A Handheld Hydraulic Soft Robotic Device With Bidirectional Bending End-Effector for Minimally Invasive Surgery

Authors: Nguyen, C.C., Teh, T., Thai, M.T., Phan, P.T., Hoang, T.T., Davies, J., Phan, H., Wang, C.H., Lovell, N.H., Nho Do, T.

Source: IEEE Transactions on Medical Robotics and Bionics IEEE Trans. Med. Robot. Bionics Medical Robotics and Bionics, IEEE Transactions on. 5(3):590-601 Aug, 2023

A Flexible Amplitude Equalizing Filter Based on Spoof Surface Plasmon Polaritons

Authors: Wang, C.H., Shi, X.M., Yang, H.L., Xi, X.L.

Source: IEEE Transactions on Antennas and Propagation IEEE Trans. Antennas Propagat. Antennas and Propagation, IEEE Transactions on. 71(7):5777-5785 Jul, 2023

HV-CV Analysis Trapping Behavior in 650V pGaN HEMT with Field Plates for High-Voltage Power Applications

Authors: Lin, Y.S., Yang, Cheng Hsun, Wang, C.H., Sou, K.P., Yang, Cheng Hong, Shih, M.C., Hung, W.S., Chuang, W. H., Ciou, F.M., Chiu, P. C., Hsu, C.C., Chen, C.F., Kuo, D.M.

Source: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :2C.4-1-2C.4-6 Apr, 2024

Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

A 3nm CMOS FinFlex™ Platform Technology with Enhanced Power Efficiency and Performance for Mobile SoC and High Performance Computing Applications

Authors: Wu, Shien-Yang, Chang, C.H., Chiang, M.C., Lin, C.Y., Liaw, J.J., Cheng, J.Y., Yeh, J.Y., Chen, H.F., Chang, S.Y., Lai, K.T., Liang, M.S., Pan, K.H., Chen, J.H., Chang, V.S., Luo, T.C., Wang, X., Mor, Y.S., Lin, C.I., Wang, S.H., Hsieh, M.Y., Chen, C.Y., Wu, B.F., Lin, C.J., Liang, C.S., Tsao, C.P., Li, C.T., Chen, C.H., Hsieh, C.H., Liu, H.H., Chen, P.N., Chen, C.C., Chen, R., Yeo, Y.C., Chui, C.O., Chang, W., Lee, T.L., Huang, K.B., Lin, H.J., Chen, K.W., Tsai, M.H., Chen, K.S., Chen, X.M., Cheng, Y.K., Wang, C.H., Shue, W., Ku, Y., Jang, S. M., Cao, M., Lu, L.C., Chang, T.S.

Source: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :27.5.1-27.5.4 Dec, 2022

Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

Critical Process Features Enabling Aggressive Contacted Gate Pitch Scaling for 3nm CMOS Technology and Beyond

Authors: Chang, Chih-Hao, Chang, V.S., Pan, K.H., Lai, K.T., Lu, J. H., Ng, J.A., Chen, C.Y., Wu, B.F., Lin, C.J., Liang, C.S., Tsao, C.P., Mor, Y.S., Li, C.T., Lin, T.C., Hsieh, C.H., Chen, P.N., Hsu, H.H., Chen, J.H., Chen, H.F., Yeh, J.Y., Chiang, M.C., Lin, C.Y., Liaw, J.J., Wang, C.H., Lee, S.B., Chen, C.C., Lin, H.J., Chen, R., Chen, K.W., Chui, C.O., Yeo, Y.C., Huang, K.B., Lee, T.L., Tsai, M.H., Chen, K.S., Lu, Y.C., Jang, S.M., Wu, S.-Y.

Source: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :27.1.1-27.1.4 Dec, 2022

Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

Laser Pre-cut and Its Effect on the Leadframe Warpage

Authors: Wang, C.H., Pok, P.L., Ng, Y. S., Chung, K.F.

Source: 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) Electronics Manufacturing Technology Conference (IEMT), 2018 IEEE 38th International. :1-4 Sep, 2018

Relation: 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

40 nm Ultralow-Power Charge-Trap Embedded NVM Technology for IoT Applications

Authors: Kouznetsov, Igor, Ramkumar, Krishnaswamy, Prabhakar, Venkatraman, Hinh, Long, Shih, H.M., Saha, S., Govindaswamy, S., Amundson, M., Dalton, D., Phan, T., Luzada, Z., Raghavan, V., Agrawal, V., Donnelly, Kevin, Shih, P.C., Huang, C.C., Lee, K.L., Wang, C.H., Huang, C.H., Lin, C.H., Sheu, Y.K.

Source: 2018 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2018 IEEE International. :1-4 May, 2018

Relation: 2018 IEEE International Memory Workshop (IMW)

Novel recursive formula for removing damping distortion effect on bridge mode shape restoration using a two-axle scanning vehicle

Authors: Xu, Hao ^{a, b}, Yang, D.S. ^{c, ⁎}, Chen, J. ^a, Wang, C.H. ^{a, d}, Yang, Y.B. ^{a, b, e, ⁎⁎}

Source: In Engineering Structures 1 June 2024 308

Effect of sintering activation energy on Si3N4 composite ceramics

Authors: Ye, C.C., Wei, W.Q., Fu, X., Wang, C.H., Ru, H.Q.

