APA (7th ed.) Citation

Chiang, C., Huang, R., Liang, C., Wu, C. M., & Kuan, Y. (2021). A 3-D Pillar-Based Electromagnetic Interference Shield for W -Band Antenna on Silicon Using Wire Bonding Technology. IEEE transactions on components, packaging, and manufacturing technology, 11(12), 2238-2241.

Chicago Style (17th ed.) Citation

Chiang, Ching-Wen, Rulin Huang, Chia-Jen Liang, Chung-Tse Michael Wu, and Yen-Cheng Kuan. "A 3-D Pillar-Based Electromagnetic Interference Shield for W -Band Antenna on Silicon Using Wire Bonding Technology." IEEE Transactions on Components, Packaging, and Manufacturing Technology 11, no. 12 (2021): 2238-2241.

MLA (8th ed.) Citation

Chiang, Ching-Wen, et al. "A 3-D Pillar-Based Electromagnetic Interference Shield for W -Band Antenna on Silicon Using Wire Bonding Technology." IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 11, no. 12, 2021, pp. 2238-2241.

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