Research on TOC Sensor Based on Lock-in Amplifier

Authors: Fu, Shimin, Li, Zhiyong, Chen, Lijie

Source: 2024 IEEE 4th International Conference on Information Technology, Big Data and Artificial Intelligence (ICIBA) Information Technology, Big Data and Artificial Intelligence (ICIBA), 2024 IEEE 4th International Conference on. 4:712-715 Dec, 2024

Relation: 2024 IEEE 4th International Conference on Information Technology, Big Data and Artificial Intelligence (ICIBA)

High-Precision Dual-Channel TEC Temperature Controller for LiDAR Doppler Vibrometry System

Authors: Ming, Zixuan, Wang, Yanyi, Song, Yingxiong, Chen, Jian, Zhang, Qianwu, Zhang, Junjie

Source: 2024 Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC) Information Photonics and Optical Communications (IPOC), 2024 Asia Communications and Photonics Conference (ACP) and International Conference on. :1-5 Nov, 2024

Relation: 2024 Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC)

Experimental Demonstration of an Advanced Package-Integrated Thin-Film Thermoelectric Cooler for on-Chip Cooling

Authors: Gong, Tingrui, Shi, Maolin, Su, Wei

Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

Study on a Dual-Function Thermoelectric Cooler-Thermoelectric Generator System

Authors: Li, Rixiong, Tang, Min, Li, Longfei

Source: 2024 IEEE 7th International Conference on Electronic Information and Communication Technology (ICEICT) Electronic Information and Communication Technology (ICEICT), 2024 IEEE 7th International Conference on. :416-418 Jul, 2024

Relation: 2024 IEEE 7th International Conference on Electronic Information and Communication Technology (ICEICT)

Modelling and Optimization of a Wearable Thermoelectric Cooler

Authors: Zhang, Yuzhen, Kassanos, Panagiotis

Source: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2024 IEEE International Conference on. :1-4 Jun, 2024

Relation: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

Numerical modelling and control of electric two-wheeler battery thermal management system with thermoelectric coolers

Authors: Bhattacharyya, Sankhadeep, Dinh, Truong, McGordon, Andrew

Source: 2024 IEEE Transportation Electrification Conference and Expo (ITEC) Transportation Electrification Conference and Expo (ITEC), 2024 IEEE. :1-6 Jun, 2024

Relation: 2024 IEEE Transportation Electrification Conference and Expo (ITEC)

The application of thermoelectric cooler in edge computing servers

Authors: Wang, Yongguang, Sun, Bo, Fu, Changzhao, Liu, Xiangnan

Source: 2024 IEEE 4th International Conference on Power, Electronics and Computer Applications (ICPECA) Power, Electronics and Computer Applications (ICPECA), 2024 IEEE 4th International Conference on. :721-725 Jan, 2024

Relation: 2024 IEEE 4th International Conference on Power, Electronics and Computer Applications (ICPECA)

A Compact Temperature Controller for MEMS Vibratory Gyroscopes Using Thermoelectric Cooler

Authors: Wang, Z., Zhou, Y., Jiang, B., Zhang, J., Zhou, T., Su, Y.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(6):3888-3894 Jun, 2024

Dynamic Thermal Management in SOI Transistors Using Holey Silicon-Based Thermoelectric Cooling

Authors: Luo, J., Lim, J., Chen, J., Venugopal, A., Ren, Z., Lee, J.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(4):2577-2584 Apr, 2024

A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging

Authors: Hu, S., Song, J., Liu, Y., Wu, C., Lei, T., Ge, A., Zhang, D., Zhao, X., Huo, Y., Lee, C.C.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(2):328-341 Feb, 2024

A Shutter-Less Nonuniformity Correction Algorithm Based on Noise Response Model for TEC-Less Uncooled Infrared Sensors

Authors: Zhou, Y., Li, X., Tang, X., Zhou, J., Li, L.

Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(2):1200-1213 Jan, 2024

Design of a Novel PID Controller Based on Machine Learning Algorithm for a Micro-Thermoelectric Cooler of the Polymerase Chain Reaction Device

Authors: Arikusu, Y.S., Bayhan, N.

Source: IEEE Access Access, IEEE. 12:61959-61977 2024

Thermoelectric Cooler Modeling and Optimization via Surrogate Modeling Using Implicit Physics-Constrained Neural Networks

Authors: Chen, L., Jin, W., Zhang, J., Tan, S.X.-.

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 42(11):4090-4101 Nov, 2023

Design of Temperature Control System of Photodetector Based on ADN8831

Authors: Tang, Yajie, Li, Xisheng, You, Jia, Hong, Ran

Source: 2022 4th International Conference on Control and Robotics (ICCR) Control and Robotics (ICCR), 2022 4th International Conference on. :141-145 Dec, 2022

Relation: 2022 4th International Conference on Control and Robotics (ICCR)

Effect of transmissivity on PV module glass for PVT-TEC air collector

Authors: Singh, Ajay Pratap, Tiwari, Sumit, Sahdev, Ravinder Kumar, Harender, Tiwari, Prabhakar

Source: 2022 International Conference on Computational Modelling, Simulation and Optimization (ICCMSO) ICCMSO Computational Modelling, Simulation and Optimization (ICCMSO), 2022 International Conference on. :401-406 Dec, 2022

Relation: 2022 International Conference on Computational Modelling, Simulation and Optimization (ICCMSO)

A Detailed Review on Battery Cooling Systems for Electric Vehicles

Authors: Tirkey, Prashant, Pandey, Rahul Kumar, Kumar, Sunil, Mahto, Jitendra Nath

Source: 2022 1st IEEE International Conference on Industrial Electronics: Developments & Applications (ICIDeA) Industrial Electronics: Developments & Applications (ICIDeA), 2022 1st IEEE International Conference on-. :45-50 Oct, 2022

Relation: 2022 1st IEEE International Conference on Industrial Electronics: Developments & Applications (ICIDeA)

Intelligent Design and Tuning Method for Embedded Thermoelectric Cooler (TEC) in 3-D Integrated Microsystems

Authors: Zhang, P., Wang, D., Zhao, W., You, B., Liu, J., Qian, C., Xu, H.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(6):788-797 Jun, 2023

Design Optimization of Micro-Thermoelectric Cooler for Thermal Management using Finite Element Simulations

Authors: Kaur, Rajvinder, Tanwar, Amit, Gupta, Parnika, Padmanathan, N., O'Brien, Peter, Razeeb, Kafil M.

Source: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-6 Sep, 2022

Relation: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Temperature Control System of Thermoelectric Cooler Based on Improved ADRC

Authors: Shan, Xiyuan, Cai, Tao, Zong, Zhicheng, Mu, Hongbo

Source: 2022 34th Chinese Control and Decision Conference (CCDC) Control and Decision Conference (CCDC), 2022 34th Chinese. :3852-3857 Aug, 2022

Relation: 2022 34th Chinese Control and Decision Conference (CCDC)

Optimization and fabrication of an in-plane radial thin-film thermoelectric cooler for chip hotspot cooling

Authors: Gong, Tingrui, Li, Lianghui, Shi, Maolin, Gao, Lei, Li, Juntao

Source: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)