Anderson, E. M., Wood, M. G., Friedman, T. A., Arterburn, S. C., Martinez, W. M., Reyna, R., . . . Shank, J. C. (2024). Gasb-to-Si Direct Wafer Bonding and Thermal Budget Considerations for Photonic Applications. ECS Meeting Abstracts, MA2024-01(1), 1509. https://doi.org/10.1149/MA2024-01301509mtgabs

Anderson, Evan M., et al. "Gasb-to-Si Direct Wafer Bonding and Thermal Budget Considerations for Photonic Applications." ECS Meeting Abstracts MA2024-01, no. 1 (2024): 1509. https://doi.org/10.1149/MA2024-01301509mtgabs.

Anderson, Evan M., et al. "Gasb-to-Si Direct Wafer Bonding and Thermal Budget Considerations for Photonic Applications." ECS Meeting Abstracts, vol. MA2024-01, no. 1, 2024, p. 1509, https://doi.org/10.1149/MA2024-01301509mtgabs.