Source: Ceramics international. 48(4):4851-4857

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100153013127.0x000001&indx=1&recIds=ETOCvdc_100153013127.0x000001

Identification of Pentostain Isomers

Authors: Wang, C.H., Gao, L.P., Wang, X.P.

Source: 2015 Seventh International Conference on Measuring Technology and Mechatronics Automation Measuring Technology and Mechatronics Automation (ICMTMA), 2015 Seventh International Conference on. :538-540 Jun, 2015

Relation: 2015 Seventh International Conference on Measuring Technology and Mechatronics Automation (ICMTMA)

Achieve good magneto-caloric response near the ambient temperature in a Fe86La7B5Ce2 amorphous ribbon

Authors: Wang, C.H., Wang, Q., Tang, B.Z., Zhou, X., Ding, D., Xia, L.

Source: In Journal of Magnetism and Magnetic Materials 1 April 2022 547

Beam profile monitoring system for proton therapy and Monte Carlo modeling of proton beam lateral development in water in 100–400MeV

Authors: Lin, C.H., Cai, S.Y., Chang, F.X., Chu, M.L., Teng, P.K., Chen, A.E., Tsai, P.R., Tsai, Y.W., Wang, C.H., Hsieh, C.W., Duh, T.S., Lee, J.H., Chao, T.C., Dai, S.J., Lee, C.C, Tung, C.J.

Source: 2012 IEEE Nuclear Science Symposium and Medical Imaging Conference Record (NSS/MIC) Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2012 IEEE. :1268-1271 Oct, 2012

Relation: 2012 IEEE Nuclear Science Symposium and Medical Imaging Conference (2012 NSS/MIC)

Design and modification of EAST new-type ICRF antenna

Authors: Song, Y.T., Wang, C.H., Yang, Q., Zhao, Y.P., Chen, Y., Zhang, X., Li, C., Ji, X., Wang, Z., Mao, X., Zhu, N., Liu, W.

Source: 2011 IEEE/NPSS 24th Symposium on Fusion Engineering Fusion Engineering (SOFE), 2011 IEEE/NPSS 24th Symposium on. :1-5 Jun, 2011

Relation: 2011 IEEE 24th Symposium on Fusion Engineering (SOFE)

Evaluating the urban metabolism sustainability of municipal solid waste management system: An extended exergy accounting and indexing perspective

Authors: Liu, J., Goel, A., Kua, H.W., Wang, C.H., Peng, Y.H.

Source: In Applied Energy 15 October 2021 300

Software-in-the-loop investigation of wake-vortex-encounter-response of identical multirotor pair with PX4 attitude controller

Authors: Wang, C.H. John, Low, Kin Huat

Source: In Aerospace Science and Technology October 2021 117

Improving the delamination fatigue resistance of composites by 3D woven metal and composite Z-filaments

Authors: Abbasi, S., Ladani, R.B., Wang, C.H., Mouritz, A.P.

Source: In Composites Part A August 2021 147

Ti2Nb10O29 anchored on Aspergillus Oryzae spore carbon skeleton for advanced lithium ion storage

Authors: Wang, C.H., Huang, L., Zhong, Y., Tong, X.L., Gu, C.D., Xia, X.H., Zhang, Lingjie, Wang, X.L., Tu, J.P.

Source: In Sustainable Materials and Technologies July 2021 28

Algorithmic implementation of low-power high performance FIR filtering IP cores

Authors: Wang, C.H., Erdogan, A.T., Arslan, T.

Source: 18th International Conference on VLSI Design held jointly with 4th International Conference on Embedded Systems Design VLSI design VLSI Design, 2005. 18th International Conference on. :659-662 2005

Relation: Proceedings. 18th International Conference on VLSI Design

3.4 A 10nm FinFET 2.8GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance

Authors: Mair, H., Wang, E., Wang, A., Kao, P., Tsai, Y., Gururajarao, S., Lagerquist, R., Son, J., Gammie, G., Lin, G., Thippana, A., Li, K., Rahman, M., Kuo, W., Yen, D., Zhuang, Y.-C., Fu, U., Wang, H.-W., Peng, M., Wu, C.-Y., Dosluoglu, T., Gelman, A., Dia, D., Gurumurthy, G., Hsieh, T., Lin, W.X., Tzeng, R., Wu, J., Wang, C.H., Ko, U.

Source: 2017 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2017 IEEE International. :56-57 Feb, 2017

Relation: 2017 IEEE International Solid- State Circuits Conference - (ISSCC)

A low cost bumping method for flip chip assembly and MEMS integration

Authors: Zhang, J.H., Wang, C.H., Pang, A.J., Zeng, J.

Source: Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) High density microsystem design and packaging and component failure analysis High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on. :171-176 2004

Relation: Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)