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1Conference
Authors: Yang, Jae-Soon, Chung, Myung-Kun, Yoo, Jae-Young, Kim, Beom-Jun, Kim, Sung-Ho, Jung, Se-Yoon, Lee, Tae-Yeon, Kim, Min-Uk, Yoon, Jun-Bo
Source: 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2025 IEEE 38th International Conference on. :987-990 Jan, 2025
Relation: 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS)
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2Conference
Authors: Chung, Myung-Kun, Jeon, Su-Min, Yang, Jae-Soon, Yoo, Jae-Young, Kim, Min-Uk, Kim, Beom-Jun, Lee, Tae-Yeon, Jo, Min-Seung, Yoon, Jun-Bo
Source: 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2025 IEEE 38th International Conference on. :857-860 Jan, 2025
Relation: 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS)
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3Conference
Authors: Chung, Myung-Kun, Kim, Min-Uk, Han, Jong-Woo, Yang, Jae-Soon, Kim, Beom-Jun, Jo, Min-Seung, Jung, Se-Yoon, Kim, Sung-Ho, Yoon, Jun-Bo
Source: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :521-524 Jan, 2024
Relation: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)
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4Periodical
Authors: Jo, Min-Seung, Kim, Ki-Hoon, Lee, Jae-Shin, Kim, Sung-Ho, Yoo, Jae-Young, Choi, Kwang-Wook, Kim, Beom-Jun, Kwon, Dae-Sung, Yoo, Ilseon, Yang, Jae-Soon
Source: ACS NANO. 17(23):23649-23658
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5Academic Journal
Authors: Jo, Min-Seung, Kim, Beom-Jun, Chung, Myung-Kun, Jung, Se-Yoon, Seo, Min-Ho, Yoo, Jae-Young, Yang, Jae-Soon, Kim, Sung-Ho, Yoon, Jun-Bo
Source: Nanoscale Advances; 3/21/2025, Vol. 7 Issue 6, p1509-1517, 9p
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6Academic Journal
Authors: Yang, Jae-Soon, Chung, Myung-Kun, Yoo, Jae-Young, Kim, Min-Uk, Kim, Beom-Jun, Jo, Min-Seung, Kim, Sung-Ho, Yoon, Jun-Bo
Source: Nature Communications; 2/27/2025, Vol. 16 Issue 1, p1-11, 11p
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7Academic Journal
Authors: Kang, Inho1, Bilbily, John2,3,4,5,6, Kim, Choong Yeon1,7, Shi, Chuanqian8, Madasu, Manish K.2,3,4,5, Jeong, Eun Young1, Parker, Kyle E.2,3,4,5, Kwon, Do A1,9, Jung, Bum‐Joon10, Yang, Jae‐Soon1, Lee, Juhyun1, Kabbaj, Noah D.L.2,3,4,5, Lee, Wonhee10,11,12, Yoon, Jun‐Bo1, Al‐Hasani, Ream2,3,4,5, Xiao, Jianliang8, McCall, Jordan G.2,3,4,5, jordangmccall@wustl.edu, Jeong, Jae‐Woong1,13, jjeong1@kaist.ac.kr
Source: Advanced Science; 1/27/2025, Vol. 12 Issue 4, p1-13, 13p
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8Academic Journal
Authors: Kim, Sung‐Ho, Jo, Min‐Seung, Choi, Kwang‐Wook, Yoo, Jae‐Young, Kim, Beom‐Jun, Yang, Jae‐Soon, Chung, Myung‐Kun, Kim, Tae‐Soo, Yoon, Jun‐Bo
Source: Small; 1/11/2024, Vol. 20 Issue 2, p1-9, 9p
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9Academic Journal
Authors: Yoo, Jae-Young (AUTHOR) jbyoon@kaist.ac.kr, Yang, Jae-Soon (AUTHOR), Chung, Myung-Kun (AUTHOR), Kim, Sung-Ho (AUTHOR), Yoon, Jun-Bo (AUTHOR)
Source: Journal of Micromechanics & Microengineering. Jul2021, Vol. 31 Issue 7, p1-16. 16p.
Subject Terms: *FLEXIBLE electronics, *STRUCTURAL design, *CURVED surfaces, *ELECTRONIC equipment