Real-Time Monitoring and Evaluation of Cutting Quality in Miniature Saw Machines Based on Convolutional Neural Networks

Authors: Lang, Kun, Yu, Haicheng, Wei, Laituo, Li, Chenming, Gao, Liyan

Source: 2024 4th International Symposium on Artificial Intelligence and Intelligent Manufacturing (AIIM) Artificial Intelligence and Intelligent Manufacturing (AIIM), 2024 4th International Symposium on. :212-216 Dec, 2024

Relation: 2024 4th International Symposium on Artificial Intelligence and Intelligent Manufacturing (AIIM)

Improving Wood Yield Recovery in Live Sawing Using Strip-bottom-left-fill Bin-packing Heuristic

Authors: Hosseini, Seyed Mohsen, Hasseni, Seif-El-Isalm, Frego, Marco, Peer, Angelika

Source: 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA) Emerging Technologies and Factory Automation (ETFA), 2023 IEEE 28th International Conference on. :1-8 Sep, 2023

Relation: 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA)

Virtual Simulation Learning Based on AR with Sawing Machine Design to Improve and Evaluate the Special Skill for Vocational Education in the COVID-19 Pandemic Era

Authors: Putra, Andika Bagus Nur Rahma, Kiong, Tee Tze, Rahmawati, Anita Dwi, Sutadji, Eddy, Ulfatin, Nurul, Subandi, Mahfud Sahly

Source: 2022 2nd International Conference on Information Technology and Education (ICIT&E) Information Technology and Education (ICIT&E), 2022 2nd International Conference on. :298-304 Jan, 2022

Relation: 2022 2nd International Conference on Information Technology and Education (ICIT&E)

Determination of Optimal Setting for the Tape-Based Partial Package Sawing of Wettable Flank QFN Package

Authors: Serapio, Rohn Kenneth L., Antilano, Ernesto T., Soreda, Alvin S., Diwata, Jerry T.

Source: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :279-283 Dec, 2021

Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

Energy Consumption Model of Diamond Disc Sawing Machine with Variable Material Removal Rate

Authors: Luan, Liqiang, Bai, Shuowei

Source: 2020 3rd World Conference on Mechanical Engineering and Intelligent Manufacturing (WCMEIM) WCMEIM Mechanical Engineering and Intelligent Manufacturing (WCMEIM), 2020 3rd World Conference on. :613-619 Dec, 2020

Relation: 2020 3rd World Conference on Mechanical Engineering and Intelligent Manufacturing (WCMEIM)

Mechanical dicing of optical quality facets and waveguides in a silicon nitride platform

Authors: Paul C Gow, Glenn M Churchill, Valerio Vitali, Thalia Dominguez Bucio, Frederic Y Gardes, Matthew P D'Souza, Periklis Petropoulos, Corin B E Gawith, James C Gates

Source: Electronics Letters, Vol 60, Iss 5, Pp n/a-n/a (2024)

Subject Terms: micromachining, optical fabrication, photonics, sawing machines, surface roughness, waveguides, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

File Description: electronic resource

Relation: https://doaj.org/toc/0013-5194; https://doaj.org/toc/1350-911X

Access URL: https://doaj.org/article/ece7d56b131d461d988726b44338c899

Influence of machine configuration on EOS damage during wafer cleaning process

Authors: Ng, K K, Yan, K P, Gaertner, Reinhold, Seidl, Stefan

Source: 2016 38th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2016 38th. :1-5 Sep, 2016

Relation: 2016 38th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)

Research on drive dynamics of hydraulic band sawing machine

Authors: Jing Ni, Zhen Meng, Bin Shao, Guojin Chen

Source: 2011 IEEE Power Engineering and Automation Conference Power Engineering and Automation Conference (PEAM), 2011 IEEE. 3:140-143 Sep, 2011

Relation: 2011 IEEE Power Engineering and Automation Conference (PEAM)

Characterizaion of Photoconductive Semiconductor Switches with Periodic-Trench Structure

Authors: Kim, Min-Seong, Ryu, Jiheon, Kim, Cheon Ho, Baek, Sung-Hyun

Source: 2018 IEEE International Conference on Plasma Science (ICOPS) Plasma Science (ICOPS), 2018 IEEE International Conference on. :1-1 Jun, 2018

Relation: 2018 IEEE International Conference on Plasma Science (ICOPS)

Impact of a new lightning detection and location system in South Africa

Authors: Evert, R., Schulze, G.

