A Study on Proton Track Reconstruction in a Pixel-Based Telescope Using a Clinical Proton Beam

Authors: Songmoolnak, A., Ritjoho, N., Sanghangthum, T., Herold, C., Boontueng, P., Phumara, P., Charoonratana, L., Simantathammakul, T., Kobdaj, C.

Source: IEEE Transactions on Nuclear Science IEEE Trans. Nucl. Sci. Nuclear Science, IEEE Transactions on. 72(3):475-482 Mar, 2025

Remaining Useful Lifetime Prediction Method of Power Modules Based on the Aging Characteristic Parameters

Authors: Xie, L., Deng, E., Gu, D., Wang, W., Liu, H., Zhang, Y., Huang, Y.

Source: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 40(1):2086-2098 Jan, 2025

Global innovation network patterns of Japanese companies based in ASEAN countries

Authors: Kondo, M.

Source: 2024 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) Industrial Engineering and Engineering Management (IEEM), 2024 IEEE International Conference on. :117-121 Dec, 2024

Relation: 2024 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)

Contrastive Point Cloud Pretraining for Enhanced Transformers

Authors: Koti, Divyashree Shivalingappa, Phillips, Joshua L., Cottle, Frederick S.

Source: 2024 IEEE 36th International Conference on Tools with Artificial Intelligence (ICTAI) ICTAI Tools with Artificial Intelligence (ICTAI), 2024 IEEE 36th International Conference on. :344-349 Oct, 2024

Relation: 2024 IEEE 36th International Conference on Tools with Artificial Intelligence (ICTAI)

3D image degradation of the free wall in human left ventricle based on X-ray phase-contrast microtomography

Authors: Du, Yongbin, Shao, Qi, Li, Zhaorui, Wang, Shunli

Source: 2024 IEEE 17th International Conference on Signal Processing (ICSP) Signal Processing (ICSP), 2024 IEEE 17th International Conference on. :626-630 Oct, 2024

Relation: 2024 IEEE 17th International Conference on Signal Processing (ICSP)

Research on Remaining Lifetime Evaluation for Traction System IGBT Devices of Electric Locomotives With Different Service Mileage

Authors: Lai, W., Shangguan, M., Shi, J., Li, H., Wu, Y., Yao, R., Wang, H., Jing, H., Li, Y.

Source: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 40(4):6020-6032 Apr, 2025

Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test

Authors: Liu, S., Vuorinen, V., Liu, X., Fredrikson, O., Brand, S., Tiwary, N., Lutz, J., Paulasto-Krockel, M.

Source: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 39(12):16695-16707 Dec, 2024

Improvement Heat Dissipation of Flip Chip Double-Sided Cooling IGBT Module Using AlSiC-Interposer Technology

Authors: Sun, G., Peng, C., Wen, J., Liu, H., Zhu, W., Wang, L.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(11):1968-1977 Nov, 2024

Aerial Target classification using micro-Doppler spectrum based on PCT and ResNet34

Authors: Zheng, Muhai, Li, Shuai, Huang, Pengjun, Li, Wentao, Tian, Biao, Xu, Shiyou

Source: 2024 9th International Conference on Signal and Image Processing (ICSIP) Signal and Image Processing (ICSIP), 2024 9th International Conference on. :575-579 Jul, 2024

Relation: 2024 9th International Conference on Signal and Image Processing (ICSIP)

Building a Kinetic Induced Voxel-Clustering Filter (KVCF) for Low-Dose Perfusion CT Imaging

Authors: Chen, Z., Jin, Y., Huang, Z., Zhang, N., Liang, K., Quan, G., Liang, D., Zheng, H., Hu, Z.

Source: IEEE Transactions on Radiation and Plasma Medical Sciences IEEE Trans. Radiat. Plasma Med. Sci. Radiation and Plasma Medical Sciences, IEEE Transactions on. 8(7):762-773 Sep, 2024

Local Interconnection Degradation of a Double-Sided Cooling SiC MOSFET Module Under Power Cycling

Authors: Chen, Y., Mei, Y., Ning, P., Lu, G.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(5):832-840 May, 2024

Low-Temperature Direct Bonding of Sputtered Nanocrystalline Ag Film for Power Electronic Packaging: Bonding Mechanism, Thermal Characteristics, and Reliability

Authors: Lu, D., Wang, X., Pan, H., Zheng, X., Li, M., Ji, H.

