Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications

Authors: Dwarakanath, S., Bhaskar, P., Kanno, K., Nimbalkar, P.C., Kathaperumal, M., Raj Pulugurtha, M., Swaminathan, M., Tummala, R.R.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 15(1):131-139 Jan, 2025

Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer

Authors: Park, G., Kim, Y., Cho, K., Park, J., Hwang, I., Kim, J., Son, K., Park, H., Watanabe, A.O., Raj, P.M., Tummala, R.R.

Source: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 63(5):1562-1573 Oct, 2021

Laminated Glass-Based, Compact Inline Stepped-Impedance Resonator Bandpass Filters for 5G New Radio Modules

Authors: Ali, M., Huang, K., Swaminathan, M., Raj, P.M., Tummala, R.R.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(4):708-711 Apr, 2021

A Review of 5G Front-End Systems Package Integration

Authors: Watanabe, A.O., Ali, M., Sayeed, S.Y.B., Tummala, R.R., Pulugurtha, M.R.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(1):118-133 Jan, 2021

Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias

Authors: Watanabe, A.O., Lin, T., Ali, M., Wang, Y., Smet, V., Raj, P.M., Tentzeris, M.M., Tummala, R.R., Swaminathan, M.

Source: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 68(12):5082-5092 Dec, 2020

Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure

Authors: Kim, Y., Park, G., Cho, K., Raj, P.M., Tummala, R.R., Kim, J.

Source: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 68(12):5055-5064 Dec, 2020

Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications

Authors: Lin, T., Kanno, K., Watanabe, A.O., Raj, P.M., Tummala, R.R., Swaminathan, M., Tentzeris, M.M.

Source: IEEE Antennas and Wireless Propagation Letters Antennas Wirel. Propag. Lett. Antennas and Wireless Propagation Letters, IEEE. 19(11):1963-1967 Nov, 2020

Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands

Authors: Ali, M., Watanabe, A.O., Lin, T., Okamoto, D., Pulugurtha, M.R., Tentzeris, M.M., Tummala, R.R.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(9):1515-1523 Sep, 2020

Reliability of Fine-Pitch μm-Diameter Microvias for High-Density Interconnects

Authors: Dwarakanath, S., Kakutani, T., Okamoto, D., Raj, P.M., Swaminathan, M., Tummala, R.R.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(9):1552-1559 Sep, 2020

Smaller Microvias for Packaging Interconnects by Picosecond UV Laser With a Nanometer Metal Barrier Layer: A Feasibility Study

Authors: Liu, F., Zhang, R., Khurana, G., Deprospo, B.H., Tummala, R.R., Swaminathan, M.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(8):1411-1418 Aug, 2020

Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages

Authors: Watanabe, A.O., Ito, H., Markondeya, R.P., Tummala, R.R., Swaminathan, M.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(5):870-877 May, 2020

An Advanced Photosensitive Dielectric Material for High-Density RDL with Ultra-Small Photo-Vias and Ultra-Fine Line/Space in 2.5D Interposers and Fan-Out Packages

Authors: Okamoto, D., Shibasaki, Y., Shibata, D., Hanada, T., Liu, F., Sundaram, V., Tummala, R.R.

Source: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1543-1548 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

Cointegration of Single-Mode Waveguides and Embedded Electrical Interconnects for High-Bandwidth Communications

Authors: Zhang, R., Liu, F., Kathaperumal, M., Swaminathan, M., Tummala, R.R.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(3):393-399 Mar, 2020

Innovative Sub-5- $\mu$ m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects

Authors: Liu, F., Khurana, G., Zhang, R., Watanabe, A., DeProspo, B.H., Nair, C., Tummala, R.R., Swaminathan, M.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(10):2016-2023 Oct, 2019

Low-Cost 1- $\mu$ m Photolithography Technologies for Large-Body-Size, Low-Resistance Panel-Based RDL

Authors: Liu, F., Nair, C., Ito, H., DeProspo, B.H., Ravichandran, S., Akimaru, H., Hasegawa, K., Tummala, R.R.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(7):1426-1433 Jul, 2019

Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications

Authors: Watanabe, A.O., Tehrani, B.K., Ogawa, T., Raj, P.M., Tentzeris, M.M., Tummala, R.R.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(3):531-533 Mar, 2020

Organic Damascene Process for 1.5- $\mu$ m Panel-Scale Redistribution Layer Technology Using 5- $\mu$ m-Thick Dry Film Photosensitive Dielectrics

Authors: Liu, F., Nair, C., Kubo, A., Ando, T., Wei, F., Sundaram, V., Tummala, R.R.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 8(5):792-801 May, 2018

Ultrathin High- $Q$ 2-D and 3-D RF Inductors in Glass Packages

Authors: Kim, M.S., Pulugurtha, M.R., Sundaram, V., Tummala, R.R., Yun, H.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 8(4):643-652 Apr, 2018

Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling

Authors: Kim, Y., Cho, J., Cho, K., Park, J., Kim, S., Kim, D., Park, G., Sitaraman, S., Raj, P.M., Tummala, R.R., Kim, J.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(9):1493-1505 Sep, 2017

Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules

Authors: Sitaraman, S., Sukumaran, V., Pulugurtha, M.R., Wu, Z., Suzuki, Y., Kim, Y., Sundaram, V., Kim, J., Tummala, R.R.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(9):1410-1418 Sep, 2017