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  1. 1
    Conference

    Source: 2024 3rd International Conference on Energy and Electrical Power Systems (ICEEPS) Energy and Electrical Power Systems (ICEEPS), 2024 3rd International Conference on. :864-868 Jul, 2024

    Relation: 2024 3rd International Conference on Energy and Electrical Power Systems (ICEEPS)

  2. 2
    Conference

    Source: 2023 3rd International Conference on Electrical Engineering and Mechatronics Technology (ICEEMT) Electrical Engineering and Mechatronics Technology (ICEEMT), 2023 3rd International Conference on. :202-206 Jul, 2023

    Relation: 2023 3rd International Conference on Electrical Engineering and Mechatronics Technology (ICEEMT)

  3. 3
    Conference

    Source: 2019 IEEE/ACM 27th International Symposium on Quality of Service (IWQoS) Quality of Service (IWQoS), 2019 IEEE/ACM 27th International Symposium on. :1-10 Jun, 2019

    Relation: 2019 IEEE/ACM 27th International Symposium on Quality of Service (IWQoS)

  4. 4
    Conference

    Source: 2018 Chinese Automation Congress (CAC) Automation Congress (CAC), 2018 Chinese. :976-979 Nov, 2018

    Relation: 2018 Chinese Automation Congress (CAC)

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    Conference

    Source: 2014 13th International Symposium on Distributed Computing and Applications to Business, Engineering and Science Distributed Computing and Applications to Business, Engineering and Science (DCABES), 2014 13th International Symposium on. :34-37 Nov, 2014

    Relation: 2014 13th International Symposium on Distributed Computing and Applications to Business, Engineering and Science (DCABES)

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    Periodical
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    Periodical

    Source: SMT: Surface Mount Technology. Jul2004, Vol. 18 Issue 7, p25-27. 2p.

    Geographic Terms: China

    Company/Entity: Data I/O Corp. 067156240 DAIO

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  12. 12
    Periodical

    Source: SMT: Surface Mount Technology. May2008, Vol. 22 Issue 5, p33-33. 1/8p.

    Subject Terms: *Technology

    Company/Entity: Data I/O Corp. 067156240 DAIO

    PDF Full Text
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    Conference

    Contributors: Schuchardt, Karen

    Source: Conference: 27th IEEE International Parallel & Distributed Processing Symposium, (IPDPS 2013), May 20-24, 2013, Boston, MA, 1205-1216

    File Description: Medium: X

  15. 15
    Periodical

    Authors: Case, Lenny

    Source: Automotive Industries. Jan2009, Vol. 189 Issue 1, p28-30. 2p. 3 Color Photographs.

    Company/Entity: Data I/O Corp. 067156240 DAIO

    People: Hume, Fred

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    Periodical

    Source: Electronic Business Buyer. Apr95, Vol. 21 Issue 4, p92. 3p. 1 Color Photograph, 1 Chart, 1 Graph.

    Company/Entity: Data I/O Corp. 067156240 DAIO

  19. 19
    Periodical

    Source: Electronic Engineering Times (01921541). 4/4/94, Issue 791, p22. 2p.

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