Effect of daisy chain structure on electromigration reliability of microbumps: A simulation study

Authors: Yan, Chenkan, Wang, Dun, Zhang, Kaihong, Zhang, Huibin, Yu, Yongjian, Xie, Weikun, Zhu, Kai, Wan, Yongkang

Source: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-6 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

Hot deformation and grain refinement mechanisms of commercially pure titanium processed via three-directional cryo-compression

Authors: Yan, Chenkan, Feng, Aihan, Qu, Shoujiang, Sun, J.L., Shen, J.

Source: In Materials Science & Engineering A 25 July 2018 731:266-277

Numerical Investigation on the Strain Evolution of Ti-6Al-4V Alloy during Multi-directional Forging at Elevated Temperatures

Authors: Yan Chenkan, Shen Jun, Lin Peng

Source: High Temperature Materials and Processes, Vol 37, Iss 6, Pp 571-580 (2018)

Subject Terms: ti-6al-4v alloy, finite element method, multi-directional forging, effective strain, Technology, Chemical technology, TP1-1185, Chemicals: Manufacture, use, etc., TP200-248

File Description: electronic resource

Relation: https://doaj.org/toc/0334-6455; https://doaj.org/toc/2191-0324

Access URL: https://doaj.org/article/654811facb8341aa927d2b0724d29036

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