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    Academic Journal

    Authors: Yu-ting, Yang1 (AUTHOR) 18750722761@163.com, Li-xiang, Chen1,2 (AUTHOR) 834244848@qq.com, Miao, Yao1 (AUTHOR) 1215513350@qq.com, Yong-wei, Yang1 (AUTHOR) zmcl_yang@163.com, Ting, Lin1 (AUTHOR) lt22862125@fjmu.edu.cn

    Source: BMC Public Health. 2/18/2025, Vol. 25 Issue 1, p1-15. 15p.

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  16. 16
    Conference

    Source: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :111-114 Oct, 2018

    Relation: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

  17. 17
    Conference

    Source: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 12th International. :85-88 Oct, 2017

    Relation: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

  18. 18
    Conference

    Source: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 12th International. :187-190 Oct, 2017

    Relation: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

  19. 19
    Conference

    Source: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :637-642 May, 2017

    Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

  20. 20
    Conference

    Source: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :1793-1798 May, 2017

    Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)