Transport characterization and quantum dot coupling in commercial 22FDX

Authors: Elbaz, Giselle A., Julliard, Pierre-Louis, Cassé, Mikaël, Niebojewski, Heimanu, Bertrand, Benoit, Roussely, Grégoire, Labracherie, Valentin, Vinet, Maud, Meunier, Tristan, Paz, Bruna Cardoso

Subject Terms: Condensed Matter - Mesoscale and Nanoscale Physics, Quantum Physics

Access URL: http://arxiv.org/abs/2501.10146

Combining multiplexed gate-based readout and isolated CMOS quantum dot arrays

Authors: Hamonic, Pierre, Nurizzo, Martin, Nath, Jayshankar, Dartiailh, Matthieu C., El-Homsy, Victor, Fragnol, Mathis, Martinez, Biel, Julliard, Pierre-Louis, Paz, Bruna Cardoso, Ouvrier-Buffet, Mathilde, Filippini, Jean-Baptiste, Bertrand, Benoit, Niebojewski, Heimanu, Bäuerle, Christopher, Vinet, Maud, Balestro, Franck, Meunier, Tristan, Urdampilleta, Matias

Subject Terms: Condensed Matter - Mesoscale and Nanoscale Physics

Access URL: http://arxiv.org/abs/2410.02325

Extraction of Drain Current Variability Components in Junctionless Nanowire Transistors

Authors: da Silva, Lucas Mota Barbosa, Pavanello, Marcelo Antonio, Casse, Mikael, Barraud, Sylvain, Vinet, Maud, Faynot, Olivier, de Souza, Michelly

Source: 2023 International Conference on Noise and Fluctuations (ICNF) Noise and Fluctuations (ICNF), 2023 International Conference on. :1-4 Oct, 2023

Relation: 2023 International Conference on Noise and Fluctuations (ICNF)

A Cryogenic Active Router for Qubit Array Biasing from DC to 320 MHz at 100 nm Gate Pitch

Authors: Jadot, Baptiste, Zurita, Marcos, Billiot, Gerard, Thonnart, Yvain, Guevel, Loyck Le, Darnas, Mathieu, Thomas, Candice, Charbonnier, Jean, Meunier, Tristan, Vinet, Maud, Badets, Franck, Pillonnet, Gael

Source: ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC) Solid State Circuits Conference (ESSCIRC), ESSCIRC 2023- IEEE 49th European. :157-160 Sep, 2023

Relation: ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC)

Low-field Mobility Degradation Factors Temperature Dependence in Two-level Stacked Nanowire MOSFETs from 120K to 400K

Authors: Rodrigues, Jaime Calcade, Casse, Mikael, Barraud, Sylvain, Vinet, Maud, Faynot, Olivier, Pavanello, Marcelo Antonio

Source: 2023 37th Symposium on Microelectronics Technology and Devices (SBMicro) Microelectronics Technology and Devices (SBMicro), 2023 37th Symposium on. :1-4 Aug, 2023

Relation: 2023 37th Symposium on Microelectronics Technology and Devices (SBMicro)

Experimental Comparison of Junctionless and Inversion-Mode Nanowire MOSFETs Electrical Properties at High Temperatures

Authors: Prates, Rhaycen R., Barraud, Sylvain, Casse, Mikael, Vinet, Maud, Faynot, Olivier, Pavanello, Marcelo A.

Source: 2022 36th Symposium on Microelectronics Technology (SBMICRO) Microelectronics Technology (SBMICRO), 2022 36th Symposium on. :1-4 Aug, 2022

Relation: 2022 36th Symposium on Microelectronics Technology (SBMICRO)

Analysis of Variability in Transconductance and Mobility of Nanowire Transistors

Authors: Barbosa da Silva, Lucas Mota, Pavanello, Marcelo Antonio, Casse, Mikael, Barraud, Sylvain, Vinet, Maud, Faynot, Olivier, de Souza, Michelly

Source: 2022 36th Symposium on Microelectronics Technology (SBMICRO) Microelectronics Technology (SBMICRO), 2022 36th Symposium on. :1-4 Aug, 2022

Relation: 2022 36th Symposium on Microelectronics Technology (SBMICRO)

Analysis of the Gate-Induced Drain Leakage of SOI Nanowire and Nanosheet MOS Transistors at High Temperatures

Authors: de Souza, Michelly, Cerdeira, Antonio, Estrada, Magali, Barraud, Sylvain, Casse, Mikael, Vinet, Maud, Faynot, Olivier, Pavanello, Marcelo A.

Source: 2022 IEEE Latin American Electron Devices Conference (LAEDC) Electron Devices Conference (LAEDC), 2022 IEEE Latin American. :1-4 Jul, 2022

Relation: 2022 IEEE Latin American Electron Devices Conference (LAEDC)

Extraction of the Back Channel Mobility in SOI Nanowire MOS Transistors under Substrate Biasing

Authors: Bergamaschi, Flavio E., Wirth, Gilson I., Barraud, Sylvain, Casse, Mikael, Vinet, Maud, Faynot, Olivier, Pavanello, Marcelo A.

Source: 2022 IEEE Latin American Electron Devices Conference (LAEDC) Electron Devices Conference (LAEDC), 2022 IEEE Latin American. :1-4 Jul, 2022

Relation: 2022 IEEE Latin American Electron Devices Conference (LAEDC)

An Experimental Evaluation of Fin Width and Low-Temperature Influence on GIDL in Stacked SOI Nanowires

Authors: de Souza, Michelly, Rodrigues, Jaime Calcade, Mariniello, Genaro, Casse, Mikael, Barraud, Sylvain, Vinet, Maud, Faynot, Olivier, Pavanello, Marcelo A.

