Randomized double‐blind cross‐over trial of bath additive containing tannic acid in patients with atopic dermatitis

Authors: Shunsuke Takahagi, Naoe Harada, Akiko Kamegashira, Shigeru Suzuki, Hajime Shindo, Hirotoshi Kanatani, Akio Tanaka, Hayato Mizuno, Michihiro Hide

Source: Journal of Cutaneous Immunology and Allergy, Vol 3, Iss 3, Pp 56-61 (2020)

Subject Terms: atopic dermatitis, bath additives, cross‐over, randomized control trial, tannic acid, Dermatology, RL1-803, Immunologic diseases. Allergy, RC581-607

File Description: electronic resource

Relation: https://doaj.org/toc/2574-4593

Access URL: https://doaj.org/article/7688737fa31a431c9038bb772d589e44

A composite additive used for a new cyanide-free silver plating bath (II): an insight by electrochemical measurements and quantum chemical calculation.

Authors: Liu, Anmin¹, Ren, Xuefeng², An, Maozhong³

Source: New Journal of Chemistry. 10/7/2017, Vol. 41 Issue 19, p11104-11112. 9p.

Subject Terms: *PLATING bath additives, *SILVER-plating, *ELECTROCHEMICAL analysis, *HYDANTOIN, *X-ray photoelectron spectroscopy

Microstructure, magnetic, and magnetoimpedance properties of electrodeposited NiFe/Cu and CoNiFe/Cu wire: A study on influence of saccharin additive in plating bath.

Authors: Mishra, Amaresh Chandra, Sahoo, Trilochan, Srinivas, V.

Source: Journal of Applied Physics; Apr2011, Vol. 109 Issue 7, p073901-1-073901-10, 10p

Effects of [HMIM]HSO4 and [OMIM]HSO4 on the electrodeposition of zinc from sulfate electrolytes.

Authors: Zhang, Qibo, Hua, Yixin

Source: Journal of Applied Electrochemistry; August 2009, Vol. 39 Issue 8, p1185-1192, 8p

Effects of temperature and current density on zinc electrodeposition from acidic sulfate electrolyte with [BMIM]HSO4 as additive.

Authors: Zhang, Qi Bo, Hua, Yi Xin, Dong, Tie Guang

Source: Journal of Applied Electrochemistry; August 2009, Vol. 39 Issue 8, p1207-1216, 10p

Effects of 1-butyl-3-methylimidazolium hydrogen sulfate-[BMIM]HSO4 on zinc electrodeposition from acidic sulfate electrolyte.

Authors: Zhang, Qibo, Hua, Yixin

Source: Journal of Applied Electrochemistry; February 2009, Vol. 39 Issue 2, p261-267, 7p

SERS and EQCM studies on the effect of allyl thiourea on copper dissolution and deposition in aqueous sulfuric acid.

Authors: Chen, Guo-Liang, Lin, Heng, Lu, Jiang-Hong

Source: Journal of Applied Electrochemistry; November 2008, Vol. 38 Issue 11, p1501-1508, 8p

Deposition of Zn-Cr alloy coatings from sulfate electrolyte: effect of polypropylene glycol 620 and glycine and combinations thereof.

Authors: Boiadjieva, Tz, Kovacheva, D., Lyutov, L.

Source: Journal of Applied Electrochemistry; October 2008, Vol. 38 Issue 10, p1435-1443, 9p

Current efficiency and kinetics of cobalt electrodeposition in acid chloride solutions. Part II: the influence of chloride and sulphate concentrations.

Authors: Kongstein, O. E., Haarberg, G. M., Thonstad, J.

Source: Journal of Applied Electrochemistry; June 2007, Vol. 37 Issue 6, p675-680, 6p

Effects of some additives on the corrosion behaviour and preferred orientations of zinc obtained by continuous current deposition.

Authors: Mouanga, M., Ricq, L., Douglade, J.

Source: Journal of Applied Electrochemistry; February 2007, Vol. 37 Issue 2, p283-289, 7p

Involvement of a metastable surface state in the electrocatalytic, electrodeposition and bath additive behaviour of copper in acid solution.

Authors: Burke, L. D., O'Connell, A. M., Sharna, R.

Source: Journal of Applied Electrochemistry; August 2006, Vol. 36 Issue 8, p919-929, 11p

Characteristics of zinc electrodeposits from acetate solutions.

Authors: Sekar, R., Jayakrishnan, Sobha

Source: Journal of Applied Electrochemistry; May 2006, Vol. 36 Issue 5, p591-597, 7p

Measurement of polarization parameters impacting on electrodeposit morphology. II: conventional zinc electrowinning solutions.

Authors: Adcock, P. A., Quillinan, A., Clark, B.

Source: Journal of Applied Electrochemistry; Aug2004, Vol. 34 Issue 8, p771-780, 10p

Silver electrodeposition from AgNO3 solutions containing organic additives: Electrodeposition from binary water-methanol solvent systems in the presence of tartaric acid.

Authors: Zarkadas, G. M., Stergiou, A., Papanastasiou, G.

Source: Journal of Applied Electrochemistry; Jun2004, Vol. 34 Issue 6, p607-615, 9p

Effects of thiourea on anodic dissolution of Au and surface oxidation behaviour in aq HClO4 studied by means of an EQCN.

Authors: Tian, M., Conway, B. E.

Source: Journal of Applied Electrochemistry; May2004, Vol. 34 Issue 5, p533-543, 11p

Development of a bath for codeposition of copper and platinum.

Authors: Obert, J., Lalvani, S. B.

Source: Journal of Applied Electrochemistry; Apr2004, Vol. 34 Issue 4, p397-401, 5p

Electrodeposition, composition and structure of Zn-Cr alloys.

Authors: Boiadjieva, Tz, Kovacheva, D., Petrov, K.

Source: Journal of Applied Electrochemistry; Mar2004, Vol. 34 Issue 3, p315-321, 7p

Thermal Effects in Thin Copper Foil.

Authors: Merchant, H. D.

Source: Journal of Electronic Materials; January 2004, Vol. 33 Issue 1, p83-88, 6p

Dependence of interface roughness and diffuseness of Cu-Co electrodeposited multilayers on electrochemical additives.

Authors: Merkourakis, Spyridon, Hÿtch, Martin J., Chassaing, Elisabeth

Source: Journal of Applied Physics; September 1 2003, Vol. 94 Issue 5, p3035-3040, 6p

An electrochemical approach to total organic carbon control in printed circuit board copper sulfate plating baths. Part II: Overall system.

Authors: Gattrell, M., MacDougall, B., Henuset, Y. M.

Source: Journal of Applied Electrochemistry; December 2002, Vol. 32 Issue 12, p1303-1311, 9p