Showing 1 - 20 results of 144 Refine Results
  1. 1
  2. 2
  3. 3
  4. 4
    Academic Journal
  5. 5
  6. 6
    Academic Journal

    Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 32(4):1-7 Jun, 2022

    Linked Full Text
  7. 7
    Academic Journal

    Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 32(4):1-5 Jun, 2022

    Linked Full Text
  8. 8
    Conference

    Source: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :40-44 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

  9. 9
    Academic Journal

    Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 31(5):1-5 Aug, 2021

    Linked Full Text
  10. 10
    Academic Journal

    Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 31(5):1-4 Aug, 2021

    Linked Full Text
  11. 11
    Academic Journal

    Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 30(4):1-5 Jun, 2020

    Linked Full Text
  12. 12
    Academic Journal

    Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 29(7):1-11 Oct, 2019

    Linked Full Text
  13. 13
    Academic Journal

    Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 29(5):1-5 Aug, 2019

    Linked Full Text
  14. 14
    Conference

    Source: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on. :1-8 Apr, 2015

    Relation: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

  15. 15
    Conference

    Source: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-13 Apr, 2013

    Relation: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

  16. 16
  17. 17
    Conference

    Source: 2011 IEEE International Symposium on Technology and Society (ISTAS) Technology and Society (ISTAS), 2011 IEEE International Symposium on. :1-5 May, 2011

    Relation: 2011 IEEE International Symposium on Technology and Society (ISTAS)

  18. 18
    Conference

    Source: First International Symposium on Control, Communications and Signal Processing, 2004. Control, communications and signal processing Control, Communications and Signal Processing, 2004. First International Symposium on. :389-392 2004

    Relation: 2004 First International Symposium on Control, Communications and Signal Processing

  19. 19
    Conference

    Source: Proceedings. IEEE Computer Society Bioinformatics Conference Bioinformatics Bioinformatics Conference, 2002. Proceedings. IEEE Computer Society. :21-28 2002

    Relation: Proceedings of IEEE Computer Society Bioinformatics Conference

  20. 20
    Academic Journal

    Source: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 28(4):1-5 Jun, 2018

    Linked Full Text