Showing 1 - 20 results of 3,040 Refine Results
  1. 1
    Academic Journal

    Antenna-Integrated and PA-Embedded Glass Substrates for D-Band InP Power Amplifier Modules

    Authors: Jia, X., Li, X., Woo Kim, J., Moon, K., Rodwell, M.J.W., Swaminathan, M.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 15(4):782-791 Apr, 2025

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  2. 2
    Academic Journal

    Broadband Characterization of Interconnects in Die-Embedded Glass Interposer

    Authors: Erdogan, S., Jia, X., Li, X., Kathaperumal, M., Agarwal, R., Swaminathan, M.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 15(4):766-773 Apr, 2025

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  3. 3
    Academic Journal

    Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications

    Authors: Dwarakanath, S., Bhaskar, P., Kanno, K., Nimbalkar, P.C., Kathaperumal, M., Raj Pulugurtha, M., Swaminathan, M., Tummala, R.R.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 15(1):131-139 Jan, 2025

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  4. 4
    Academic Journal

    Glass Package With Multiple Embedded Dies for mmWave Applications

    Authors: Li, X., Jia, X., Woo Kim, J., Erdogan, S., Moon, K., Jordan, M.B., Swaminathan, M.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(10):1816-1824 Oct, 2024

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  5. 5
    Academic Journal

    Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Small-Cell Applications

    Authors: Aslani-Amoli, N., Liu, F., Swaminathan, M., Zhuang, C., Zhelev, N.Z., Seok, S., Kim, C.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(3):437-444 Mar, 2024

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  6. 6
    Academic Journal

    Real-Time Digital RF Emulation—Part I: The Direct Path Computational Model

    Authors: DeLude, C., Driscoll, J., Mukherjee, M., Rahman, N., Mao, X., Kamal, U., Khan, S., Sivaraman, H., Huang, E., McHarg, J., Swaminathan, M., Pande, S., Mukhopadhyay, S., Romberg, J.

    Source: IEEE Transactions on Radar Systems Trans. Rad. Sys. Radar Systems, IEEE Transactions on. 2:866-879 2024

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  7. 7
    Academic Journal

    Real-Time Digital RF Emulation—Part II: A Near Memory Custom Accelerator

    Authors: Mao, X., Mukherjee, M., Rahman, N.M., DeLude, C., Driscoll, J., Sharma, S., Behnam, P., Kamal, U., Woo, J., Kim, D., Khan, S., Tong, J., Seo, J., Sinha, P., Swaminathan, M., Krishna, T., Pande, S., Romberg, J., Mukhopadhyay, S.

    Source: IEEE Transactions on Radar Systems Trans. Rad. Sys. Radar Systems, IEEE Transactions on. 2:849-865 2024

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  8. 8
    Academic Journal

    Air-Filled SIWs Using Laminate Dielectrics on Glass Substrate for D-Band Applications

    Authors: Rehman, M.u., Kumar, L.N.V., Erdogan, S., Swaminathan, M.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(1):98-105 Jan, 2024

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  9. 9
    Academic Journal

    Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75–170 GHz Wireless Applications

    Authors: Aslani-Amoli, N., Rehman, M.u., Vijay Kumar, L.N., Moradinia, A., Liu, F., Swaminathan, M., Zhuang, C., Vaddi, R., Seok, S., Kim, C.

    Source: IEEE Microwave and Wireless Technology Letters IEEE Microw. Wireless Tech. Lett. Microwave and Wireless Technology Letters, IEEE. 33(10):1415-1418 Oct, 2023

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  10. 10
    Academic Journal

    Extrapolation With Range Determination of 2-D Spectral Transposed Convolutional Neural Network for Advanced Packaging Problems

    Authors: Guo, Y., Jia, X., Li, X., Wang, Y., Kumar, R., Sharma, R., Swaminathan, M.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(10):1533-1544 Oct, 2023

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  11. 11
    Academic Journal

    Characterization of Microstrip Line and SIW on ABF in Glass Interposers for mmWave Applications

    Authors: ur Rehman, M., Kumar, L.N.V., Swaminathan, M.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(9):1520-1523 Sep, 2023

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  12. 12
    Academic Journal

    D-Band Integrated and Miniaturized Quasi-Yagi Antenna Array in Glass Interposer

    Authors: Erdogan, S., Moon, K.J., Kathaperumal, M., Swaminathan, M.

    Source: IEEE Transactions on Terahertz Science and Technology IEEE Trans. THz Sci. Technol. Terahertz Science and Technology, IEEE Transactions on. 13(3):270-279 May, 2023

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  13. 13
    Academic Journal

    A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers

    Authors: Liu, F., Nimbalkar, P., Aslani-Amoli, N., Kathaperumal, M., Tummala, R., Swaminathan, M.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(3):291-299 Mar, 2023

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  14. 14
    Academic Journal

    Antenna Array on Glass Interposer for 6G Wireless Communications

    Authors: Huang, K., Swaminathan, M.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(2):211-218 Feb, 2023

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  15. 15
    Academic Journal

    Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications

    Authors: Jia, X., Li, X., Erdogan, S., Moon, K., Kim, J.W., Huang, K., Jordan, M.B., Swaminathan, M.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(2):219-229 Feb, 2023

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  16. 16
    Conference

    Ultra-Wide Bandwidth Substrate Integrated Waveguide Fed Vivaldi Antenna in D-Band Using Glass Interposer

    Authors: Vijay Kumar, L.N., Swaminathan, M.

    Source: 2023 IEEE Radio and Wireless Symposium (RWS) Radio and Wireless Symposium (RWS), 2023 IEEE. :150-152 Jan, 2023

    Relation: 2023 IEEE Radio and Wireless Symposium (RWS)

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  17. 17
    Academic Journal

    Bayesian Learning for Uncertainty Quantification, Optimization, and Inverse Design

    Authors: Swaminathan, M., Bhatti, O.W., Guo, Y., Huang, E., Akinwande, O.

    Source: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 70(11):4620-4634 Nov, 2022

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  18. 18
    Academic Journal

    Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications

    Authors: ur Rehman, M., Kumar, L.N.V., Swaminathan, M.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(10):1719-1722 Oct, 2022

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  19. 19
    Academic Journal

    Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications

    Authors: Aslani-Amoli, N., ur Rehman, M., Liu, F., Swaminathan, M., Zhuang, C., Zhelev, N.Z., Seok, S., Kim, C.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(9):1432-1445 Sep, 2022

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  20. 20
    Academic Journal

    Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications

    Authors: Sivapurapu, S., Chen, R., Kanno, K., Kakutani, T., Letz, M., Liu, F., Sitaraman, S.K., Swaminathan, M.

    Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(9):1465-1473 Sep, 2022

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