BEOL-Compatible Non-Volatile Capacitive Synapse with ALD W-Doped In2O3 Semiconductor Layer

Authors: Lee, Junmo, Zhang, Chengyang, Shon, Minji, Read, James, Deng, Sunbin, Phadke, Omkar, Venkatesan Ravindran, Prasanna, Tian, Mengkun, Luo, Yuan-Chun, Kim, Tae-Hyeon, Khan, Asif Islam, Datta, Suman, Yu, Shimeng

Source: 2024 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2024 IEEE International. :1-4 Dec, 2024

Relation: 2024 IEEE International Electron Devices Meeting (IEDM)

First Demonstration of W-Doped In2O3 Gate-All-Around (GAA) Nanosheet FET with Improved Performance and Record Threshold Voltage Stability

Authors: Sarkar, Eknath, Zhang, Chengyang, Chakraborty, Dyutimoy, Waqar, Faaiq G, Kirtania, Sharadindugopal, Aabrar, Khandker Akif, Park, Hyeonwoo, Shin, Jaewon, Tian, Mengkun, Khan, Asif I, Yu, Shimeng, Datta, Suman

Source: 2024 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2024 IEEE International. :1-4 Dec, 2024

Relation: 2024 IEEE International Electron Devices Meeting (IEDM)

Self-Healing Ferroelectric Capacitors with ∼ 1000x Endurance Improvement at High Temperatures (85–125°C)

Authors: Afroze, Nashrah, Padovani, Andrea, Choi, Jihoon, Ravikumar, Priyankka Gundlapudi, Kuo, Yu-Hsin, Zhang, Chengyang, Song, Taeyoung, Tian, Mengkun, Sarkar, Eknath, Noor, Manifa, Ravindran, Prasanna Venkatesan, Aabrar, Khandker Akif, Yildiz, Bilge, Mahapatra, Souvik, Kummel, Andrew, Cho, Kyeongjae, Yu, Shimeng, Datta, Suman, Lee, Jun Hee, Larcher, Luca, Thareja, Gaurav, Khan, Asif

Source: 2024 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2024 IEEE International. :1-4 Dec, 2024

Relation: 2024 IEEE International Electron Devices Meeting (IEDM)

Impact of Non-Coplanarities on Microstructure and Properties of Sintered NP-Cu Interconnections

Authors: Amirnasiri, Ali, Sosa, Ramon A., Tian, Mengkun, Antoniou, Antonia, Smet, Vanessa

Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2298-2303 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Design Framework for Ferroelectric Gate Stack Engineering of Vertical NAND Structures for Efficient TLC and QLC Operation

Authors: Das, Dipjyoti, Fernandes, Lance, Ravindran, Prasanna Venkatesan, Song, Taeyoung, Park, Chinsung, Afroze, Nashrah, Tian, Mengkun, Chen, Hang, Chem, Winston, Kim, Kijoon, Woo, Jongho, Lim, Suhwan, Kim, Kwangsoo, Kim, Wanki, Ha, Daewon, Yu, Shimeng, Datta, Suman, Khan, Asif

Source: 2024 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2024 IEEE International. :1-4 May, 2024

Relation: 2024 IEEE International Memory Workshop (IMW)

Comprehensive Time Dependent Dielectric Breakdown (TDDB) Characterization of Ferroelectric Capacitors Under Bipolar Stress Conditions

Authors: Ravikumar, Priyankka Gundlapudi, Ravindran, Prasanna Venkatesan, Aabrar, Khandker Akif, Song, Taeyoung, Kirtania, Sharadindu Gopal, Das, Dipjyoti, Park, Chinsung, Afroze, Nashrah, Tian, Mengkun, Yu, Shimeng, Islam, Ahmad Ehtesham, Datta, Suman, Mahapatra, Souvik, Khan, Asif

Source: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :1-5 Apr, 2024

Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

Ion-Assisted Nanoscale Material Engineering in Atomic Layers

Authors: Taghinejad, Hossein, Taghinejad, Mohammad, Abdollahramezani, Sajjad, Li, Qitong, Woods, Eric V., Tian, Mengkun, Eftekhar, Ali A., Lyu, Yuanqi, Zhang, Xiang, Ajayan, Pulickel M., Cai, Wenshan, Brongersma, Mark L., Analytis, James G., Adibi, Ali

Subject Terms: Condensed Matter - Materials Science, Condensed Matter - Mesoscale and Nanoscale Physics, Physics - Applied Physics

Access URL: http://arxiv.org/abs/2410.06181

Experimental demonstration and modeling of a ferroelectric gate stack with a tunnel dielectric insert for NAND applications

Authors: Das, Dipjyoti, Park, Hyeonwoo, Wang, Zekai, Zhang, Chengyang, Ravindran, Prasanna Venkatesan, Park, Chinsung, Afroze, Nashrah, Hsu, Po-Kai, Tian, Mengkun, Chen, Hang, Chern, Winston, Lim, Suhwan, Kim, Kwangsoo, Kim, Kijoon, Kim, Wanki, Ha, Daewon, Yu, Shimeng, Datta, Suman, Khan, Asif

Source: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

Ferroelectric Gate Stack Engineering with Tunnel Dielectric Insert for Achieving High MemoryWindow in FEFETs for NAND Applications

Authors: Das, Dipjyoti, Park, Hyeonwoo, Wang, Zekai, Zhang, Chengyang, Ravindran, Prasanna Venkatesan, Park, Chinsung, Afroze, Nashrah, Hsu, Po-Kai, Tian, Mengkun, Chen, Hang, Chern, Winston, Lim, Suhwan, Kim, Kwangsoo, Kim, Kijoon, Kim, Wanki, Ha, Daewon, Yu, Shimeng, Datta, Suman, Khan, Asif

