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1Academic Journal
Source: IEEE Transactions on Industrial Informatics IEEE Trans. Ind. Inf. Industrial Informatics, IEEE Transactions on. 21(3):2630-2639 Mar, 2025
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2Conference
Authors: Patel, Nitin, Jha, Sunil, Nohwal, Aman
Source: 2025 9th International Conference on Mechanical Engineering and Robotics Research (ICMERR) Mechanical Engineering and Robotics Research (ICMERR), 2025 9th International Conference on. :123-127 Jan, 2025
Relation: 2025 9th International Conference on Mechanical Engineering and Robotics Research (ICMERR)
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3Conference
Authors: Hietala, Mikko, Rautio, Timo, Keskitalo, Markku, Jaskari, Matias, Arvola, Jari, Jarvenpaa, Antti
Source: 2024 International Conference on Power, Energy and Innovations (ICPEI) Power, Energy and Innovations (ICPEI), 2024 International Conference on. :196-201 Oct, 2024
Relation: 2024 International Conference on Power, Energy and Innovations (ICPEI)
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4Conference
Authors: Nagpal, Amandeep, Rajitha, Akula, K, Aravinda, Gouthami, G., Kalra, Ravi, Abdulla, Namaat R.
Source: 2024 OPJU International Technology Conference (OTCON) on Smart Computing for Innovation and Advancement in Industry 4.0 Smart Computing for Innovation and Advancement in Industry 4.0, 2024 OPJU International Technology Conference (OTCON) on. :1-6 Jun, 2024
Relation: 2024 OPJU International Technology Conference (OTCON) on Smart Computing for Innovation and Advancement in Industry 4.0
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5Conference
Authors: Khan, Irfan, Anjimoon, Shaik, Asha, V, Singla, Atul, Akhil, P., Alsultany, Nahed Mahmood Ahmed
Source: 2024 OPJU International Technology Conference (OTCON) on Smart Computing for Innovation and Advancement in Industry 4.0 Smart Computing for Innovation and Advancement in Industry 4.0, 2024 OPJU International Technology Conference (OTCON) on. :1-6 Jun, 2024
Relation: 2024 OPJU International Technology Conference (OTCON) on Smart Computing for Innovation and Advancement in Industry 4.0
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6Conference
Authors: Al Zaidi, Hussein Oraibi Hawi, Kumar, S Vinod, Raj, Vijilius Helena, Lakhanpal, Sorabh, Yadav, Dinesh Kumar, Neelima, K.
Source: 2024 OPJU International Technology Conference (OTCON) on Smart Computing for Innovation and Advancement in Industry 4.0 Smart Computing for Innovation and Advancement in Industry 4.0, 2024 OPJU International Technology Conference (OTCON) on. :1-6 Jun, 2024
Relation: 2024 OPJU International Technology Conference (OTCON) on Smart Computing for Innovation and Advancement in Industry 4.0
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7Conference
Authors: Biswas, Preesat, Rajitha, Akula, Revathi, V, Thethi, H Pal, Mohammed, Safaa Halool, Yadav, Dinesh Kumar
Source: 2024 OPJU International Technology Conference (OTCON) on Smart Computing for Innovation and Advancement in Industry 4.0 Smart Computing for Innovation and Advancement in Industry 4.0, 2024 OPJU International Technology Conference (OTCON) on. :1-6 Jun, 2024
Relation: 2024 OPJU International Technology Conference (OTCON) on Smart Computing for Innovation and Advancement in Industry 4.0
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8Conference
Authors: Nagpal, Amandeep, Alekhya, V, Swathi, B, Sravani, A, Kumar, Ashwani, Shleghm, Maytham Razaq
Source: 2024 OPJU International Technology Conference (OTCON) on Smart Computing for Innovation and Advancement in Industry 4.0 Smart Computing for Innovation and Advancement in Industry 4.0, 2024 OPJU International Technology Conference (OTCON) on. :1-6 Jun, 2024
Relation: 2024 OPJU International Technology Conference (OTCON) on Smart Computing for Innovation and Advancement in Industry 4.0
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9Conference
Authors: Nijhawan, Ginni, Lalitha, G, Asha, V, Suresh, V J, Praveen, Abdulzahraa, Zahraa H.
