Future Design Direction for SRAM Data Array: Hierarchical Subarray With Active Interconnect

Authors: Liu, H., Gilardi, C., Salahuddin, S.M., Pei, Z., Schuddinck, P., Xiang, Y., Weckx, P., Hellings, G., Bardon, M.G., Ryckaert, J., Pan, C., Mitra, S., Catthoor, F.

Source: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 71(12):6495-6506 Dec, 2024

A Novel DTCO-driven 1T1R Bitcell for sub-10ns STT-MRAM LLC Macros at N12 Node

Authors: Garcia-Redondo, F., Verschueren, L., Rao, S., Pandey, P., Abdi, D., Weckx, P., Couet, S., Garcia-Bardon, M., Hellings, G.

Source: 2024 IEEE European Solid-State Electronics Research Conference (ESSERC) Solid-State Electronics Research Conference (ESSERC), 2024 IEEE European. :665-668 Sep, 2024

Relation: 2024 IEEE European Solid-State Electronics Research Conference (ESSERC)

Area-Efficient CFET Dual-port SRAM with Backside Interconnect

Authors: Abdi, D., Brunion, M., Garcia-Redondo, F., Weckx, P., Boemmels, J., Verschueren, L., Farokhnejad, A., Garcia-Bardon, M., Hellings, G., Ryckaert, J.

Source: 2024 IEEE European Solid-State Electronics Research Conference (ESSERC) Solid-State Electronics Research Conference (ESSERC), 2024 IEEE European. :21-24 Sep, 2024

Relation: 2024 IEEE European Solid-State Electronics Research Conference (ESSERC)

Possible Origins, Identification, and Screening of Silent Data Corruption in Data Centers

Authors: Sangani, D., Kaczer, B., Weckx, P., Roussel, Ph. J., Mishra, S., Marinissen, E. J., Gielen, G.

Source: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :1-7 Apr, 2024

Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation

Authors: Mishra, S., Vermeersch, B., Sankatali, V., Kukner, H., Sharma, A., Mirabeli, G., Bufler, F. M., Brunion, M., Abdi, D., Oprins, H., Biswas, D., Zografos, O., Catthoor, F., Weckx, P., Hellings, G., Myers, J., Ryckaert, J.

Source: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :1-6 Apr, 2024

Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

Gate oxide reliability: upcoming trends, challenges, and opportunities

Authors: Kaczer, B., Degraeve, R., Franco, J., Grasser, T., Roussel, Ph. J., Bury, E., Weckx, P., Chasin, A., Tyaginov, S., Vandemaele, M., Grill, A., O'Sullivan, B., Fortuny, J. Diaz, Canflanca, P. Saraza, Waltl, M., Rinaudo, P., Zhao, Y., Kao, E., Asanovski, R., Catapano, E., Beckers, A., Vici, A., Truijen, B., Higashi, Y., Clima, S., Xiang, Y., Sangani, D., Panarella, L., Smets, Q., Knobloch, T., Waldhor, D., Van Troeye, B., Guo, Y., Kruv, A., Viswakarma, K., Gonzalez, M., Linten, D.

Source: 2024 IEEE Silicon Nanoelectronics Workshop (SNW) Silicon Nanoelectronics Workshop (SNW), 2024 IEEE. :3-4 Jun, 2024

Relation: 2024 IEEE Silicon Nanoelectronics Workshop (SNW)

CFET SRAM With Double-Sided Interconnect Design and DTCO Benchmark

Authors: Liu, H., Schuddinck, P., Pei, Z., Verschueren, L., Mertens, H., Salahuddin, S.M., Hiblot, G., Xiang, Y., Chan, B.T., Subramanian, S., Weckx, P., Hellings, G., Bardon, M.G., Ryckaert, J., Pan, C., Catthoor, F.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(10):5099-5106 Oct, 2023

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)

Authors: Mishra, S., Sankatali, V., Vermeersch, B., Brunion, M., Lofrano, M., Abdi, D., Oprins, H., Biswas, D., Zografos, O., Hiblot, G., Van Der Plas, G., Weckx, P., Hellings, G., Myers, J., Catthoor, F., Ryckaert, J.

