PCM-impregnated heat sinks for transient thermal management of GaN electronic chips

Authors: Ahmadi, Behzad, Bigham, Sajjad

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-6 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

A novel framework to design phase change material composite for cooling of electronic devices

Authors: Singh, Ayushman, Rangarajan, Srikanth, Sammakia, Bahgat G.

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-8 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Hexagonal Boron Nitride Nanosheets Filler Infiltrated Polymer Composite Films for Thermal Management Applications

Authors: Ravichandran, Vanmathi, Varrla, Eswaraiah

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-6 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Experimental Study of HFE-7000 Flow Boiling Heat Transfer and Pressure Drop in a Mini Channel Heat Sink for High-Power Defense Applications

Authors: Mohammadilooey, Mandana, Benam, Behnam Parizad, Yagci, Vedat, Malyemez, Muhammed Caglar, Parlak, Murat, Sadaghiani, Abdolali K, Kosar, Ali

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-6 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Numerical and Analytical Investigation on the Influence of Geometry on Thermohydraulic Performance of Single-phase Split Flow Cold Plates for Data Center Liquid Cooling

Authors: Kisitu, Deogratius, Ortega, Alfonso

Source: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-10 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Novel Thermal Packaging Approach for an Airtight Electronic Chassis without Card Retainer-I

Authors: Parlak, Murat, Sen, Ahmet Sahin, Yagci, Vedat

Source: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-7 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

High Heat-Flux Removal From Topside-Cooled GaN Power Devices by Water-Jet Impingement Using 3-D-Printed Nozzles

Authors: Ramaraju, R.V., Zaman, M.S., Passandideh-Fard, M., Trescases, O., Chandra, S.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(8):1164-1173 Aug, 2023

Thermo-hydraulic performance of electronic chip cooling through micro-channel heat sink with ribs and cavities on side wall

Authors: Singh, Vasujeet, Nemalipuri, Pruthiviraj, Vitankar, Vivek, Das, Harish Chandra

Source: 2023 Third International Conference on Advances in Electrical, Computing, Communication and Sustainable Technologies (ICAECT) Advances in Electrical, Computing, Communication and Sustainable Technologies (ICAECT), 2023 Third International Conference on. :1-8 Jan, 2023

Relation: 2023 Third International Conference on Advances in Electrical, Computing, Communication and Sustainable Technologies (ICAECT)

High Heat Flux Removal by Water Jet Impingement using 3D Printed Nozzles

Authors: Ramaraju, Ram gopal varma, Passandideh-Fard, Mohammad, Chandra, Sanjeev

Source: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-6 Sep, 2022

Relation: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Evaluation of the performance of a magnetic-shuttle micropump in a two-phase mechanical pumping loop

Authors: Nico, Valeria, O'Donovan, Barry, Dalton, Eric

Source: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-6 Sep, 2022

Relation: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Thermal Performance of Miniature Vapour-Compression Refrigeration System for CPU Thermal Management

Authors: Fazeel, Mohammed N. M., Lebon, Michel, Byrne, Gerad, Murray, Gemma, Battagoli, Sara, Robinson, Anthony J.

Source: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-4 Sep, 2022

Relation: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Investigation of Grooved Heat Pipe Embedded Cold Plate Design with Additive Manufacturing

Authors: Yagci, Vedat, Parlak, Murat, Cadirci, Sertac

Source: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-5 Sep, 2022

Relation: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Thermal Management of Two-Sided Heat Load on a Cold Plate Considering the Friction Stir Welding Process

Authors: Parlak, Murat, Ors, Ergun, Yagci, Vedat

Source: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-8 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Intra- and inter-device passive thermal management using solid-solid Nickel Titanium phase change materials

Authors: Sharar, Darin James, Peters, Christopher, Olver, Kimberly, Wilson, Adam, Tsang, Harvey, Altman, David

Source: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-7 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Thermal Fluid Assessment of Cylinders with Multiple Slots in Aligned Flow

Authors: Alshareef, Sultan, Harman, Todd, Ameel, Tim

Source: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-9 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Data Analysis Platform for Nanobubble Characterization of Solid-state Nanopores

Authors: Paul, Soumyadeep, Hanada, Yuichiro, Lan, Bluest, Daiguji, Hirofumi, Liang, Kuo-Ching, Hsu, Wei-Lun

Source: 2022 IEEE 17th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Nano/Micro Engineered and Molecular Systems (NEMS), 2022 IEEE 17th International Conference on. :205-210 Apr, 2022

Relation: 2022 IEEE 17th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

Numerical Analysis of Pool Boiling of Nanofluids for High Heat Dissipation Applications

Authors: V., E., J., J.P., S., T.P.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(8):1293-1301 Aug, 2022

Two-Phase Closed-Loop Thermosyphon Filled with a Dielectric Liquid for Electronics Cooling Applications

Authors: Ghaffari, Omidreza, Sayed, Chady Al, Vincent, Manuel, Larimi, Yaser Nabavi, Grenier, Francis, Jasmin, Simon, Frechette, Luc, Sylvestre, Julien

Source: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :74-80 Jun, 2021

Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Topology Optimized Aluminum Heat Sinks for Steady-State and Transient Operation

Authors: Sharar, Darin J., Wilson, Adam A., Leff, Asher C.

Source: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :1030-1035 Jun, 2021

Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

The Impact of Variation in Filling Ratios, Evacuation Pressure, and Heat Input on Thermal Performance of Pulsating Heat Pipe

Authors: Patel, E.D., Kumar, S.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(2):259-269 Feb, 2022