Partial Discharge in Silicone Gel on Power Module Substrates in High-Humidity Conditions

Authors: Sherriff, M., Griffo, A., Jia, C., Ng, C., Zhu, Z., Stone, D.A.

Source: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 32(1):484-493 Feb, 2025

Gamma Irradiation in HfOₓ-Based Resistive Switching Memory With Mitigated Performance Degradation Using Ruthenium Electrode

Authors: Chen, Y., Lin, C., Hou, T., Chung, C., Chang, Y.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(12):7442-7446 Dec, 2024

Microacoustic Shear Horizontal Lithium Niobate Leaky SAWs for Harsh Environment Sensing

Authors: Gubinelli, Walter, Colombo, Luca, Tetro, Ryan, Sui, Wen, Maietta, Nicol, Sautriot, Yvonne, Simeoni, Pietro, Feng, Philip X.-L., Rinaldi, Matteo

Source: 2024 IEEE SENSORS SENSORS, 2024 IEEE. :1-4 Oct, 2024

Relation: 2024 IEEE SENSORS

A methodology for resilience assessment of offshore drilling systems in harsh environments

Authors: Li, Jinsong, Liu, Wei, Lei, Lei, Zuo, Honggang, Zheng, Ming, Ma, Yingwen, Yin, Zhiming, Zhang, Xingquan, Tian, Deqiang, Hu, Mengqian

Source: 2024 6th International Conference on System Reliability and Safety Engineering (SRSE) System Reliability and Safety Engineering (SRSE), 2024 6th International Conference on. :453-458 Oct, 2024

Relation: 2024 6th International Conference on System Reliability and Safety Engineering (SRSE)

High Temperature In-Order RISC-V Processor with Heterogeneous Pipeline and Out-of-Order Write-Back Mechanism

Authors: Hawich, Malte, Szucs, Jan, Blume, Holger

Source: 2024 Kleinheubach Conference Kleinheubach Conference, 2024. :1-4 Sep, 2024

Relation: 2024 Kleinheubach Conference

A Fiber-optic Technique for the Wall Thickness Measurement of the Industrial Tubes under Harsh Environment

Authors: Djinovic, Z., Gavrilovic-Wohlmuther, A., Tomic, M.

Source: 2024 47th MIPRO ICT and Electronics Convention (MIPRO) MIPRO ICT and Electronics Convention (MIPRO), 2024 47th. :1754-1759 May, 2024

Relation: 2024 47th MIPRO ICT and Electronics Convention (MIPRO)

Analysis of Electronic Modules for Construction Machines and Development of a Reliability Test Method

Authors: Hausler, Max, Meier, Karsten, Bock, Karlheinz

Source: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-5 May, 2024

Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)

500 °C Microtesla Sensitive Magnetic Field Sensing Using a 4H-SiC PIN Diode

Authors: Okeil, H., Wachutka, G.

Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(19):29884-29889 Oct, 2024

Advances in Fiber Bragg Grating (FBG) Sensing: A Review of Conventional and New Approaches and Novel Sensing Materials in Harsh and Emerging Industrial Sensing

Authors: Kok, S.P., Go, Y.I., Wang, X., Wong, M.L.D.

Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(19):29485-29505 Oct, 2024

Dynamic Demodulation Technique for Tandem Dual-Cavity EFPI Sensors Enabling Simultaneous Temperature Measurement in Harsh Environment

Authors: Qi, X., Binghe, M., Zhiyong, T., Ruofei, L., Zhibo, M.

Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(18):28844-28851 Sep, 2024

Switch-SLAM: Switching-Based LiDAR-Inertial-Visual SLAM for Degenerate Environments

Authors: Lee, J., Komatsu, R., Shinozaki, M., Kitajima, T., Asama, H., An, Q., Yamashita, A.

Source: IEEE Robotics and Automation Letters IEEE Robot. Autom. Lett. Robotics and Automation Letters, IEEE. 9(8):7270-7277 Aug, 2024

Towards Harsh Environment Silicon Carbide Based On-Chip Antenna

Authors: Dasari, Sree Adinarayana, Lee, Seung Yoon, Ghalichechian, Nima

Source: 2025 United States National Committee of URSI National Radio Science Meeting (USNC-URSI NRSM) URSI National Radio Science Meeting (USNC-URSI NRSM), 2025 United States National Committee of. :18-19 Jan, 2025

Relation: 2025 United States National Committee of URSI National Radio Science Meeting (USNC-URSI NRSM)

Improving Clock Frequencies in ASIC Designs through Semi-Automatic Register Placement and Advanced Retiming

Authors: Hawich, Malte, Klein, Simon C., Stuckenberg, Tobias, Blume, Holger

Source: 2024 Panhellenic Conference on Electronics & Telecommunications (PACET) Electronics & Telecommunications (PACET), 2024 Panhellenic Conference on. :1-6 Mar, 2024

Relation: 2024 Panhellenic Conference on Electronics & Telecommunications (PACET)

Enhancing RISC-V Processor Performance in Harsh Environments through Data Cache Optimization

Authors: Fruhauf, Jan-Luca, Hawich, Malte, Blume, Holger

Source: 2024 Panhellenic Conference on Electronics & Telecommunications (PACET) Electronics & Telecommunications (PACET), 2024 Panhellenic Conference on. :1-4 Mar, 2024

Relation: 2024 Panhellenic Conference on Electronics & Telecommunications (PACET)

Optimizing RISC-V Processor Performance with Adaptive Execution Unit Lengths in Harsh Environment Condition

Authors: Szucs, Jan, Hawich, Malte, Blume, Holger

Source: 2024 Panhellenic Conference on Electronics & Telecommunications (PACET) Electronics & Telecommunications (PACET), 2024 Panhellenic Conference on. :1-5 Mar, 2024

Relation: 2024 Panhellenic Conference on Electronics & Telecommunications (PACET)

A 3.38-ppm/°C Voltage Reference for Harsh Environment Applications Empowered by the In-Loop Resistance Trimming Technique

Authors: Fan, H., Fang, Z., Li, Y., Qian, Q., Kang, X., Chen, M., Sun, W.

Source: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 71(6):2911-2915 Jun, 2024

Gallium Nitride (GaN) MEMS Lamb Wave Resonators Operating At High Temperature Up To 800°C

Authors: Sui, Wen, Sheplak, Mark, Feng, Philip X.-L.

Source: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :638-641 Jan, 2024

Relation: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)

AC-Powered MEMS Logic for Harsh Environments

Authors: Halvorsen, Einar, Mitcheson, Paul D.

Source: 2023 IEEE 22nd International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS) Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS), 2023 IEEE 22nd International Conference on. :288-291 Dec, 2023

Relation: 2023 IEEE 22nd International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS)

GaN-Based Threshold Switching Behaviors at High Temperatures Enabled by Interface Engineering for Harsh Environment Memory Applications

Authors: Fu, K., Luo, S., Fu, H., Hatch, K., Alugubelli, S.R., Liu, H., Li, T., Xu, M., Mei, Z., He, Z., Zhou, J., Chang, C., Ponce, F.A., Nemanich, R., Zhao, Y.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(3):1641-1645 Mar, 2024

Design and Characterization of a Data Converter in a SiC CMOS Technology for Harsh Environment Sensing Applications

Authors: Niu, Yunfan, Mo, Jiarui, May, Alexander, Rommel, Mathias, Rossi, Chiara, Romijn, Joost, Zhang, Guoqi, Vollebregt, Sten

Source: 2023 IEEE SENSORS SENSORS, 2023 IEEE. :1-4 Oct, 2023

Relation: 2023 IEEE SENSORS