Source: 2005 IEEE Power Engineering Society Inaugural Conference and Exposition in Africa Power Engineering Society Inaugural Conference and Exposition in Africa, 2005 IEEE. :356-363 2005

Relation: 2005 IEEE Power Engineering Society Inaugural Conference and Exposition in Africa

Large-scale PV module manufacturing using ultra-thin polycrystalline silicon solar cells

Authors: Wohlgemuth, J., Narayanan, M., Clark, R., Koval, T., Roncin, S., Bennett, M., Cunningham, D., Amin, D., Creager, J.

Source: Conference Record of the Thirty-first IEEE Photovoltaic Specialists Conference, 2005. Photovoltaic Specialists Conference Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE. :1023-1026 2005

Relation: Conference Record of the Thirty-First IEEE Photovoltaic Specialists Conference

Role-based access control system for Web services

Authors: Xu Feng, Lin Guoyan, Huang Hao, Xie Li

Source: The Fourth International Conference onComputer and Information Technology, 2004. CIT '04. Computer and information technology Computer and Information Technology, 2004. CIT '04. The Fourth International Conference on. :357-362 2004

Relation: Proceedings. The Fourth International Conference on Computer and Information Technology

Young's modulus characterization for the fragile low-k film by the improved surface acoustic waves technique

Authors: Xia Xiao, Hata, N., Suying Yao, Kikkawa, T.

Source: Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. Solid-state and integrated circuits technology Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on. 1:528-531 vol.1 2004

Relation: 2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings

Miniature, high efficiency transducers for use in ultrasonic flow meters

Authors: Joshi, S.G., Zaitsev, B.D., Kuznetsova, I.E.

Source: IEEE Ultrasonics Symposium, 2004 Ultrasonics Symposium Ultrasonics Symposium, 2004 IEEE. 2:1286-1289 Vol.2 2004

Relation: 2004 IEEE Ultrasonics Symposium

Performances of short reflectors on 128/spl deg/ LiNbO/sub 3/

Authors: Lehtonen, S., Plessky, V.P., Bereux, N., Salomaa, M.M.

Source: IEEE Ultrasonics Symposium, 2004 Ultrasonics Symposium Ultrasonics Symposium, 2004 IEEE. 1:433-436 Vol.1 2004

Relation: 2004 IEEE Ultrasonics Symposium

Analysis of dispersion characteristics of shear-horizontal-type surface acoustic waves under waveguide structures

Authors: Yamada, T., Satoh, K., Nakagawa, R., Omori, T., Hashimoto, K., Yamaguchi, M.

Source: IEEE Symposium on Ultrasonics, 2003 IEEE ultrasonics symposium Ultrasonics, 2003 IEEE Symposium on. 2:1692-1695 Vol.2 2003

Relation: 2003 IEEE Ultrasonics Symposium

Laser dicing of chip scale and silicon wafer scale packages

Authors: Lizotte, T.

Source: IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International. :1-5 2003

Relation: 28th International Electronics Manufacturing Technology Symposium

Asymmetric and compressed logarithmic number systems for multimedia coprocessor (invited paper)

Authors: Arnold, M.G.

Source: The Thrity-Seventh Asilomar Conference on Signals, Systems & Computers, 2003 Signals, systems and computers Signals, Systems and Computers, 2004. Conference Record of the Thirty-Seventh Asilomar Conference on. 2:1426-1430 Vol.2 2003

Relation: Conference Record of the 37th Asilomar Conference on Signals, Systems and Computers

A metallic glass surface acoustic wave device

Authors: French, L.A.Jr., Pollard, T.B., Bernhardt, G., Call, M., Doucette, L.D., da Cunha, M.P., Lad, R.J., Vetelino, J.F.

Source: 2002 IEEE Ultrasonics Symposium, 2002. Proceedings. Ultrasonics symposium Ultrasonics Symposium, 2002. Proceedings. 2002 IEEE. 1:127-130 vol.1 2002

Relation: Proceedings of 2002 IEEE International Ultrasonics Symposium

Experimental and theoretical investigation for temperature characteristics and propagation losses of SAWs on SiO/sub 2//Al/LiTaO/sub 3/

Authors: Asai, K., Hikita, M., Isobe, A., Sakiyama, K., Tada, T.

Source: 2002 IEEE Ultrasonics Symposium, 2002. Proceedings. Ultrasonics symposium Ultrasonics Symposium, 2002. Proceedings. 2002 IEEE. 1:235-238 vol.1 2002

Relation: Proceedings of 2002 IEEE International Ultrasonics Symposium