30.1 A 28Gb/mm24XX-Layer 1Tb 3b/Cell WF-Bonding 3D-NAND Flash with 5.6Gb/s/Pin IOs

Authors: Park, Sang-Soo, Lyu, Jae-Doeg, Kim, Myungjun, Lee, Jaeyun, Song, Younsun, Yu, Chung-Ho, Makoto, Hirano, Kwon, Yongseok, Park, Jong-Hoon, Kim, Ho-Joon, Lee, Daein, Seo, Donghyun, Go, Byungrok, Jeon, Seoyoon, Kim, Yoonjee, Kim, Doo-Hyun, Jo, Youngmin, Yoon, Hyunjun, Park, Junehong, Kim, Inmo, Kim, Sunghoon, Lee, Hokil, Yu, Je-Hyeon, Kim, Sang-Lok, Ku, Hwan-Seok, Seo, Jungmin, Byun, Jindo, Yun, Seung-Hyeon, Kang, Kyoungtae, Kim, Seung-Beom, Lee, Yohan, Lee, Yongkyu, Kang, Kyunghwa, Lee, Han-Jun, Ryu, Younghwan, Kim, Hyundo, Kim, Wontae, Choi, Hyeongdo, Jeon, Juho, Park, Ansoo, Song, Raehyun, Kim, Jae-Hwan, Kim, Jung-Soo, Lee, Hwa-Seok, Lee, Moo-Kyung, Son, Jae-Ick, Cho, Jiho, Kim, Moosung, Im, Jae-Woo, Park, Jongmin, Kwon, Hyuckjoon, Choi, Youngdon, Yoon, Chiweon, Lee, Seungjae, Song, Kiwhan, Hur, Sung-Hoi

Source: 2025 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2025 IEEE International. 68:1-3 Feb, 2025

Relation: 2025 IEEE International Solid-State Circuits Conference (ISSCC)