Source: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 39(5):6040-6051 May, 2024

Coarse-to-Fine Learning for Planning CT-Enhanced Limited-Angle CBCT Reconstruction

Authors: Zang, S., Zhang, Y., Hu, D., Mao, W., Fei, X., Ji, X., Yao, Y., Yang, C., Coatrieux, G., Chen, Y.

Source: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 73:1-15 2024

Predictive value of serum procalcitonin level for the diagnosis of bloodstream infections in hematological patients

Authors: Qi Sun, Qingsong Lin, Yanxia Lv, Zhiying Tian, Qiushuang Yan, Yaqing Yu, Xue Fu, Hongjing Yao, Fujun Sun, Yonghui Xia, Guoqing Zhu, Sizhou Feng

Source: BMC Infectious Diseases, Vol 25, Iss 1, Pp 1-10 (2025)

Subject Terms: Procalcitonin (PCT), Bloodstream infection (BSI), Hematology patients, Cut-off level, Infectious and parasitic diseases, RC109-216

File Description: electronic resource

Relation: https://doaj.org/toc/1471-2334

Access URL: https://doaj.org/article/b52d6055d268487292f24743faa0a501

Design and Analysis of Nuclear Transportation Cask Using Phase Changing Material

Authors: Girish Venkatesh Gudi, R. G. Nagraj, Abhijit Dandavate

Source: Tehnički Glasnik, Vol 19, Iss 1, Pp 110-118 (2025)

Subject Terms: ANSYS, Peak Cladding Temperature (PCT), Phase Changing Material (PCM), transportation cask, Technology

File Description: electronic resource

Relation: https://hrcak.srce.hr/file/473487; https://doaj.org/toc/1846-6168; https://doaj.org/toc/1848-5588

Access URL: https://doaj.org/article/1165bff0dbc84338ab75ed72f1c653b3

Clinical significance of PCT, CRP, IL-6, NLR, and TyG Index in early diagnosis and severity assessment of acute pancreatitis: A retrospective analysis

Authors: Xu Xinyu, Zhou Jiang, Ai Qing, Li Lihua, Liu Xiehong, Zhou Lin

Source: Scientific Reports, Vol 15, Iss 1, Pp 1-10 (2025)

Subject Terms: Acute Pancreatitis (AP), C-Reactive protein (CRP), Procalcitonin (PCT), Interleukin-6 (IL-6), Neutrophil-to-lymphocyte ratio (NLR), Triglyceride-glucose index (TyG Index), Medicine, Science

File Description: electronic resource

Relation: https://doaj.org/toc/2045-2322

Access URL: https://doaj.org/article/ec464d3915c94a11b66192a2b6f40cdd

Thermo-Hygroscopic-Mechanical Coupling Simulation Method for Power Electronics Under Power Cycling Test

Authors: Wang, Y., Deng, E., Wu, T., Zhang, Y., Xie, L., Huang, Y.

Source: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 38(9):11521-11530 Sep, 2023

Advanced Power Cycling Test Integrated With Voltage, Current, Temperature, and Humidity Stress

Authors: Wang, Y., Deng, E., Wu, L., Cao, H., Yan, Y., Zeng, P., Zhang, Y., Zhao, Y., Huang, Y.

Source: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 38(6):7685-7696 Jun, 2023

Research on PCT Reliability of Power Devices based on FOPLP

Authors: Jiang, Jing, Ren, Ya Fei, Gao, Chen Shan, Zhang, Guoqi, Ye, Huaiyu, Fan, Jiajie, Song, Guan Qiang

Source: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

Design and Analysis of PVT Invariant Current Reference in 65-nm CMOS

Authors: Maurya, Nishant, Wary, Nijwm

Source: 2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2022 IEEE 65th International Midwest Symposium on. :1-4 Aug, 2022

Relation: 2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS)