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1Academic Journal
Source: IEEE Solid-State Circuits Letters IEEE Solid-State Circuits Lett. Solid-State Circuits Letters, IEEE. 4:100-103 2021
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2Academic Journal
Authors: Teh, Y., Hargrove, L.J.
Source: IEEE Transactions on Neural Systems and Rehabilitation Engineering IEEE Trans. Neural Syst. Rehabil. Eng. Neural Systems and Rehabilitation Engineering, IEEE Transactions on. 28(7):1605-1613 Jul, 2020
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3Academic Journal
Authors: Wan, Q., Teh, Y., Gao, Y., Mok, P.K.T.
Source: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 64(9):2346-2358 Sep, 2017
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4Academic Journal
Authors: Kwan, A. M. H., Song, S., Lu, X., Lu, L., Teh, Y.-K., Teh, Y.-F., Chong, E. W. C., Gao, Y., Hau, W., Zeng, F., Wong, M., Huang, C., Taniyama, A., Makino, Y., Nishino, S., Tsuchiya, T., Tabata, O.
Source: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 21(3):586-595 Jun, 2012
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5Conference
Authors: Hong, P. K., Low, K. M., Moo, S. Y., Teh, Y. C.
Source: Materials science forum. 981:196-201
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6Conference
Authors: Wu, Xusheng, Hu, Y., Kusunoki, N., Yang, Z. J., Yang, G., Teh, Y., Kirshnan, R., Krishnan, S., Shepard, J., Han, S., Lee, Y., Arnaud, F., Sherony, M., Sudijono, J., Steegen, A.
Source: 2010 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC) Electron Devices and Solid-State Circuits (EDSSC), 2010 IEEE International Conference of. :1-4 Dec, 2010
Relation: 2010 IEEE International Conference of Electron Devices and Solid- State Circuits (EDSSC)
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7Academic Journal
Authors: Teh, Y.-K., Mok, P. K. T.
Source: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 49(11):2694-2704 Nov, 2014
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8Academic Journal
Authors: Teh, Y.-K., Mok, P. K. T.
Source: IEEE Journal on Emerging and Selected Topics in Circuits and Systems IEEE J. Emerg. Sel. Topics Circuits Syst. Emerging and Selected Topics in Circuits and Systems, IEEE Journal on. 4(3):313-323 Sep, 2014
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9Conference
Authors: Steegen, A., Mo, R., Mann, R., Sun, M.-C., Eller, M., Leake, G., Vietzke, D., Tilke, A., Guarin, F., Fischer, A., Pompl, T., Massey, G., Vayshenker, A., Tan, W.L., Ebert, A., Lin, W., Gao, W., Lian, J., Kim, J.-P., Wrschka, P., Yang, J.-H., Ajmera, A., Knoefler, R., Teh, Y.-W., Jamin, F., Park, J.E., Hooper, K., Griffin, C., Nguyen, P., Klee, V., Ku, V., Baiocco, C., Johnson, G., Tai, L., Benedict, J., Scheer, S., Zhuang, H., Ramanchandran, V., Matusiewicz, G., Lin, Y.-H., Siew, Y.K., Zhang, F., Leong, L.S., Liew, S.L., park, K.C, Lee, K.-W., Hong, D.H., Choi, S.-M., Kaltalioglu, E., Kim, S.O., Naujok, M., Sherony, M., Cowley, A., Thomas, A., Sudijohno, J., Schiml, T., Ku, J.-H., Yang, I.
Source: IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. International Electron Devices Meeting 2005 Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International. :64-67 2005
Relation: International Electron Devices Meeting 2005
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10Report
Authors: De Iorio, M., Elliott, L. T., Favaro, S., Adhikari, K., Teh, Y. W.
Access URL: http://arxiv.org/abs/1503.08278
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11Academic Journal
Authors: Teh, Y.-K., Mohd-Yasin, F., Choong, F., Reaz, M., Kordesch, A. V.
Source: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 56(2):122-126 Feb, 2009
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12Academic Journal
Authors: Adams, R.P., Fox, E.B., Sudderth, E.B., Whye Teh, Y.
