Compute SNDR-Boosted 22-nm MRAM-Based In-Memory Computing Macro Using Statistical Error Compensation

Authors: Roy, S.K., Ou, H., Ahmed, M.G., Deaville, P., Zhang, B., Verma, N., Hanumolu, P.K., Shanbhag, N.R.

Source: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 60(3):1092-1102 Mar, 2025

A Fully Row/Column-Parallel In-Memory Computing Macro in Foundry MRAM With Differential Readout for Noise Rejection

Authors: Deaville, P., Zhang, B., Verma, N.

Source: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 59(7):2070-2080 Jul, 2024

Design and Characterization of High Quality-Factor Inductors for Wireless Systems Compatible With Flexible Large-Area Electronics

Authors: Ma, Y., Wagner, S., Verma, N., Sturm, J.C.

Source: IEEE Journal on Flexible Electronics IEEE Flex. Electron. Flexible Electronics, IEEE Journal on. 3(6):234-241 Jun, 2024

Computational Prediction of Potential Vaccine Candidates From tRNA Encoded peptides (tREP) Using a Bioinformatic Workflow and Molecular Dynamics Validations

Authors: Shanthappa, P.M., Verma, N., George, A., Dhar, P.K., Athri, P.

Source: IEEE/ACM Transactions on Computational Biology and Bioinformatics IEEE/ACM Trans. Comput. Biol. and Bioinf. Computational Biology and Bioinformatics, IEEE/ACM Transactions on. 21(3):439-449 Jun, 2024

A Monolithically Integrable Reconfigurable Antenna Based on Large-Area Electronics

Authors: Wu, C., Ma, Y., Venkatesh, S., Mehlman, Y., Ozatay, M., Wagner, S., Sturm, J.C., Verma, N.

Source: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 59(5):1475-1485 May, 2024

Training Neural Networks With In-Memory-Computing Hardware and Multi-Level Radix-4 Inputs

Authors: Grimm, C., Lee, J., Verma, N.

Source: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 71(4):1781-1793 Apr, 2024

An IoT and Blockchain-Based Secure and Transparent Supply Chain Management Framework in Smart Cities Using Optimal Queue Model

Authors: Ahmad, A.Y.A.B., Verma, N., Sarhan, N.M., Awwad, E.M., Arora, A., Nyangaresi, V.O.

Source: IEEE Access Access, IEEE. 12:51752-51771 2024

Piezoelectric Soft Robot Inchworm Motion by Tuning Ground Friction Through Robot Shape: Quasi-Static Modeling and Experimental Validation

Authors: Zheng, Z., Kumar, P., Chen, Y., Cheng, H., Wagner, S., Chen, M., Verma, N., Sturm, J.C.

Source: IEEE Transactions on Robotics IEEE Trans. Robot. Robotics, IEEE Transactions on. 40:2339-2356 2024

Guest Editorial: Special Issue on Artificial Intelligence Methods for Maintenance and Safety of Automation Systems

Authors: Chen, H., Luo, H., Verma, N., Jiang, B.

Source: IEEE Transactions on Artificial Intelligence IEEE Trans. Artif. Intell. Artificial Intelligence, IEEE Transactions on. 4(4):589-591 Aug, 2023

Developing a novel assistive technology, empowering the deaf to speak, using visual feedback.

Authors: Singh S, Nagarajan K, Chachan R, Pandey P, Vijayalakshmi P, Verma N, Singh A

Source: Journal of Otology, Vol 20, Iss 1, Pp 12-19 (2025)

Subject Terms: deafness, sign language, cochlear implants, speech to text, deaf rehabilitation, deaf speech, Otorhinolaryngology, RF1-547

File Description: electronic resource

Relation: https://www.sciopen.com/article/10.26599/JOTO.2025.9540003; https://doaj.org/toc/1672-2930

Access URL: https://doaj.org/article/5dc593f6711a492abe9f5b5b5a158afc

The Future of Flexible Electronic Technology [Speaker’s Corner]

Authors: Wagner, S., Sturm, J.C., Verma, N.

Source: IEEE Electron Devices Magazine IEEE Electron Devices Mag. Electron Devices Magazine, IEEE. 2(2):7-7 Jun, 2024

Neural Network Training on In-Memory-Computing Hardware With Radix-4 Gradients

Authors: Grimm, C., Verma, N.

Source: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 69(10):4056-4068 Oct, 2022

An Approach Towards the Design of Interval Type-3 T–S Fuzzy System

Authors: Singh, D., Verma, N., Ghosh, A., Malagaudanavar, A.

Source: IEEE Transactions on Fuzzy Systems IEEE Trans. Fuzzy Syst. Fuzzy Systems, IEEE Transactions on. 30(9):3880-3893 Sep, 2022

Convolutional Autoencoder-Based Transfer Learning for Multi-Task Image Inferences

Authors: Lu, J., Verma, N., Jha, N.K.

Source: IEEE Transactions on Emerging Topics in Computing IEEE Trans. Emerg. Topics Comput. Emerging Topics in Computing, IEEE Transactions on. 10(2):1045-1057 Jun, 2022

A Disturbance Observer-Based Intelligent Finite-Time Sliding Mode Flight Controller Design for an Autonomous Quadrotor

Authors: Tripathi, V.K., Yogi, S.C., Kamath, A.K., Behera, L., K. Verma, N., Nahavandi, S.

Source: IEEE Systems Journal Systems Journal, IEEE. 16(1):1649-1660 Mar, 2022

Device, Circuit, and System Design for Enabling Giga-Hertz Large-Area Electronics

Authors: Ma, Y., Wu, C., Fata, N.M., Kumar, P., Wagner, S., Sturm, J.C., Verma, N.

Source: IEEE Open Journal of the Solid-State Circuits Society IEEE Open J. Solid-State Circuits Soc. Solid-State Circuits Society, IEEE Open Journal of the. 2:177-192 2022

Scalable and Programmable Neural Network Inference Accelerator Based on In-Memory Computing

Authors: Jia, H., Ozatay, M., Tang, Y., Valavi, H., Pathak, R., Lee, J., Verma, N.

Source: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 57(1):198-211 Jan, 2022

Femtosecond and Nanosecond Laser Structuring of Crystalline Silicon Surface by Soft Ablation: Morphology and Optical Properties

Authors: Verma, N., Anoop, K. K., Joy, N., Philip, R.

Source: 2022 IEEE International Conference on Plasma Science (ICOPS) Plasma Science (ICOPS), 2022 IEEE International Conference on. :1-2 May, 2022

Relation: 2022 IEEE International Conference on Plasma Science (ICOPS)

Neural Network Training With Stochastic Hardware Models and Software Abstractions

Authors: Zhang, B., Chen, L., Verma, N.

Source: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 68(4):1532-1542 Apr, 2021

A Novel Wearable Device for Continuous Temperature Monitoring & Fever Detection

Authors: Verma, N., Haji-Abolhassani, I., Ganesh, S., Vera-Aguilera, J., Paludo, J., Heitz, R., Markovic, S.N., Kulig, K., Ghoreyshi, A.

Source: IEEE Journal of Translational Engineering in Health and Medicine IEEE J. Transl. Eng. Health Med. Translational Engineering in Health and Medicine, IEEE Journal of. 9:1-7 2021