Showing 1 - 20 results of 3,847 Refine Results
  1. 1
    Conference

    An Improved Two-Stage Time Synchronization Scheme for OTFS Systems

    Authors: Wang, Chin-Liang, Li, Yu-Tang, Ma, Kai-Hsiang

    Source: 2024 IEEE 100th Vehicular Technology Conference (VTC2024-Fall) Vehicular Technology Conference (VTC2024-Fall), 2024 IEEE 100th. :1-5 Oct, 2024

    Relation: 2024 IEEE 100th Vehicular Technology Conference (VTC2024-Fall)

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  2. 2
    Conference

    Low-Complexity Power Allocation for Outage Balancing in NOMA Systems with Imperfect CSIT

    Authors: Huang, Shih-Hsuan, Wang, Chin-Liang

    Source: 2024 IEEE 100th Vehicular Technology Conference (VTC2024-Fall) Vehicular Technology Conference (VTC2024-Fall), 2024 IEEE 100th. :1-5 Oct, 2024

    Relation: 2024 IEEE 100th Vehicular Technology Conference (VTC2024-Fall)

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  3. 3
    Report

    Enhanced deep-freezing magneto- and elasto-caloric effects by modifying lattice anharmonicity and electronic structures

    Authors: Huang, Xiao-Ming, Zhao, Ying, Hao, Xiaowen, Xiang, Hua-You, Yang, Jin-Han, Wang, Chin-Wei, Yang, Wenyun, Zhang, Cuiping, Zhao, Binru, Ma, Jie, Li, Zongbin, Kuang, Yafei, Zuo, Liang, Tong, Xin, Yan, Hai-Le, Ren, Qingyong

    Subject Terms: Condensed Matter - Materials Science

    Access URL: http://arxiv.org/abs/2502.19034

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  4. 4
    Conference

    Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding with Tailored CMP Process

    Authors: Lee, Ou-Hsiang, Chiu, Wei-Lan, Chang, Hsiang-Hung, Chiang, Chia-Wen, Yu, Shih-Cheng, Yang, Tsung-Yu Ou, Hsiao, Su-Ching, Ko, Ting-Yu, Lin, Yu-Min, Wang, Chin-Hung, Lo, Wei-Chung, Lee, Chia-Hsin, Tan, Chung-An, Fowler, Michelle, Lubbers, Maycie

    Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1863-1867 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    Conference

    Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned Cu and SiCN-to-SiO2 Wafer-to-Wafer Hybrid Bonding

    Authors: Chiu, Wei-Lan, Lee, Ou-Hsiang, Chang, Hsiang-Hung, Lo, James Yi-Jen, Shih, Chiang-Lin, Chiu, Hsih-Yang, Wang, Chin-Hung, Lo, Wei-Chung

    Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :319-324 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  6. 6
    Conference

    Fan-out RDL Packaging Process and Shuttle Service

    Authors: Yu, Chen-Chun, Chang, Hsiang-Hung, Chen, Yi-Shu, Lee, Yuan-Chang, Fu, Huan-Chun, Chen, Yu-Fang, Lin, I-Hsing, Ku, Chiao-Ying, You, Shih-Cheng, Wu, Kuan-Chu, Chen, Ying-Ju, Wang, Chin-Hung, Lo, Wei-Chung

    Source: 2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2024 19th International. :397-398 Oct, 2024

    Relation: 2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  7. 7
    Report

    Structural and Magnetic properties of Ge0.5Mn0.5Co2O4 using neutron diffraction

    Authors: Jain, Pooja, Schundelmier, Benny, Wang, Chin-Wei, Yadav, Poonam, Wei, Kaya, Lalla, N. P., Sharma, Shivani

    Subject Terms: Condensed Matter - Strongly Correlated Electrons

    Access URL: http://arxiv.org/abs/2407.01342

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  8. 8
    Conference

    BER Analysis for a MIMO-NOMA System Using QPSK Modulation and Linear MMSE Detection

    Authors: Wang, Chin-Liang, Ding, Yu-Cheng

    Source: 2023 IEEE Globecom Workshops (GC Wkshps) Globecom Workshops (GC Wkshps), 2023 IEEE. :1952-1957 Dec, 2023

    Relation: 2023 IEEE Globecom Workshops (GC Wkshps)

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  9. 9
    Conference

    Advanced Fan-Out Embedded Chip Process Integration for 3D Application

    Authors: Hsiao, Chih-Cheng, Hsu, Chao-Kai, Li, Ching-Iang, Chang, Yung-Sheng, Dai, Ming-Ji, Lo, Feng-Hsiang, Wang, Chin-Hung, Lo, Wei-Chung

    Source: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :181-182 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  10. 10
    Report

    Characterization and enumeration on Lam\'e equations with finite monodromy

    Authors: Chou, You-Cheng, Wang, Chin-Lung, Wu, Po-Sheng

    Subject Terms: Mathematics - Differential Geometry

    Access URL: http://arxiv.org/abs/2402.16286

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  11. 11
    Academic Journal

