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1Conference
Authors: Miguel, Maria Paula Medeiros Gomes, Ferreira, Mariana Marques, de Souza, Cleonilson Protasio, An, Yajun, Baiocchi, Orlando
Source: 2024 IEEE World AI IoT Congress (AIIoT) World AI IoT Congress (AIIoT), 2024 IEEE. :0225-0230 May, 2024
Relation: 2024 IEEE World AI IoT Congress (AIIoT)
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2Academic Journal
Polarization-Induced Temperature Self-Sensing and Self-Powering Behavior of Carbon–Carbon Composites
Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(13):20375-20385 Jul, 2024
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3Academic Journal
Underwater Thermal Energy Harvesting: Frameworks, Challenges, Applications, and Future Investigation
Authors: Khan, A., Villar, S.G., Lopez, L.A.D., Almaleh, A., Alqahtani, A.M., Alnaimi, R.
Source: IEEE Access Access, IEEE. 12:174371-174386 2024
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4Conference
Source: 2022 21st International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS) Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS), 2022 21st International Conference on. :256-259 Dec, 2022
Relation: 2022 21st International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS)
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5Academic Journal
Source: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 70(6):5819-5829 Jun, 2023
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6Academic Journal
Authors: Venugopal, P., Rajendran, M.K., Chowdary, G.
Source: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 57(10):3150-3163 Oct, 2022
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7Conference
Authors: Phillips, Jamie D.
Source: 2022 IEEE 49th Photovoltaics Specialists Conference (PVSC) Photovoltaics Specialists Conference (PVSC), 2022 IEEE 49th. :0009-0011 Jun, 2022
Relation: 2022 IEEE 49th Photovoltaics Specialists Conference (PVSC)
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8Conference
Authors: Mohd Fairuz, W. N., Ahmad, M. R., Arabee, S. Mohd
Source: 2021 IEEE International Conference on Sensors and Nanotechnology (SENNANO) Sensors and Nanotechnology (SENNANO), 2021 IEEE International Conference on. :105-108 Sep, 2021
Relation: 2021 IEEE International Conference on Sensors and Nanotechnology (SENNANO)
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9Academic Journal
Authors: Todorov, T.S., Fursov, A.S., Mitrev, R.P., Fomichev, V.V., Valtchev, S.S., Ilain, A.V.
Source: IEEE/ASME Transactions on Mechatronics IEEE/ASME Trans. Mechatron. Mechatronics, IEEE/ASME Transactions on. 27(1):475-484 Feb, 2022
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10Academic Journal
Authors: Soonho Kim, Rongzhen Piao, Seung Kyun Lee, Taekgeun Oh, Booki Chun, Jae-Weon Jeong, Ha-Jin Lee, Doo-Yeol Yoo
Source: Case Studies in Construction Materials, Vol 21, Iss , Pp e03861- (2024)
Subject Terms: Multi-functional cement composites, Thermoelectric property, Thermal energy harvesting, Carbon nanotube, Seebeck coefficient, Materials of engineering and construction. Mechanics of materials, TA401-492
File Description: electronic resource
Relation: http://www.sciencedirect.com/science/article/pii/S221450952401012X; https://doaj.org/toc/2214-5095
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11Conference
Authors: Demin, Gleb, Andrushin, Roman, Djuzhev, Nikolay
Source: 2020 7th All-Russian Microwave Conference (RMC) Microwave Conference (RMC), 2020 7th All-Russian. :31-35 Nov, 2020
Relation: 2020 7th All-Russian Microwave Conference (RMC)
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12Conference
Authors: Zhu, Xinhui, Jiang, Weixiang, Liu, Fangming, Zhang, Qixia, Pan, Li, Chen, Qiong, Jia, Ziyang
Source: 2020 ACM/IEEE 47th Annual International Symposium on Computer Architecture (ISCA) Computer Architecture (ISCA), 2020 ACM/IEEE 47th Annual International Symposium on. :405-418 May, 2020
Relation: 2020 ACM/IEEE 47th Annual International Symposium on Computer Architecture (ISCA)
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13Academic Journal
Authors: Lin, Ziqing a, Hong, Jiale a, Huang, Chunzhi a, Zhang, Xinyue a, Shen, Shengtao a, Du, Zehang a, Zhou, Piaopiao b, Miao, Yang-Bao c, Lin, Zong-Hong d, e, Lyu, Xiaolin a, ⁎, Zou, Zhigang a, f
Source: In Nano Energy 1 June 2025 138
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14Academic Journal
Authors: Jiang, Wangkai 1, 4, Liu, Jin-Zhuo 1, 4, Wang, Zheshan 1, Wang, Hui 1, Liu, Xiangxiang 2, Wang, Liqiang 3, Wang, Xiao-Qiao 1, Zhuo, Ming-Peng 1, Hu, Jianchen 1, ∗, Zhang, Ke-Qin 1, 5, ∗∗
Source: In Device 17 January 2025 3(1)
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15Conference
Authors: Coca, Octavian, Fodor, Alexandra
Source: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2019 IEEE 25th International Symposium for. :202-207 Oct, 2019
Relation: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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16Academic Journal
Authors: Ivo Yotov, Georgi Todorov, Elitsa Gieva, Todor Todorov
Source: Actuators, Vol 14, Iss 1, p 8 (2024)
Subject Terms: thermal energy harvesting, thermally self-excited vibrations, shape memory alloys, polyvinylidene fluoride cantilevers, Materials of engineering and construction. Mechanics of materials, TA401-492, Production of electric energy or power. Powerplants. Central stations, TK1001-1841
File Description: electronic resource
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17Conference
Authors: Lynggaard, P.
Source: 2018 11th CMI International Conference: Prospects and Challenges Towards Developing a Digital Economy within the EU CMI International Conference: Prospects and Challenges Towards Developing a Digital Economy within the EU, 2018. :67-73 Nov, 2018
Relation: 2018 11TH CMI International Conference: Prospects and Challenges Towards Developing a Digital Economy within the EU
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18Conference
Authors: Huang, Long T., Ha, Dong Sam, Cho, Hyuntae
Source: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society. :3045-3050 Oct, 2018
Relation: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society
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19Conference
Authors: Li, Jiayu, Hyun, Hoon Ji, SamHa, Dong
Source: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society. :901-906 Oct, 2018
Relation: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society
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20Conference
Authors: Hyun, Ji Hoon, Huang, Long, Ha, Dong Sam
Source: 2018 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2018 IEEE International Symposium on. :1-5 May, 2018
Relation: 2018 IEEE International Symposium on Circuits and Systems (ISCAS)