Source: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024

Relation: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

Discovering the nanoscale origins of localized corrosion in additive manufactured stainless steel 316L by in situ liquid cell TEM

Authors: Tian, Mengkun, Choundraj, Jahnavi Desai, Voisin, Thomas, Wang, Y. Morris, Kacher, Josh

Subject Terms: Condensed Matter - Materials Science

Access URL: http://arxiv.org/abs/2112.08263

Antiferroelectric negative capacitance from a structural phase transition in zirconia

Authors: Hoffmann, Michael, Wang, Zheng, Tasneem, Nujhat, Zubair, Ahmad, Ravindran, Prasanna Venkat, Tian, Mengkun, Gaskell, Anthony, Triyoso, Dina, Consiglio, Steven, Tapily, Kanda, Clark, Robert, Hur, Jae, Pentapati, Sai Surya Kiran, Dopita, Milan, Yu, Shimeng, Chern, Winston, Kacher, Josh, Reyes-Lillo, Sebastian E., Antoniadis, Dimitri, Ravichandran, Jayakanth, Slesazeck, Stefan, Mikolajick, Thomas, Khan, Asif Islam

Subject Terms: Condensed Matter - Materials Science, Physics - Applied Physics

Access URL: http://arxiv.org/abs/2104.10811

Quantitative Raman and x-ray photoelectron spectroscopy of mixed-phase indium selenide films.

Authors: Voigt, Cooper A.¹ (AUTHOR), Tian, Mengkun¹ (AUTHOR), Peacock, Ryan¹ (AUTHOR), Wagner, Brent K.² (AUTHOR), Vogel, Eric M.¹ (AUTHOR) eric.vogel@mse.gatech.edu

Source: Journal of Applied Physics. 6/7/2024, Vol. 135 Issue 21, p1-9. 9p.

Subject Terms: *INDIUM selenide, *RAMAN scattering, *THIN films

Structural and electrochemical evolution of alloy interfacial layers in anode-free solid-state batteries

Authors: Sandoval, Stephanie Elizabeth, Lewis, John A., Vishnugopi, Bairav S., Nelson, Douglas Lars, Schneider, Matthew M., Cortes, Francisco Javier Quintero, Matthews, Christopher M., Watt, John, Tian, Mengkun, Shevchenko, Pavel, Mukherjee, Partha P., McDowell, Matthew T.

Source: In Joule 20 September 2023 7(9):2054-2073

Discovering the nanoscale origins of localized corrosion in additive manufactured stainless steel 316L by liquid cell transmission electron microscopy

Authors: Tian, Mengkun, Choundraj, Jahnavi Desai, Voisin, Thomas, Wang, Y. Morris, Kacher, Josh

Source: In Corrosion Science November 2022 208

Ultrastable Gold Nanostars via Bottlebrush-like Block Copolymers.

Authors: Choi, Woosung, Liu, Haihua, Tian, Mengkun, Zhang, Mingyue, Liu, Fan, Gage, Thomas E., Arslan, Ilke, Tsukruk, Vladimir V., Lin, Zhiqun

Source: ACS Applied Materials & Interfaces; 4/2/2025, Vol. 17 Issue 13, p20138-20148, 11p

Controlling the Surface Oxidation of Cu Nanowires Improves Their Catalytic Selectivity and Stability toward C2+ Products in CO2 Reduction

Authors: Lyu, Zhiheng, Zhu, Shangqian, Xie, Minghao, Zhang, Yu, Chen, Zitao, Chen, Ruhui, Tian, Mengkun, Chi, Miaofang, Shao, Minhua, Xia, Younan

Source: Angewandte Chemie. 133(4):1937-1943

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100124251387.0x000001&indx=1&recIds=ETOCvdc_100124251387.0x000001

Polymer-Ligated Uniform Lead Chalcogenide Nanoparticles with Tunable Size and Robust Stability Enabled by Judiciously Designed Surface Chemistry

Authors: Liang, Shuang, Zhang, Mingyue, He, Yanjie, Kang, Zhitao, Tian, Mengkun, Zhang, Meng, Miao, Han, Lin, Zhiqun

Source: Chemistry of materials. 33(17):6701-6712

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN632522690&indx=1&recIds=ETOCRN632522690

In Situ Dynamics during Heating of Copper-Intercalated Bismuth Telluride

Authors: Shetty, Pralav P., Kondekar, Neha, Thenuwara, Akila C., Boebinger, Matthew G., Wright, Salem C., Tian, Mengkun, McDowell, Matthew T.

Source: In Matter 7 October 2020 3(4):1246-1262

Accelerated Short Circuiting in Anode‐Free Solid‐State Batteries Driven by Local Lithium Depletion

Authors: Lewis, John A., Sandoval, Stephanie E., Liu, Yuhgene, Nelson, Douglas Lars, Yoon, Sun Geun, Wang, Runzi, Zhao, Ying, Tian, Mengkun, Shevchenko, Pavel, Martínez‐Pañeda, Emilio, McDowell, Matthew T.

Source: Advanced energy materials. 13(12)

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100181453084.0x000001&indx=1&recIds=ETOCvdc_100181453084.0x000001

Ferrielectricity in the Archetypal Antiferroelectric, PbZrO3

Authors: Yao, Yulian, Naden, Aaron, Tian, Mengkun, Lisenkov, Sergey, Beller, Zachary, Kumar, Amit, Kacher, Josh, Ponomareva, Inna, Bassiri‐Gharb, Nazanin

Source: Advanced materials. 35(3)

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100171655146.0x000001&indx=1&recIds=ETOCvdc_100171655146.0x000001