj.org/toc/2198-3844 |
DOI: | 10.1002/advs.202000736 |
Access URL: | https://doaj.org/article/230f9594874340b18aad25f0d3c8d9c5 |
Accession Number: | edsdoj.230f9594874340b18aad25f0d3c8d9c5 |
Database: | Directory of Open Access Journals |
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