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1Academic Journal
Authors: Nguyen, C.C., Teh, T., Thai, M.T., Phan, P.T., Hoang, T.T., Davies, J., Phan, H., Wang, C.H., Lovell, N.H., Nho Do, T.
Source: IEEE Transactions on Medical Robotics and Bionics IEEE Trans. Med. Robot. Bionics Medical Robotics and Bionics, IEEE Transactions on. 5(3):590-601 Aug, 2023
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2Academic Journal
Authors: Wang, C.H., Shi, X.M., Yang, H.L., Xi, X.L.
Source: IEEE Transactions on Antennas and Propagation IEEE Trans. Antennas Propagat. Antennas and Propagation, IEEE Transactions on. 71(7):5777-5785 Jul, 2023
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3Conference
Authors: Lin, Y.S., Yang, Cheng Hsun, Wang, C.H., Sou, K.P., Yang, Cheng Hong, Shih, M.C., Hung, W.S., Chuang, W. H., Ciou, F.M., Chiu, P. C., Hsu, C.C., Chen, C.F., Kuo, D.M.
Source: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :2C.4-1-2C.4-6 Apr, 2024
Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)
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4Conference
Authors: Wu, Shien-Yang, Chang, C.H., Chiang, M.C., Lin, C.Y., Liaw, J.J., Cheng, J.Y., Yeh, J.Y., Chen, H.F., Chang, S.Y., Lai, K.T., Liang, M.S., Pan, K.H., Chen, J.H., Chang, V.S., Luo, T.C., Wang, X., Mor, Y.S., Lin, C.I., Wang, S.H., Hsieh, M.Y., Chen, C.Y., Wu, B.F., Lin, C.J., Liang, C.S., Tsao, C.P., Li, C.T., Chen, C.H., Hsieh, C.H., Liu, H.H., Chen, P.N., Chen, C.C., Chen, R., Yeo, Y.C., Chui, C.O., Chang, W., Lee, T.L., Huang, K.B., Lin, H.J., Chen, K.W., Tsai, M.H., Chen, K.S., Chen, X.M., Cheng, Y.K., Wang, C.H., Shue, W., Ku, Y., Jang, S. M., Cao, M., Lu, L.C., Chang, T.S.
Source: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :27.5.1-27.5.4 Dec, 2022
Relation: 2022 IEEE International Electron Devices Meeting (IEDM)
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5Conference
Authors: Chang, Chih-Hao, Chang, V.S., Pan, K.H., Lai, K.T., Lu, J. H., Ng, J.A., Chen, C.Y., Wu, B.F., Lin, C.J., Liang, C.S., Tsao, C.P., Mor, Y.S., Li, C.T., Lin, T.C., Hsieh, C.H., Chen, P.N., Hsu, H.H., Chen, J.H., Chen, H.F., Yeh, J.Y., Chiang, M.C., Lin, C.Y., Liaw, J.J., Wang, C.H., Lee, S.B., Chen, C.C., Lin, H.J., Chen, R., Chen, K.W., Chui, C.O., Yeo, Y.C., Huang, K.B., Lee, T.L., Tsai, M.H., Chen, K.S., Lu, Y.C., Jang, S.M., Wu, S.-Y.
Source: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :27.1.1-27.1.4 Dec, 2022
Relation: 2022 IEEE International Electron Devices Meeting (IEDM)
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6Conference
Authors: Wang, C.H., Pok, P.L., Ng, Y. S., Chung, K.F.
Source: 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) Electronics Manufacturing Technology Conference (IEMT), 2018 IEEE 38th International. :1-4 Sep, 2018
Relation: 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)
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7Conference
Authors: Kouznetsov, Igor, Ramkumar, Krishnaswamy, Prabhakar, Venkatraman, Hinh, Long, Shih, H.M., Saha, S., Govindaswamy, S., Amundson, M., Dalton, D., Phan, T., Luzada, Z., Raghavan, V., Agrawal, V., Donnelly, Kevin, Shih, P.C., Huang, C.C., Lee, K.L., Wang, C.H., Huang, C.H., Lin, C.H., Sheu, Y.K.
