A Novel Insight Into the Mechanism of Bipolar Degradation in 4H-SiC MOSFET

Authors: Long, Y., Chen, Y., Wang, P., Hou, B., He, H.

Source: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 46(3):464-467 Mar, 2025

Failure Mechanism of 1200-V SiC MOSFET With Embedded Schottky Barrier Diode Under Short-Circuit Condition

Authors: Li, X., Deng, X., Liao, Z., Jia, R., Zhang, B.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 72(3):1259-1263 Mar, 2025

Failure Mechanism Investigations of Bond Wires Lifting-Off and Die-Attach Solder Aging Considering the Thermal Coupling Effects

Authors: Ge, X., Chen, K., Wang, H., Xu, Z., Fu, Z.

Source: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 40(1):2042-2056 Jan, 2025

A Review of Reliability Verification Technology for Aviation Intelligent Systems

Authors: Li, Jiao, Peng, Wensheng, Zeng, Zhaoyang, Xu, Ming

Source: 2024 11th International Conference on Dependable Systems and Their Applications (DSA) DSA Dependable Systems and Their Applications (DSA), 2024 11th International Conference on. :172-181 Nov, 2024

Relation: 2024 11th International Conference on Dependable Systems and Their Applications (DSA)

Sneak Circuit Analysis Covering Interface Circuits in Spacecraft Integrated Chips while Considering Faults

Authors: Liu, Weiming, Chen, Cen, Xiao, Kaiwen, Feng, Mingtao, Zhang, Haonan, Zhai, Guofu

Source: 2024 6th International Conference on System Reliability and Safety Engineering (SRSE) System Reliability and Safety Engineering (SRSE), 2024 6th International Conference on. :222-228 Oct, 2024

Relation: 2024 6th International Conference on System Reliability and Safety Engineering (SRSE)

Analysis Of Power MOSFETs Failure Mechanisms Based On TCAD Model

Authors: Du, Jiangyuan, Chen, Cen, Wang, Zicheng, Zhai, Guofu

Source: 2024 6th International Conference on System Reliability and Safety Engineering (SRSE) System Reliability and Safety Engineering (SRSE), 2024 6th International Conference on. :205-211 Oct, 2024

Relation: 2024 6th International Conference on System Reliability and Safety Engineering (SRSE)

Wear and Corrosion of Electrical Connectors Caused by Mechanical Operations in High Temperature Environment

Authors: Han, Yicheng, Meng, Yuan, Zhang, Chao, Ren, Wanbin

Source: 2024 IEEE 69th Holm Conference on Electrical Contacts (HOLM) Electrical Contacts (HOLM), 2024 IEEE 69th Holm Conference on. :1-7 Oct, 2024

Relation: 2024 IEEE 69th Holm Conference on Electrical Contacts (HOLM)

The UIS Withstand Capability and Device Failure Mechanism of 650 V p-GaN Gate HEMTs

Authors: Huang, Qihang, Ma, Luanxi, Nie, Yanyu, Huang, Shuting, Zhu, Jianggen, Shi, Yu, Du, Rongxin, Zhou, David, Wan, Yuxi, Zhang, Bo, Zhou, Qi

Source: 2024 IEEE 17th International Conference on Solid-State & Integrated Circuit Technology (ICSICT) Solid-State & Integrated Circuit Technology (ICSICT), 2024 IEEE 17th International Conference on. :1-3 Oct, 2024

Relation: 2024 IEEE 17th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)

An In-Depth Investigation Into Short-Circuit Failure Mechanisms of State-of-the-Art 1200 V Double Trench SiC MOSFETs

Authors: Li, X., Wu, Y., Qi, Z., Fu, Z., Chen, Y., Zhang, W., Zhang, Q., Zhao, H., Deng, X., Zhang, B.

Source: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 39(12):15576-15583 Dec, 2024

Failure Mechanism Analysis of 1.2 kV SiC MOSFETs Under Low-Temperature Storage, Power Cycling, and Short-Circuit Interactions

Authors: Wang, P., Chen, Y., Zhu, X., He, H., Li, J.