Source: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-7 Mar, 2023

Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)

3D SRAM Macro Design in 3D Nanofabric Process Technology

Authors: Abdi, D.B., Salahuddin, S.M., Boemmels, J., Giacomin, E., Weckx, P., Ryckaert, J., Hellings, G., Catthoor, F.

Source: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 70(7):2858-2867 Jul, 2023

Increasing Functionality of Wafer’s Backside: Analysis of Si and WS₂ Backside Power-Switch

Authors: Mirabelli, G., Chen, R., Ahmed, Z., Chehab, B., Zografos, O., Hiblot, G., Weckx, P., Hellings, G., Ryckaert, J.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(7):3970-3974 Jul, 2023

CFET SRAM DTCO, Interconnect Guideline, and Benchmark for CMOS Scaling

Authors: Liu, H., Salahuddin, S.M., Chan, B.T., Schuddinck, P., Xiang, Y., Hellings, G., Weckx, P., Ryckaert, J., Catthoor, F.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(3):883-890 Mar, 2023

Multitimescale Mitigation for Performance Variability Improvement in Time-Critical Systems

Authors: Lin, J., Weckx, P., Mishra, S., Spessot, A., Catthoor, F.

Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 30(11):1757-1769 Nov, 2022

Thermal Performance Analysis of Mempool RISC-V Multicore SoC

Authors: Venkateswarlu, S., Mishra, S., Oprins, H., Vermeersch, B., Brunion, M., Han, J., Stan, M.R., Weckx, P., Catthoor, F.

Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 30(11):1668-1676 Nov, 2022

Evaluation of Nanosheet and Forksheet Width Modulation for Digital IC Design in the Sub-3-nm Era

Authors: Sisto, G., Zografos, O., Chehab, B., Kakarla, N., Xiang, Y., Milojevic, D., Weckx, P., Hellings, G., Ryckaert, J.

Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 30(10):1497-1506 Oct, 2022

Proactive Run-Time Mitigation for Time-Critical Applications Using Dynamic Scenario Methodology

Authors: Lin, J. Y., Weckx, P., Mishra, S., Spessot, A., Catthoor, F.

Source: 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE) Design, Automation & Test in Europe Conference & Exhibition (DATE), 2022. :616-621 Mar, 2022

Relation: 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE)

Block-level Evaluation and Optimization of Backside PDN for High-Performance Computing at the A14 node

Authors: Sisto, G., Preston, R., Chen, R., Mirabelli, G., Farokhnejad, A., Zhou, Y., Ciofi, I., Jourdain, A., Veloso, A., Stucchi, M., Zografos, O., Weckx, P., Hellings, G., Ryckaert, J.

Source: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023

Relation: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

Extended Methodology to Determine SRAM Write Margin in Resistance-Dominated Technology Node

Authors: Liu, H., Salahuddin, S.M., Abdi, D., Chen, R., Weckx, P., Matagne, P., Catthoor, F.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(6):3113-3117 Jun, 2022

Reliability and Variability-Aware DTCO Flow: Demonstration of Projections to N3 FinFET and Nanosheet Technologies

Authors: Rzepa, G., Karner, M., Baumgartner, O., Strof, G., Schanovsky, F., Mitterbauer, F., Kernstock, C., Karner, H.W., Weckx, P., Hellings, G., Claes, D., Wu, Z., Xiang, Y., Chiarella, T., Parvais, B., Mitard, J., Franco, J., Kaczer, B., Linten, D., Stanojevic, Z.

Source: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-6 Mar, 2021

Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)

Overhead Reduction with Optimal Margining Using A Reliability Aware Design Paradigm

Authors: Mishra, S., Weckx, P., Zografos, O., Lin, J. Y., Spessot, A., Catthoor, F.

Source: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-7 Mar, 2021

Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)

TCAD-Assisted MultiPhysics Modeling & Simulation for Accelerating Silicon Quantum Dot Qubit Design

Authors: Mohiyaddin, F. A., Simion, G., Stuyck, N. I. Dumoulin, Li, R., Elsayed, A., Shehata, M., Kubicek, S., Godfrin, C., Chan, B. T., Jussot, J., ubotaru, F. C, Brebels, S., Bufler, F. M., Eneman, G., Weckx, P., Matagne, P., Spessot, A., Govoreanu, B., Radu, I. P.

Source: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2020 International Conference o. :253-256 Sep, 2020

Relation: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)