Source: 2018 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2018 IEEE International. :1-4 May, 2018
Relation: 2018 IEEE International Memory Workshop (IMW)
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8Academic Journal
Authors: Xu, Hao a, b, Yang, D.S. c, ⁎, Chen, J. a, Wang, C.H. a, d, Yang, Y.B. a, b, e, ⁎⁎
Source: In Engineering Structures 1 June 2024 308
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9Periodical
Authors: Ye, C.C., Wei, W.Q., Fu, X., Wang, C.H., Ru, H.Q.
Source: Ceramics international. 48(4):4851-4857
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10Conference
Authors: Wang, C.H., Gao, L.P., Wang, X.P.
Source: 2015 Seventh International Conference on Measuring Technology and Mechatronics Automation Measuring Technology and Mechatronics Automation (ICMTMA), 2015 Seventh International Conference on. :538-540 Jun, 2015
Relation: 2015 Seventh International Conference on Measuring Technology and Mechatronics Automation (ICMTMA)
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11Academic Journal
Authors: Wang, C.H., Wang, Q., Tang, B.Z., Zhou, X., Ding, D., Xia, L.
Source: In Journal of Magnetism and Magnetic Materials 1 April 2022 547
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12Conference
Authors: Lin, C.H., Cai, S.Y., Chang, F.X., Chu, M.L., Teng, P.K., Chen, A.E., Tsai, P.R., Tsai, Y.W., Wang, C.H., Hsieh, C.W., Duh, T.S., Lee, J.H., Chao, T.C., Dai, S.J., Lee, C.C, Tung, C.J.
Source: 2012 IEEE Nuclear Science Symposium and Medical Imaging Conference Record (NSS/MIC) Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2012 IEEE. :1268-1271 Oct, 2012
Relation: 2012 IEEE Nuclear Science Symposium and Medical Imaging Conference (2012 NSS/MIC)
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13Conference
Authors: Song, Y.T., Wang, C.H., Yang, Q., Zhao, Y.P., Chen, Y., Zhang, X., Li, C., Ji, X., Wang, Z., Mao, X., Zhu, N., Liu, W.
Source: 2011 IEEE/NPSS 24th Symposium on Fusion Engineering Fusion Engineering (SOFE), 2011 IEEE/NPSS 24th Symposium on. :1-5 Jun, 2011
Relation: 2011 IEEE 24th Symposium on Fusion Engineering (SOFE)
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14Academic Journal
Authors: Liu, J., Goel, A., Kua, H.W., Wang, C.H., Peng, Y.H.
Source: In Applied Energy 15 October 2021 300
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15Academic Journal
Authors: Wang, C.H. John, Low, Kin Huat
Source: In Aerospace Science and Technology October 2021 117
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16Academic Journal
Authors: Abbasi, S., Ladani, R.B., Wang, C.H., Mouritz, A.P.
Source: In Composites Part A August 2021 147
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17Academic Journal
Authors: Wang, C.H., Huang, L., Zhong, Y., Tong, X.L., Gu, C.D., Xia, X.H., Zhang, Lingjie, Wang, X.L., Tu, J.P.
Source: In Sustainable Materials and Technologies July 2021 28
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18Conference
Authors: Wang, C.H., Erdogan, A.T., Arslan, T.
Source: 18th International Conference on VLSI Design held jointly with 4th International Conference on Embedded Systems Design VLSI design VLSI Design, 2005. 18th International Conference on. :659-662 2005
Relation: Proceedings. 18th International Conference on VLSI Design
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19Conference
Authors: Mair, H., Wang, E., Wang, A., Kao, P., Tsai, Y., Gururajarao, S., Lagerquist, R., Son, J., Gammie, G., Lin, G., Thippana, A., Li, K., Rahman, M., Kuo, W., Yen, D., Zhuang, Y.-C., Fu, U., Wang, H.-W., Peng, M., Wu, C.-Y., Dosluoglu, T., Gelman, A., Dia, D., Gurumurthy, G., Hsieh, T., Lin, W.X., Tzeng, R., Wu, J., Wang, C.H., Ko, U.
Source: 2017 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2017 IEEE International. :56-57 Feb, 2017
Relation: 2017 IEEE International Solid- State Circuits Conference - (ISSCC)
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20Conference
Authors: Zhang, J.H., Wang, C.H., Pang, A.J., Zeng, J.
Source: Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) High density microsystem design and packaging and component failure analysis High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on. :171-176 2004
Relation: Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)