Impact of Thermal Effects on Cryptographic Resilience: A Study of an ASIC Implementation of the Montgomery Ladder

Authors: Kabin, Ievgen, Langendoerfer, Peter, Dyka, Zoya

Source: 2025 IEEE 26th Latin American Test Symposium (LATS) Latin American Test Symposium (LATS), 2025 IEEE 26th. :1-4 Mar, 2025

Relation: 2025 IEEE 26th Latin American Test Symposium (LATS)

An Efficient Branch-and-Bound Routing Optimization Method for Optical NoCs

Authors: Liu, Y., Ye, Y.

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 44(4):1276-1289 Apr, 2025

Investigation of Thermal Sensitivity and Linearity of Quantum Well-Based Heterojunction Bipolar Transistor

Authors: Kumar, M., Chang, S., Wu, C.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 72(1):111-118 Jan, 2025

Analysis of TCC in p-n Short Silicon Diodes at 300–400 K

Authors: Kubica, R.M.R., Albouy, A., Balestra, F., Aliane, A., Leduc, P.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(8):4476-4482 Aug, 2024

An Efficient Branch-and-Bound Routing Algorithm for Optical NoCs

Authors: Liu, Yihao, Ye, Yaoyao

Source: 2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC) Design Automation Conference (ASP-DAC), 2024 29th Asia and South Pacific. :860-865 Jan, 2024

Relation: 2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC)

Thermal Sensitivity Mapping with OBIRCH

Authors: Ching, Keyt Yeng, Tan, Jethro, Chan, Gary

Source: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-4 Jul, 2023

Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

A Temperature Independent Readout Circuit for ISFET-Based Sensor Applications

Authors: Moussavi, Elmira, Sisejkovic, Dominik, Singh, Animesh, Kizatov, Daniyar, Leupers, Rainer, Ingebrandt, Sven, Pachauri, Vivek, Merchant, Farhad

Source: 2022 IEEE 23rd Latin American Test Symposium (LATS) Latin American Test Symposium (LATS), 2022 IEEE 23rd. :1-4 Sep, 2022

Relation: 2022 IEEE 23rd Latin American Test Symposium (LATS)

The Electrical Characteristics of the Co/Giemsa/n-Si Heterostructure Depending on Measurement Temperatures and Frequencies

Authors: Kocyigit, A., Aydogan, S., Incekara, U., Yilmaz, M.

Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(8):8184-8191 Apr, 2023

Thermal Sensing Characteristics of Low-Voltage n-Channel Organic Field-Effect Transistors With Triple Layers of Naphthalenediimide-Containing Conjugated Polymer and Gate-Insulating Polymers

Authors: Lee, C., Lee, W., Song, M., Kim, H., Kim, Y.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(2):720-725 Feb, 2023

Influence of rice husk ash inclusion on electrical characteristics of dry cement mortar

Authors: Etuk Sunday Edet, Robert Ubong Williams, Okechukwu Agbasi, Inyang Namdie Joseph

Source: Zaštita Materijala, Vol 65, Iss 4, Pp 660-667 (2024)

Subject Terms: building, electrical resistance, temperature sensing, thermal sensitivity index, waste, Chemical technology, TP1-1185

File Description: electronic resource

Relation: https://www.zastita-materijala.org/index.php/home/article/view/1051; https://doaj.org/toc/0351-9465; https://doaj.org/toc/2466-2585

Access URL: https://doaj.org/article/6790030d9080403aa00eeae86c6f81fe

Methodology of Specification of Parameters of Strengthening of Elements of Bearing Surfaces of Aircraft

Authors: Senyk, Andriy, Pabyrivskyi, Viktor, Ukhanska, Oksana, Futryk, Yuriy, Senyk, Yuliya, Stepanyuk, Oleksandr

Source: 2022 IEEE 16th International Conference on Advanced Trends in Radioelectronics, Telecommunications and Computer Engineering (TCSET) Advanced Trends in Radioelectronics, Telecommunications and Computer Engineering (TCSET), 2022 IEEE 16th International Conference on. :746-750 Feb, 2022

Relation: 2022 IEEE 16th International Conference on Advanced Trends in Radioelectronics, Telecommunications and Computer Engineering (TCSET)

Multi-objective optimization of kitchen comfort based on arithmetic superposition index P