Source: 2022 IEEE 15th Workshop on Low Temperature Electronics (WOLTE) Low Temperature Electronics (WOLTE), 2022 IEEE 15th Workshop on. :1-4 Jun, 2022

Relation: 2022 IEEE 15th Workshop on Low Temperature Electronics (WOLTE)

Electrical characterization and modeling of FDSOI MOSFETs for Cryo-Electronics

Authors: Casse, Mikael, Paz, Bruna Cardoso, Ghibaudo, Gerard, Vinet, Maud

Source: 2022 IEEE 15th Workshop on Low Temperature Electronics (WOLTE) Low Temperature Electronics (WOLTE), 2022 IEEE 15th Workshop on. :1-4 Jun, 2022

Relation: 2022 IEEE 15th Workshop on Low Temperature Electronics (WOLTE)

Broadband parametric amplification for multiplexed SiMOS quantum dot signals

Authors: Elhomsy, Victor, Planat, Luca, Niegemann, David J., Cardoso-Paz, Bruna, Badreldin, Ali, Klemt, Bernhard, Thiney, Vivien, Lethiecq, Renan, Eyraud, Eric, Dartiailh, Matthieu C., Bertrand, Benoit, Niebojewski, Heimanu, Bäuerle, Christopher, Vinet, Maud, Meunier, Tristan, Roch, Nicolas, Urdampilleta, Matias

Subject Terms: Condensed Matter - Mesoscale and Nanoscale Physics

Access URL: http://arxiv.org/abs/2307.14717

Electrical manipulation of a single electron spin in CMOS with micromagnet and spin-valley coupling

Authors: Klemt, Bernhard, El-Homsy, Victor, Nurizzo, Martin, Hamonic, Pierre, Martinez, Biel, Paz, Bruna Cardoso, spence, Cameron, Dartiailh, Matthieu, Jadot, Baptiste, Chanrion, Emmanuel, Thiney, Vivien, Lethiecq, Renan, Bertrand, Benoit, Niebojewski, Heimanu, Bäuerle, Christopher, Vinet, Maud, Niquet, Yann-Michel, Meunier, Tristan, Urdampilleta, Matias

Subject Terms: Condensed Matter - Mesoscale and Nanoscale Physics

Access URL: http://arxiv.org/abs/2303.04960

Experimental Assessment of Variability in Junctionless Nanowire nMOS Transistors

Authors: De Souza, Michelly, Barraud, Sylvain, Casse, Mikael, Vinet, Maud, Faynor, Olivier, Pavanello, Marcelo Antonio

Source: ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2021 - IEEE 51st European. :223-226 Sep, 2021

Relation: ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC)

RF performances at cryogenic temperatures of inductances integrated in a FDSOI technology

Authors: Berlingard, Quentin, Lugo-Alvarez, Jose, Contamin, Lauriane, Durand, Cedric, Galy, Philippe, Juge, Andre, De Franceschi, Silvano, Vinet, Maud, Meunier, Tristan, Casse, Mikael, Gaillard, Fred

Source: 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS) Ultimate Integration on Silicon (EuroSOI-ULIS), 2021 Joint International EUROSOI Workshop and International Conference on. :1-4 Sep, 2021

Relation: 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS)

Performance of Stacked SOI Nanowires in a Wide Temperature Range

Authors: Rodrigues, Jaime C., Mariniello, Genaro, Casse, Mikael, Barraud, Sylvain, Vinet, Maud, Faynot, Olivier, Pavanello, Marcelo A.

Source: 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS) Ultimate Integration on Silicon (EuroSOI-ULIS), 2021 Joint International EUROSOI Workshop and International Conference on. :1-4 Sep, 2021

Relation: 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS)

Temperature Influence on the Electrical Properties of Vertically Stacked Nanowire MOSFETs

Authors: Rodrigues, Jaime C., Mariniello, Genaro, Casse, Mikael, Barraud, Sylvain, Vinet, Maud, Faynot, Olivier, Pavanello, Marcelo A.

Source: 2021 35th Symposium on Microelectronics Technology and Devices (SBMicro) Microelectronics Technology and Devices (SBMicro), 2021 35th Symposium on. :1-4 Aug, 2021

Relation: 2021 35th Symposium on Microelectronics Technology and Devices (SBMicro)

Die-to-Wafer 3D Interconnections Operating at Sub-Kelvin Temperatures for Quantum Computation

Authors: Thomas, Candice, Charbonnier, Jean, Garnier, Arnaud, Bresson, Nicolas, Fournel, Frank, Renet, Sebastien, Franiatte, Remi, David, Nadine, Thiney, Vivien, Urdampilleta, Matias, Meunier, Tristan, Vinet, Maud

Source: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-7 Sep, 2020

Relation: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

Electrostatics and channel coupling on 28 nm FD-SOIfor cryogenic applications

Authors: Paz, Bruna Cardoso, Casse, Mikael, Haendler, Sebastien, Juge, Andre, Vincent, Emmanuel, Galy, Philippe, Arnaud, Franck, Ghibaudo, Gerard, Vinet, Maud, de Franceschi, Silvano, Meunier, Tristan, Gaillard, Fred

Source: 2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) Ultimate Integration on Silicon (EUROSOI-ULIS), 2020 Joint International EUROSOI Workshop and International Conference on. :1-4 Sep, 2020

Relation: 2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)

Evaluation of Analog Characteristics of n-Type Vertically Stacked Nanowires

Authors: Mariniello, Genaro, Barraud, Sylvain, Vinet, Maud, Faynot, Olivier, Paz, Bruna Cardoso, Pavanello, Marcelo Antonio

Source: 2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) Ultimate Integration on Silicon (EUROSOI-ULIS), 2020 Joint International EUROSOI Workshop and International Conference on. :1-4 Sep, 2020

Relation: 2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)