Development of a 10–50-W Plasma Jet at 10 GHz

Authors: Ziegler, H., Heuermann, H., Schopp, C.

Source: IEEE Transactions on Plasma Science IEEE Trans. Plasma Sci. Plasma Science, IEEE Transactions on. 53(4):627-632 Apr, 2025

On Forward and Inverse Energy-Based Magnetic Vector Hysteresis Operators

Authors: Egger, H., Engertsberger, F., Domenig, L., Roppert, K., Kaltenbacher, M.

Source: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 61(4):1-7 Apr, 2025

Electromagnetic-Thermal Analysis of an HTS Linear Motor for High-Dynamic Applications

Authors: Desikan, A., de Bruyn, B.J.H., Krop, D.C.J., Lomonova, E.A.

Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 35(5):1-9 Aug, 2025

Simulation of Pulsed-Magnetization of HTS Jointless Loops With J-A Formulation With Circuit Coupling and Thermal Modeling

Authors: Santos, B.M.O., Santos, N.G.d., Santos, G.d., Andrade, R.d.

Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 35(5):1-4 Aug, 2025

Multi-Physics Characteristic Simulations of a Current-Limiting CORC Conductor for a 35 kV/1.5 kA Superconducting Fault Current Limiter (SFCL)

Authors: Zhu, J., Huang, P., Chen, P., Zhang, H., Yang, Y., Sheng, J.

Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 35(5):1-5 Aug, 2025

3D Modeling and Simulation of HTS Stacked Tapes Magnetic Lens Within Small HTS Coil

Authors: Wang, R., Hu, C., Wang, L., Geng, J.

Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 35(5):1-5 Aug, 2025

FEM Analysis of Hybrid LTS/HTS Cos-Theta Dipole Magnet With Heterogeneous Cable Model

Authors: D'Agliano, A., Zlobin, A.V., Novitski, I., Turrioni, D., Barzi, E., Donati, S., Giusti, V.

Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 35(5):1-5 Aug, 2025

Evaluation of the primary stability of two types of dental implants through computational modeling of insertion process and pull-out test

Authors: Shanzari, Armin, Akhlaghi, Pedram, Rouhi, Gholamreza

Source: 2024 31st National and 9th International Iranian Conference on Biomedical Engineering (ICBME) Biomedical Engineering (ICBME), 2024 31st National and 9th International Iranian Conference on. :225-229 Nov, 2024

Relation: 2024 31st National and 9th International Iranian Conference on Biomedical Engineering (ICBME)

Fingerless Soft Gripper Capable of Omnidirectional Deformations: Proof-Of-Concept

Authors: Kim, Haneul, Shin, Hayeon, Li, Chenchen, Peng, Yulian, Wang, Hongbo, Joe, Seonggun

Source: 2024 13th International Conference on Control, Automation and Information Sciences (ICCAIS) Control, Automation and Information Sciences (ICCAIS), 2024 13th International Conference on. :1-6 Nov, 2024

Relation: 2024 13th International Conference on Control, Automation and Information Sciences (ICCAIS)

Axial Laminations for Eddy Current Mitigation in Unlaminated Rotors for Axial Flux Surface Permanent Magnet Synchronous Machines

Authors: French, Samuel, Wong, Kelvin, Klink, David, Patterson, Dean, Heins, Greg, Bahrani, Behrooz

Source: 2024 IEEE Energy Conversion Congress and Exposition (ECCE) Energy Conversion Congress and Exposition (ECCE), 2024 IEEE. :4975-4979 Oct, 2024

Relation: 2024 IEEE Energy Conversion Congress and Exposition (ECCE)

SPMMs and Enclosures Steady Heat Transfer Modeling Utilizing a 3-D Finite Element Partitioning Technique

Authors: Kefalas, Themistoklis D., Kladas, Antonios G.

