Front-side metallization of silane-compoundmodified Si by electroless deposition of Ni(P) and interfacial characterizations

Authors: Kuei-Chang Lai, Pei-Yu Wu, Tzu-Chien Wei, Tseng-Chieh Pan, Chih-Ming Chen

Source: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :337-340 Apr, 2016

Relation: 2016 International Conference on Electronics Packaging (ICEP)