Source: 2024 OPJU International Technology Conference (OTCON) on Smart Computing for Innovation and Advancement in Industry 4.0 Smart Computing for Innovation and Advancement in Industry 4.0, 2024 OPJU International Technology Conference (OTCON) on. :1-6 Jun, 2024
Relation: 2024 OPJU International Technology Conference (OTCON) on Smart Computing for Innovation and Advancement in Industry 4.0
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10Academic Journal
Source: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 71(8):9708-9718 Aug, 2024
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11Academic Journal
Source: IEEE Transactions on Plasma Science IEEE Trans. Plasma Sci. Plasma Science, IEEE Transactions on. 52(7):2586-2594 Jul, 2024
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12Conference
Authors: Yadav, Ashish, Srivastava, Manu, Jain, Prashant K, Rathee, Sandeep
Source: 2024 1st International Conference on Robotics, Engineering, Science, and Technology (RESTCON) Robotics, Engineering, Science, and Technology (RESTCON), 2024 1st International Conference on. :218-221 Feb, 2024
Relation: 2024 1st International Conference on Robotics, Engineering, Science, and Technology (RESTCON)
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13Conference
Source: 2024 1st International Conference on Robotics, Engineering, Science, and Technology (RESTCON) Robotics, Engineering, Science, and Technology (RESTCON), 2024 1st International Conference on. :143-148 Feb, 2024
Relation: 2024 1st International Conference on Robotics, Engineering, Science, and Technology (RESTCON)
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14Academic Journal
Authors: Fang, J., Wang, Z., Liu, W., Lauria, S., Zeng, N., Prieto, C., Sikstrom, F., Liu, X.
Source: IEEE Transactions on Automation Science and Engineering IEEE Trans. Automat. Sci. Eng. Automation Science and Engineering, IEEE Transactions on. 21(2):1244-1257 Apr, 2024
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15Academic Journal
Authors: A. Rajesh Kannan, N. Siva Shanmugam, K. Sanjeeviprakash, Yasam Palguna, Rajesh Korla, Wonjoo Lee, YuHyeong Jeong, Jonghun Yoon
Source: Journal of Materials Research and Technology, Vol 36, Iss , Pp 3996-4004 (2025)
Subject Terms: Wire arc additive manufacturing, Austenitic stainless steels, Microstructure, Mechanical properties, Elevated temperatures, Mining engineering. Metallurgy, TN1-997
File Description: electronic resource
Relation: http://www.sciencedirect.com/science/article/pii/S2238785425009068; https://doaj.org/toc/2238-7854
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16Academic Journal
Authors: Shambhu Kumar Manjhi, Oyyaravelu R, Srikanth Bontha, A.S.S. Balan
Source: International Journal of Lightweight Materials and Manufacture, Vol 8, Iss 3, Pp 355-373 (2025)
Subject Terms: Wire arc additive manufacturing, AZ31 Mg alloy, Low plasticity burnishing, Burnishing pattern, Microstructure, Electrochemical corrosion, Technology
File Description: electronic resource
Relation: http://www.sciencedirect.com/science/article/pii/S2588840424001008; https://doaj.org/toc/2588-8404
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17Academic Journal
Authors: Le Zhou, Silong Cao, Wen Ma, Furong Chen
Source: Journal of Materials Research and Technology, Vol 36, Iss , Pp 1597-1612 (2025)
Subject Terms: Wire arc additive manufacturing, Al–5%Mg alloy, Magnetic field, Microstructure optimization, Mechanical properties, Mining engineering. Metallurgy, TN1-997
File Description: electronic resource
Relation: http://www.sciencedirect.com/science/article/pii/S2238785425007501; https://doaj.org/toc/2238-7854
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18Academic Journal
Microstructure and corrosion resistance of CMT+P wire arc additive manufacturing 2024 aluminum alloy
Authors: YAN Junpei, LU Xuecheng, ZHANG Zhiqiang, ZHUO Shuai, LI Hanxi
Source: Cailiao gongcheng, Vol 53, Iss 3, Pp 105-116 (2025)
Subject Terms: high strength aluminum alloy, wire arc additive manufacturing, pore, microstructure, corrosion resistance, Materials of engineering and construction. Mechanics of materials, TA401-492
File Description: electronic resource
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19Academic Journal
Authors: Abdulrazaq Mustafa Mohammed, AL-Khafaji Mohanned M. H., Salahaddin Abdulkader Kadauw, Krinke Stefan, Zeidler Henning
Source: Management Systems in Production Engineering, Vol 33, Iss 1, Pp 46-53 (2025)
Subject Terms: wire arc additive manufacturing, fuzzy logic, cmt welding, inclined plane, Production management. Operations management, TS155-194
File Description: electronic resource
Relation: https://doaj.org/toc/2450-5781
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20Academic Journal
Source: Journal of Materials Research and Technology, Vol 35, Iss , Pp 3226-3235 (2025)
Subject Terms: Inconel 625 alloy, Wire arc additive manufacturing, Mechanical properties, Microstructures, Fracture behavior, Mining engineering. Metallurgy, TN1-997
File Description: electronic resource
Relation: http://www.sciencedirect.com/science/article/pii/S2238785425002728; https://doaj.org/toc/2238-7854