    Effectiveness of a hybrid, obesity-specific counselling programme in improving medical students’ self-efficacy and motivational interviewing skills for paediatric obesity counselling

    Authors: Wang Chin Eileen Ng, Rachana Koura, Khairunisa Binte Khaider, Chu Shan Elaine Chew, Courtney Davis

    Source: BMC Medical Education, Vol 25, Iss 1, Pp 1-7 (2025)

    Subject Terms: Paediatric obesity, Motivational interviewing, Counselling, Behavioural change, Medical students, Special aspects of education, LC8-6691, Medicine

    File Description: electronic resource

    Relation: https://doaj.org/toc/1472-6920

    Access URL: https://doaj.org/article/0c46155f489e42c28aa2d42f8b6bb1a1

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  12. 12
    Conference

    Design and Development of a Prototype Upper-limb Rehabilitation Robot Based on Multi-body Dynamics Analysis

    Authors: Sung, Hsiu-Hsien, Hsiao, Chih-Kun, Lee, Cheng-Kang, Wang, Chin-Yu

    Source: 2023 9th International Conference on Automation, Robotics and Applications (ICARA) Automation, Robotics and Applications (ICARA), 2023 9th International Conference on. :123-127 Feb, 2023

    Relation: 2023 9th International Conference on Automation, Robotics and Applications (ICARA)

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  13. 13
    Conference

    A Low-Complexity Power Allocation Scheme for MIMO-NOMA Systems With Imperfect Channel Estimation

    Authors: Wang, Chin-Liang, Ding, Yu-Cheng, Wang, Yu-Ching, Xiao, Pei

    Source: 2022 IEEE 33rd Annual International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC) Personal, Indoor and Mobile Radio Communications (PIMRC), 2022 IEEE 33rd Annual International Symposium on. :234-239 Sep, 2022

    Relation: 2022 IEEE 33rd Annual International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC)

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  14. 14
    Report

    Annealing-tunable charge density wave in the kagome antiferromagnet FeGe

    Authors: Wu, Xueliang, Mi, Xinrun, Zhang, Long, Wang, Chin-Wei, Maraytta, Nour, Zhou, Xiaoyuan, He, Mingquan, Merz, Michael, Chai, Yisheng, Wang, Aifeng

    Source: Phys. Rev. Lett. 132, 256501 (2024)

    Subject Terms: Condensed Matter - Strongly Correlated Electrons, Condensed Matter - Materials Science

    Access URL: http://arxiv.org/abs/2308.01291

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  15. 15
    Conference

    Joint Fine Time Synchronization and Channel Estimation Using Deep Learning for Wireless Communication Systems

    Authors: Wang, Chin-Liang, Hsieh, Cheng-Chieh

    Source: 2022 IEEE 95th Vehicular Technology Conference: (VTC2022-Spring) Vehicular Technology Conference (VTC2022-Spring), 2022 IEEE 95th. :1-6 Jun, 2022

    Relation: 2022 IEEE 95th Vehicular Technology Conference (VTC2022-Spring)

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  16. 16
    Conference

    Modeling and Mitigating Fiber Weave Effect Using Layer Equivalent Model and Monte Carlo Method

    Authors: Wang, Chin-Hsun, Lu, Ming-Tsun, Huang, Jun-Rui, Chen, Ching-Sheng, Wu, Ruey-Beei

    Source: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1851-1857 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  17. 17
    Academic Journal

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  18. 18
    Conference

    Proportional-Fairness Resource Allocation Based on Statistical Channel State Information for a Downlink Multicarrier NOMA System

    Authors: Wang, Chin-Liang, Liu, Meng-Hsin, Shen, Yu-Cheng

    Source: 2021 15th International Conference on Signal Processing and Communication Systems (ICSPCS) Signal Processing and Communication Systems (ICSPCS), 2021 15th International Conference on. :1-7 Dec, 2021

    Relation: 2021 15th International Conference on Signal Processing and Communication Systems (ICSPCS)

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  19. 19
    Conference

    Development of a 6-axis Robot Using Multibody Dynamic Software

    Authors: Lan, Lien Tang, Lin, Pang Chieh, Wang, Chin Yu

    Source: 2021 9th International Conference on Control, Mechatronics and Automation (ICCMA) Control, Mechatronics and Automation (ICCMA), 2021 9th International Conference on. :39-45 Nov, 2021

    Relation: 2021 9th International Conference on Control, Mechatronics and Automation (ICCMA)

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  20. 20
    Conference

    Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2 Hybrid Bonding

    Authors: Yang, Shih-Chi, Ong., Jia-Juen, Tran, Dinh-Phuc, Chiu, Wei-Lan, Lee, Ou-Hsing, Chiang, Chia-Wen, Chang, Hsiang-Hung, Wang, Chin-Hung, Chen, Chih

    Source: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :13-14 Apr, 2023

    Relation: 2023 International Conference on Electronics Packaging (ICEP)

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