Source: IEEE Transactions on Pattern Analysis and Machine Intelligence IEEE Trans. Pattern Anal. Mach. Intell. Pattern Analysis and Machine Intelligence, IEEE Transactions on. 37(2):209-211 Feb, 2015
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13Conference
Authors: Yang, H. S., Wong, R., Hasumi, R., Gao, Y., Kim, N.S., Lee, D. H., Badrudduza, S., Nair, D., Ostermayr, M., Kang, H., Zhuang, H., Li, J., Kang, L., Chen, X., Thean, A., Arnaud, F., Zhuang, L., Schiller, C., Sun, D. P., Teh, Y. W., Wallner, J., Takasu, Y., Stein, K., Samavedam, S., Jaeger, D., Baiocco, C.V., Sherony, M., Khare, M., Lage, C., Pape, J., Sudijono, J., Steegen, A.L., Stiffler, S.
Source: 2008 IEEE International Electron Devices Meeting Electron Devices Meeting, 2008. IEDM 2008. IEEE International. :1-4 Dec, 2008
Relation: 2008 IEEE International Electron Devices Meeting (IEDM)
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14Conference
Authors: Chen, X., Samavedam, S., Narayanan, V., Stein, K., Hobbs, C., Baiocco, C., Li, W., Jaeger, D., Zaleski, M., Yang, H. S., Kim, N., Lee, Y., Zhang, D., Kang, L., Chen, J., Zhuang, H., Sheikh, A., Wallner, J., Aquilino, M., Han, J., Jin, Z., Li, J., Massey, G., Kalpat, S., Jha, R., Moumen, N., Mo, R., Kirshnan, S., Wang, X., Chudzik, M., Chowdhury, M., Nair, D., Reddy, C., Teh, Y. W., Kothandaraman, C., Coolbaugh, D., Pandey, S., Tekleab, D., Thean, A., Sherony, M., Lage, C., Sudijono, J., Lindsay, R., Ku, J. H., Khare, M., Steegen, A.
Source: 2008 Symposium on VLSI Technology VLSI Technology, 2008 Symposium on. :88-89 Jun, 2008
Relation: 2008 Symposium on VLSI Technology
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15Conference
Authors: Khaw, M. K., Mohd-Yasin, F., Teh, Y. K., Reaz, M B.I.
Source: 2006 IEEE International Conference on Semiconductor Electronics Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on. :901-905 Nov, 2006
Relation: 2006 IEEE International Conference on Semiconductor Electronics
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16Conference
Authors: Teh, Y. K., Mohd-Yasin, F., Reaz, M. B. I., Kordesch, A.
Source: 2006 IEEE International Conference on Semiconductor Electronics Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on. :896-900 Nov, 2006
Relation: 2006 IEEE International Conference on Semiconductor Electronics
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17Academic Journal
Authors: Ashton, L. A., Griffiths, H. M., Parr, C. L., Evans, T. A., Didham, R. K., Hasan, F., Teh, Y. A., Tin, H. S., Vairappan, C. S., Eggleton, P.
Source: Science, 2019 Jan 01. 363(6423), 174-177.
Access URL: https://www.jstor.org/stable/26569979
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18Academic Journal
Authors: Teh, Y., Mok, P.K.T.
Source: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 63(5):508-512 May, 2016
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19Conference
Authors: Hamaguchi, M., Nair, D., Jaeger, D., Nishimura, H., Li, W., Na, M-H., Bernicot, C., Liang, J., Stahrenberg, K., Kim, K., Eller, M., Lee, K-C., Iwamoto, T., Teh, Y-W., Mori, S., Takasu, Y., Park, JH, Song, L., Kim, N-S., Kohler, S., Kothari, H., Han, J-P., Miyake, S., Meer, H.V., Arnaud, F., Barla, K., Sherony, M., Donaton, R., Celik, M., Miyashita, K., Narayanan, V., Wachnik, R., Chudzik, M., Sudijono, J., Ku, J.-H., Kim, J.D., Sekine, M., Johnson, S., Neumueller, W., Sampson, R., Kaste, E., Divakaruni, R., Matsuoka, F.
Source: 2011 International Electron Devices Meeting Electron Devices Meeting (IEDM), 2011 IEEE International. :25.6.1-25.6.4 Dec, 2011
Relation: 2011 IEEE International Electron Devices Meeting (IEDM)
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20Conference
Authors: Tan, Y. M., Tan, C. Y., Singh, R., Teh, Y. C., Yap, B. K.
Source: Materials science forum. 866:181-185