Source: 2024 International Conference on Electrical Machines (ICEM) Electrical Machines (ICEM), 2024 International Conference on. :1-6 Sep, 2024

Relation: 2024 International Conference on Electrical Machines (ICEM)

A Flexible Framework Based on Finite-Element Method for Capacitance Extraction of 3-Dimensional Interconnects

Authors: Zheng, Qiwen, Wu, Ye, Zhang, Zichang

Source: 2024 IEEE International Conference on Semiconductor Electronics (ICSE) Semiconductor Electronics (ICSE), 2024 IEEE International Conference on. :144-147 Aug, 2024

Relation: 2024 IEEE International Conference on Semiconductor Electronics (ICSE)

Modeling and Numerical Simulation of Argon Based DBD Plasma Jets: Mathematical Approaches and Local Energy Approximation

Authors: Ouali, Moustapha, Lagmich, Youssef

Source: 2024 International Conference on Computing, Internet of Things and Microwave Systems (ICCIMS) Computing, Internet of Things and Microwave Systems (ICCIMS), 2024 International Conference on. :1-5 Jul, 2024

Relation: 2024 International Conference on Computing, Internet of Things and Microwave Systems (ICCIMS)

Field-Based Discretization of the 3-D Contrast Source Inversion Method Applied to Brain Stroke Microwave Imaging

Authors: Mariano, V., Vasquez, J.A.T., Rodriguez-Duarte, D.O., Vipiana, F.

Source: IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology IEEE J. Electromagn. RF Microw. Med. Biol. Electromagnetics, RF and Microwaves in Medicine and Biology, IEEE Journal of. 8(3):290-297 Sep, 2024

A Mixed Precision Direct Electromagnetic Finite Element Solver on GPUs

Authors: Wang, Junjie, Li, Zhi-Ming, Zuo, Sheng, Jiang, Shugang, Dang, Xiaojie

Source: 2024 International Applied Computational Electromagnetics Society Symposium (ACES-China) Applied Computational Electromagnetics Society Symposium (ACES-China), 2024 International. :1-3 Aug, 2024

Relation: 2024 International Applied Computational Electromagnetics Society Symposium (ACES-China)

A Novel Causal Method to Blend the DC and AC Solution over the Entire Frequency Band

Authors: Liu, Peng, Thiel, Werner, Xin, X., Zhu, Kevin, Bracken, Eric

Source: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024 Microwave Symposium - IMS 2024, 2024 IEEE/MTT-S International. :470-472 Jun, 2024

Relation: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

Mitigating Cracking from RDL Stress in Glass Substrates with Low-CTE Electrodeposited Copper-Graphene Composites

Authors: Molina-Mangual, Christian, Surillo, Emanuel Torres, Nedumthakady, Nithin, Smet, Vanessa

Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1552-1557 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Analysis of non-contact measurement methods for sag of overhead transmission lines

Authors: Fan, Haoyang, Huang, Qi, Zhang, Zhenyuan, Liao, Kaiji, Tang, Xiaotian, Khawaja, Arsalan Habib

Source: 2024 IEEE/IAS 60th Industrial and Commercial Power Systems Technical Conference (I&CPS) Industrial and Commercial Power Systems Technical Conference (I&CPS), 2024 IEEE/IAS 60th. :1-6 May, 2024

Relation: 2024 IEEE/IAS 60th Industrial and Commercial Power Systems Technical Conference (I&CPS)

Study of an Improved Flux Reversal Permanent Magnet Outer-Rotor Motor

Authors: Sarshar, Mohammad Reza, Jalali Kondelaji, Mohammad Amin, Mirsalim, Mojtaba

Source: 2024 32nd International Conference on Electrical Engineering (ICEE) Electrical Engineering (ICEE), 2024 32nd International Conference on. :1-4 May, 2024

Relation: 2024 32nd International Conference on Electrical Engineering (ICEE)

Neural Network Assisted 3D FBAR Modeling With Random Electrode Shapes

Authors: He, Xi, Marvin Tan, Xing Haw, Chen, Ma, Huang, Feixuan, Yang, Fengyuan, Ren, Qinghua, Ma, Yiming, Chen, Jianlin, Wang, Nan

Source: 2024 IEEE MTT-S International Conference on Microwave Acoustics & Mechanics (IC-MAM) Microwave Acoustics & Mechanics (IC-MAM), 2024 IEEE MTT-S International Conference on. :13-16 May, 2024

Relation: 2024 IEEE MTT-S International Conference on Microwave Acoustics & Mechanics (IC-MAM)