-
1Conference
Authors: Ferhi, Mokhtar, Khemiri, Karim, Najari, Montassar, Djebali, Ridha
Source: 2025 15th International Renewable Energy Congress (IREC) Renewable Energy Congress (IREC), 2025 15th International. :1-6 Feb, 2025
Relation: 2025 15th International Renewable Energy Congress (IREC)
-
2Conference
Authors: Ferhi, Mokhtar, Khemiri, Karim, Najari, Montassar, Djebali, Ridha
Source: 2025 15th International Renewable Energy Congress (IREC) Renewable Energy Congress (IREC), 2025 15th International. :1-6 Feb, 2025
Relation: 2025 15th International Renewable Energy Congress (IREC)
-
3Conference
Authors: Sami, Missaoui, Eya, Missaoui, Zied, Driss
Source: 2025 15th International Renewable Energy Congress (IREC) Renewable Energy Congress (IREC), 2025 15th International. :1-6 Feb, 2025
Relation: 2025 15th International Renewable Energy Congress (IREC)
-
4Conference
Authors: Chen, Miaopeng, Si, Yang, Ma, Linrui, Zhu, Chuang, Li, Pin
Source: 2024 7th International Conference on Power and Energy Applications (ICPEA) Power and Energy Applications (ICPEA), 2024 7th International Conference on. :576-581 Oct, 2024
Relation: 2024 7th International Conference on Power and Energy Applications (ICPEA)
-
5Conference
Authors: Zhang, Shiwei, Zhao, Yincai, Bai, Jingjing, Qiu, Huarong, Li, Yiming, Yang, Zixin, Yan, Caiman
Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024
Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)
-
6Conference
Authors: Zhang, Zihui, Tian, Maocheng
Source: 2024 3rd International Conference on Energy and Electrical Power Systems (ICEEPS) Energy and Electrical Power Systems (ICEEPS), 2024 3rd International Conference on. :511-516 Jul, 2024
Relation: 2024 3rd International Conference on Energy and Electrical Power Systems (ICEEPS)
-
7Conference
Authors: Patel, Akshat, Sahu, Gopinath, Wei, Tiwei
Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-9 May, 2024
Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
-
8Conference
Authors: Pettit, Logan, Gerdes, Josh, Reicks, Andrew, Zuhlke, Craig, Gogos, George
Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-8 May, 2024
Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
-
9Conference
Authors: Ahmed, Faisal, Azarifar, Mohammad, Ikhlaq, Muhammad, Arik, Mehmet
Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-6 May, 2024
Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
-
10Conference
Authors: Ceperley, Alexander, Sahu, Gopinath, Reicks, Andrew, Zuhlke, Craig, Gogos, George, Weibel, Justin A.
Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-7 May, 2024
Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
-
11Conference
Flow Boiling Heat Transfer Improvement of PF-5060 Using Femtosecond Laser Surface Processed Aluminum
Authors: Gerdes, Josh, Pettit, Logan, Reicks, Andrew, Zuhlke, Craig, Gogos, George
Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-7 May, 2024
Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
-
12Academic Journal
Authors: Wiggins, C.S., Crawford, C., Gehrig, M.L., Kessel, C., Joslin, C.
Source: IEEE Transactions on Plasma Science IEEE Trans. Plasma Sci. Plasma Science, IEEE Transactions on. 52(9):3644-3650 Sep, 2024
-
13Conference
Authors: Yao, Zesheng, Chen, Yanhu, Yang, Canjun, Xia, Qingchao
Source: 2024 8th International Conference on Green Energy and Applications (ICGEA) Green Energy and Applications (ICGEA), 2024 8th International Conference on. :174-179 Mar, 2024
Relation: 2024 8th International Conference on Green Energy and Applications (ICGEA)
-
14Conference
Authors: Ferhi, Mokhtar, Khilifi, Dorra, Djebali, Ridha
Source: 2023 14th International Renewable Energy Congress (IREC) Renewable Energy Congress (IREC), 2023 14th International. :1-5 Dec, 2023
Relation: 2023 14th International Renewable Energy Congress (IREC)
-
15Conference
Authors: Ferhi, Mokhtar, Khilifi, Dorra, Djebali, Ridha
Source: 2023 14th International Renewable Energy Congress (IREC) Renewable Energy Congress (IREC), 2023 14th International. :1-6 Dec, 2023
Relation: 2023 14th International Renewable Energy Congress (IREC)
-
16Conference
Authors: Kale, Suryaji S, Gawade, Sanjaykumar S, Bhosale, Govind
Source: 2023 IEEE Engineering Informatics Engineering Informatics, 2023 IEEE. :1-5 Nov, 2023
Relation: 2023 IEEE Engineering Informatics
-
17Conference
Authors: Pettit, Logan, Costa-Greger, Justin, Reicks, Andrew, Sarin, Suchit, Shield, Jeffrey, Zuhlke, Craig, Gogos, George
Source: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-10 May, 2023
Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
-
18Conference
Authors: Costa-Greger, Justin, Pettit, Logan, Reicks, Andrew, Sarin, Suchit, Pettit, Chase, Shield, Jeffrey, Zuhlke, Craig, Gogos, George
Source: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-9 May, 2023
Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
-
19Academic Journal
Authors: Si Wenrong, Fu Chenzhao, Wu Xinye, Deng Xianqin, Yuan Peng, Huang Zexuan, Yang Jian
Source: Open Physics, Vol 23, Iss 1, Pp 392-7 (2025)
Subject Terms: panel-type radiator, metal foam, heat transfer enhancement, numerical simulation, Physics, QC1-999
File Description: electronic resource
Relation: https://doaj.org/toc/2391-5471
-
20Academic Journal
Authors: Kochkin D.Yu., Arkhipov V.E., Korepanova E.M., Zaitsev D.V.
Source: Problems of the Regional Energetics, Vol 65, Iss 1, Pp 64-71 (2025)
Subject Terms: heat transfer enhancement, boiling, minichannel, graphene, two-phase flow., Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Production of electric energy or power. Powerplants. Central stations, TK1001-1841, Renewable energy sources, TJ807-830
File Description: electronic resource