Authors: Shunyu Zhang, Xiangrui Zhao, Liangguo Cheng, Zhihang Shen, Zhenlei Chen

Source: Case Studies in Thermal Engineering, Vol 66, Iss , Pp 105745- (2025)

Subject Terms: Arithmetic superposition index P, Thermal sensitivity weighting, Multi-objective optimization, Kitchen comfort, Orthogonal experiments, Auxiliary ventilation, Engineering (General). Civil engineering (General), TA1-2040

File Description: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2214157X2500005X; https://doaj.org/toc/2214-157X

Access URL: https://doaj.org/article/d5cd824a1ad5435f99878c6ae0650f21

Temperature Insensitive Delay-Line Fiber Interferometer Operating at Room Temperature

Authors: Shi, B., Marra, G., Feng, Z., Sakr, H., Hayes, J.R., Fokoua, E.R.N., Ding, M., Poletti, F., Richardson, D.J., Slavik, R.

Source: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 40(16):5716-5721 Aug, 2022

Parametric Thermal Sensitivity Analysis of 225kW High Speed PMSM for Blower Application

Authors: Abubakar, Usman, Wang, Xiaoyuan, Shah, Sayyed Haleem, Ur rahman, Sadiq

Source: 2021 IEEE Industrial Electronics and Applications Conference (IEACon) Industrial Electronics and Applications Conference (IEACon), 2021 IEEE. :97-102 Nov, 2021

Relation: 2021 IEEE Industrial Electronics and Applications Conference (IEACon)

Optimizing Hollow Core Fibers for Stable Interferometry

Authors: Shi, Bo, Davidson, Ian A., Mahdiraji, Ghafour A., Rzegocki, Jaroslaw, Numkam Fokoua, Eric R., Mousavi, Mohammad, Feng, Zitong, Ding, Meng, Poletti, Francesco, Richardson, David J., Slavik, Radan

Source: 2023 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS) Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS), 2023 Joint Conference of the European. :1-2 May, 2023

Relation: 2023 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS)

Effect of Extraction and Spray Drying Temperatures on The Bioactive Materials Content in Red Dragon Fruit Skin

Authors: Dian Shofinita, Yazid Bindar, Tjokorde Walmiki Samadhi, Arwinda Jaelawijaya, Darien Theodric, Amarthya Benigna Achmadi

Source: International Journal of Technology, Vol 15, Iss 5, Pp 1282-1291 (2024)

Subject Terms: antioxidant, dragon fruit skin, food colorants, spray drying, thermal sensitivity, Technology, Technology (General), T1-995

File Description: electronic resource

Relation: https://ijtech.eng.ui.ac.id/article/view/6040; https://doaj.org/toc/2086-9614; https://doaj.org/toc/2087-2100

Access URL: https://doaj.org/article/f2b25c24820d440494eefa37b0517bf4

Local temperature of water determined based on fluorescent intensity ratio of NaYF4:Er3+,Yb3+ upconversion nanoparticles

Authors: Nguyen, Van Nghia ^{a, ⁎}, Trinh, Duc Thien ^b, Nguyen, Dinh Lam ^c, Nguyen, Thanh Huong ^d, Le Thi, Minh Cham ^a, Nguyen Thi, Ha Phuong ^a, Nguyen, Ngoc Thanh ^e, Pham, Hung-Vuong ^f, Le, Quoc Minh ^{d, g}

Source: In Ceramics International April 2025 51(10):13580-13585

Thermal comfort characteristics of preschool children in kindergartens: A field study during summer in the hot summer and cold winter zone of China

Authors: Chen, Weiming ^{a, b}, Chang, Junrui ^c, Wang, Qin ^c, Liu, Ningrui ^d, Gao, Xinting ^e, Zhang, Hui ^f, Zhu, Yingxin ^{a, g}, Cao, Bin ^{a, b, ⁎}

Source: In Sustainable Cities and Society 1 March 2025 121

Local thermal sensation and thermal comfort of human body during small-scale thermal stimulus

Authors: Yue, Huanyu ^{a, b}, Cao, Bin ^{a, b, ⁎}

Source: In Building and Environment 15 February 2025 270

Experimental research on human thermal sensitivity and thermal demand distribution in regional regulatory environments

Authors: Li, Han ^a, Wu, Zhiyao ^a, Hu, Haiyu ^b, Kong, Xiangfei ^{a, ⁎}, Fan, Man ^a

Source: In Building and Environment 15 February 2025 270