Source: IEEE Journal of Emerging and Selected Topics in Power Electronics IEEE J. Emerg. Sel. Topics Power Electron. Emerging and Selected Topics in Power Electronics, IEEE Journal of. 12(5):4562-4572 Oct, 2024

Failure of Cable Accessory: Interface Breakdown Under the Effect of Moisture

Authors: Li, Z., Zhou, K., Wang, C., Meng, P., Li, Y., Lin, S., Fu, Y., Yuan, H.

Source: IEEE Transactions on Power Delivery IEEE Trans. Power Delivery Power Delivery, IEEE Transactions on. 39(5):2644-2652 Oct, 2024

Experimental Investigation on the Turn-Off Failure Mechanism of IGCT

Authors: Liu, J., Pan, J., Wu, J., Meng, L., Liu, F., Zhu, Y., Xu, X., Chen, Z., Li, Z., Zeng, R.

Source: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 39(10):13062-13070 Oct, 2024

Failure Characteristics and Mechanisms of Sn-Based Solder Interconnections Under Vibrational Conditions

Authors: Jiang, Xuening, Zhang, Chenghao, Pan, Zhen, Wang, Jun, Liu, Yang

Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :01-04 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

The Study on Reliability and Failure Mechanism of Micro-coil Spring Board-Level Arrays

Authors: An, Qi, Zhang, Minghua, Fei, Jingming

Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

Effect mechanism analysis of low-temperature on short-circuit robustness of SiC MOSFETs

Authors: Wang, Pengkai, Chen, Yuan, Zhu, Xinyu, He, Hu, Li, Junhui

Source: 2024 IEEE 19th Conference on Industrial Electronics and Applications (ICIEA) Industrial Electronics and Applications (ICIEA), 2024 IEEE 19th Conference on. :1-4 Aug, 2024

Relation: 2024 IEEE 19th Conference on Industrial Electronics and Applications (ICIEA)

Failure Analysis on Superluminescent Diode

Authors: Hu, Xuanyu, Liu, Xubo, Wang, Kai, Li, Pinhuan, Ding, Qichao, Mai, Zhihong

Source: 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) the Physical and Failure Analysis of Integrated Circuits (IPFA), 2024 IEEE International Symposium on. :1-5 Jul, 2024

Relation: 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Analysis of Different Impact of LDD Missing and Silicide Missing Defects on MOSFET Characteristic

Authors: Zheng, Shijun, Bian, Haijiao

Source: 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) the Physical and Failure Analysis of Integrated Circuits (IPFA), 2024 IEEE International Symposium on. :01-05 Jul, 2024

Relation: 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Insights into Overcurrent-Induced Gate Breakdown and Failure Analysis of 1200 V SiC MOSFETs

Authors: Wang, Ruolan, Fang, Mingsheng, Song, Li, Hu, Xuanyu, Yang, Anli, Wang, Yupu, Li, Kaixuan, Liu, Ting, Meng, Cao, Wang, Dandan, Yang, Bing, Ding, Qichao, Mai, Zhihong

Source: 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) the Physical and Failure Analysis of Integrated Circuits (IPFA), 2024 IEEE International Symposium on. :1-5 Jul, 2024

Relation: 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Shear Strength Analysis of Aging SAC-Bi Solder Joints with Different Solder Paste Volumes

Authors: Pouya, Shaheen, Alahmer, Ali, Bolanos, Sergio, Tahat, Sufyan, Alalkayleh, Abdallah, El Amine Belhadi, Mohamed, Hamasha, Sa'd

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-7 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

BGA electromigration behavior and why it has become the bottleneck

Authors: Labie, Riet, Nawghane, Chinmay, Tsiakos, Dimitrios, Mertens, Jan, Tremble, Eric, Graf, Richard, Sauter, Wolfgang

Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :678-684 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)