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1Conference
Authors: Lozano, Adolfo
Source: 2025 41st Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2025 41st. :47-53 Mar, 2025
Relation: 2025 41st Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
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2Academic Journal
Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 25(8):12695-12702 Apr, 2025
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3Academic Journal
Authors: Zhang, W., He, Y., Xu, M., Li, Y., Bai, Y., Wang, X., Gyselinck, J., Gerada, D.
Source: IEEE Transactions on Transportation Electrification IEEE Trans. Transp. Electrific. Transportation Electrification, IEEE Transactions on. 11(2):5156-5168 Apr, 2025
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4Book
Source: Devices and Wearables Using Smart Actuator. Mar 12, 2025
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5Conference
Authors: Petrov, Panayot, Mollov, Valentin
Source: 2024 International Conference Automatics and Informatics (ICAI) Automatics and Informatics (ICAI), 2024 International Conference. :51-55 Oct, 2024
Relation: 2024 International Conference Automatics and Informatics (ICAI)
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6Academic Journal
Source: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 31(5):2776-2784 Oct, 2024
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7Academic Journal
Source: IEEE Transactions on Antennas and Propagation IEEE Trans. Antennas Propagat. Antennas and Propagation, IEEE Transactions on. 72(6):5273-5282 Jun, 2024
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8Conference
Authors: Zhang, Wei, Li, Shaohua, Xu, Kai, Zhou, Bo, Chen, Xuezhi, Wu, Da
Source: 2023 7th International Conference on Electrical, Mechanical and Computer Engineering (ICEMCE) Electrical, Mechanical and Computer Engineering (ICEMCE), 2023 7th International Conference on. :78-82 Oct, 2023
Relation: 2023 7th International Conference on Electrical, Mechanical and Computer Engineering (ICEMCE)
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9Academic Journal
Authors: Smirnov, V.I., Gavrikov, A.A.
Source: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 73:1-9 2024
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10Conference
Authors: Raina, Gautam, Sharma, Shubham, Sinha, Sunanda
Source: 2023 IEEE 3rd International Conference on Sustainable Energy and Future Electric Transportation (SEFET) Sustainable Energy and Future Electric Transportation (SEFET), 2023 IEEE 3rd International Conference on. :1-6 Aug, 2023
Relation: 2023 IEEE 3rd International Conference on Sustainable Energy and Future Electric Transportation (SEFET)
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11Conference
Authors: Saito, Ryo, Amano, Haruto, Mineta, Takashi
Source: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :820-823 Jun, 2023
Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)
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12Conference
Authors: Lallo, Elias, Sahlen, Wilhelm, Elfsberg, Mattias, Munktell, Sara
Source: 2023 IEEE Pulsed Power Conference (PPC) Pulsed Power Conference (PPC), 2023 IEEE. :1-4 Jun, 2023
Relation: 2023 IEEE Pulsed Power Conference (PPC)
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13Academic Journal
Authors: Yongjie Ma, Jingyong Wang, Fuhang Hu, Echuan Yan, Yu Zhang, Hao Deng, Xuefeng Gao, Jianguo Kang, Haoxin Shi, Xin Zhang, Jianqiao Zheng, Jixiang Guo
Source: Scientific Reports, Vol 15, Iss 1, Pp 1-22 (2025)
Subject Terms: Ground source heat pump, Shallow geothermal energy, Improved combined thermal response test, Artificial neural network, Thermal conductivity, Medicine, Science
File Description: electronic resource
Relation: https://doaj.org/toc/2045-2322
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14Conference
Source: 2023 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2023 IEEE International Symposium on. :1-5 May, 2023
Relation: 2023 IEEE International Symposium on Circuits and Systems (ISCAS)
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15Academic Journal
Authors: Xiaowen Su, Yanping Yuan, Zhaojun Wang, Wei Liu, Li Lan, Zhiwei Lian
Source: Energy and Built Environment, Vol 5, Iss 6, Pp 853-862 (2024)
Subject Terms: Local thermal comfort, Non-uniform thermal environment, Comfort theory, Thermal response, Evaluation indices, Environmental technology. Sanitary engineering, TD1-1066, Building construction, TH1-9745
File Description: electronic resource
Relation: http://www.sciencedirect.com/science/article/pii/S2666123323000594; https://doaj.org/toc/2666-1233
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16Academic Journal
Authors: He, Y., Sun, K., Wu, Y., Zhao, H., Wang, X., Gerada, C., Gerada, D.
Source: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 69(12):13544-13554 Dec, 2022
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17Academic Journal
Authors: Chenglong Wang, Pengxi Zhu, Xuanming Ding, Qi Wu, Gangqiang Kong
Source: Case Studies in Thermal Engineering, Vol 68, Iss , Pp 105889- (2025)
Subject Terms: Energy diaphragm wall, Thermal response, Operational strategy, Experimental study, Laboratory model test, Engineering (General). Civil engineering (General), TA1-2040
File Description: electronic resource
Relation: http://www.sciencedirect.com/science/article/pii/S2214157X25001492; https://doaj.org/toc/2214-157X
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18Conference
Authors: Luo, Huahuang, Cabot, Jose, Wang, Xiaoyi, Duan, Mingzheng, Lee, Yi-Kuen
Source: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) SSolid-State Sensors, Actuators and Microsystems (Transducers), 2021 21st International Conference on. :406-409 Jun, 2021
Relation: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)
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19Conference
Source: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :1162-1167 Jun, 2021
Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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20Academic Journal
Authors: Cai, Liqin a, b, ⁎, 1, Yang, Qian b, 1, Shao, Xiang a, Wang, Sen a, Fu, Yaming a, Mao, Xinghuai a, Hou, Linxi a, Meng, Yan c, Wei, Yongchang b, ⁎, Xu, Xiaojuan b, ⁎
Source: In International Journal of Biological Macromolecules May 2025 306 Part 1