Digital Twins for IC Packages and Electronics-enabled Systems

Authors: Inamdar, Adwait, Gromala, Przemyslaw, Bailey, Christopher, Nguyen, Luu, Chan, Benson, Ryu, Jong, Rezaie, Farnood, Detofsky, Abram, Van Driel, Willem D., Zhang, GuoQi

Source: 2024 IEEE Smart World Congress (SWC) SWC Smart World Congress (SWC), 2024 IEEE. :2125-2132 Dec, 2024

Relation: 2024 IEEE Smart World Congress (SWC)

Exploring Pressureless Nano-Copper Sintering for Power Chip Interconnection

Authors: Gao, Chenshan, Li, Shizhen, Wang, Shaogang, Zhang, Guoqi, Ye, Huaiyu

Source: 2024 21st China International Forum on Solid State Lighting & 2024 10th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) Soli State Lighting & 2024 10th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS), 2024 21st China International Forum on. :141-144 Nov, 2024

Relation: 2024 21st China International Forum on Solid State Lighting & 2024 10th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)

Finite Element Analysis of Planar Inductors With Soft Magnetic Encapsulation Materials

Authors: Wang, Jiaxuan, Li, Xiao, Zhao, Jiayan, Li, Jinbing, Zhang, Guoqi, Liu, Pan

Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

Investigating Coalescence Kinetics in Cu Nanoparticle by Molecular Dynamics and 3D Reconstruction

Authors: Du, Leiming, Ji, Xinrui, Liu, Kai, Fan, Jiajie, Zhang, Guoqi

Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

Molecular Dynamics Assisted Corrosion-Resistant Evaluation of Encapsulation Materials on Copper Used in Power Electronics Packaging

Authors: Zhang, Jinyuan, Chen, Wei, Tang, Hongyu, Zhu, Xi, Zhang, Guoqi, Fan, Jiajie

Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

An Investigation of Process Parameters Effects on Void Formation in Fluxless Solder Paste for Power Module Packaging Applications via Formic Acid Vacuum Reflow Technology

Authors: Ji, Liangzheng, Guo, Wenwu, Zhang, Guoqi, Zhang, Jing, Liu, Pan

Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

Avalanche Ruggedness Evaluation on Planar and Trench SiC MOSFETs: An Experimental and TCAD Simulation Study

Authors: Luo, Tao, Luo, Runding, Xiang, Zaiman, Zhuang, Jianjun, Zhang, Guoqi, Fan, Jiajie

Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

Simulation, Prediction and Verification of the Thermal and Electrical Properties of Sintered Copper Joints with Random Pore Structure for Power Electronics Packaging

Authors: Liu, Wenting, Wang, Jianhao, Gao, Yue, Ji, Liangzheng, Zhang, Jing, Zhang, Guoqi, Liu, Pan

Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation

Authors: Liu, Xu, Wang, Shaogang, Hu, Dong, Gao, Chenshan, Huang, Qianming, Ye, Huaiyu, French, Paddy, Zhang, Guoqi

Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1119-1123 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Authors: Ji, Xinrui, Du, Leiming, van Zeijl, Henk, Zhang, Guoqi, Derakhshandeh, Jaber, Beyne, Eric

Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1891-1895 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

In Situ Analysis of Copper Microstructures in Electromigration Using SEM-EBSD Techniques

Authors: Zhang, Yaqian, Yan, Yixin, Vollebregt, Sten, Zhang, Guoqi

Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1317-1321 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Investigating Sintering Mechanism of 100 nm Ag Nanoparticles via In-situ SEM Observation and Phase Field Simulation

Authors: Hu, Xiao, Hu, Dong, Poelma, Rene, Huang, Jianlin, Fan, Jiajie, Van Driel, Willem D., Zhang, Guoqi

Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1236-1240 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Characterization of a Piezoresistive Sensor for In-Situ Health Monitoring of Solder Bumps

Authors: Inamdar, Adwait, Thukral, Varun, Zhang, Letian, Zaal, Jeroen J. M., Van Soestbergen, Michiel, Tuinhout, Hans, Van Driel, Willem D., Zhang, GuoQi

Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :157-163 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Multi-Objective Optimization of a 1200-V Fan-Out Panel-Level SiC MOSFET Packaging with Improved Genetic and Particle Swarm Algorithms

Authors: Yan, Xuyang, Chen, Wei, Li, Wenyu, Jiang, Jing, Fan, Xuejun, Zhang, Guoqi, Fan, Jiajie

Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2143-2149 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

An Efficient Rectifier Hybridizing Synchronized Electric Charge Extraction and Bias-Flipping for Triboelectric Energy Harvesting

Authors: Peng, Wenyu, van Driel, Willem, Zhang, Guoqi, Du, Sijun

Source: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification

Authors: Martin, Henry A., Xu, Haojia, Smits, Edsger C.P., van Driel, Willem D., Zhang, GuoQi

Source: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-7 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Temperature dependent trap characterisation and modelling of silicon carbide MOS capacitor

Authors: Li, Jinglin, Vollebregt, Sten, Zhang, Yaqian, Shekhar, Aditya, May, Alexander, Driel, Willem D. Van, Zhang, Guoqi

Source: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components

Authors: Inamdar, Adwait, Hauck, Torsten, Soestbergen, Michiel van, Driel, Willem D. van, Zhang, GuoQi

Source: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Sintering Process Simulation of Ag Nanoparticles by Phase Field Method

Authors: Hu, Xiao, Huang, Jianlin, Poelma, Rene, Driel, Willem Dirk van, Zhang, Guoqi

Source: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Warpage deformation analysis of AMB ceramic substrates in power modules

Authors: Hu, Dong, Wang, Chieh, Li, Zichuan, Gupta, Nikhil, Poelma, Rene H., Shi, Ziliang, Fan, Jiajie, Zhang, Guoqi

Source: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-9 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)