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1Conference
Authors: Dias, A., Felizardo, E., Bundaleska, N., Henriques, J., Tatarova, E., Kovacevic, E., Berndt, J., Strunskus, T., Cvelbar, U., Abrashev, M., Almeida, A., Do Rego, A.M.B., Ferraria, A.M.
Source: 2020 IEEE International Conference on Plasma Science (ICOPS) Plasma Science (ICOPS), 2020 IEEE International Conference on. :470-470 Dec, 2020
Relation: 2020 IEEE International Conference on Plasma Science (ICOPS)
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2Report
Authors: Abraham, J. W., Strunskus, T., Faupel, F., Bonitz, M.
Source: J. Appl. Phys. 119, 185301 (2016)
Subject Terms: Condensed Matter - Materials Science
Access URL: http://arxiv.org/abs/1602.06265
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3Report
Authors: Rosenthal, L., Greve, H., Zaporojtchenko, V., Strunskus, T., Faupel, F., Bonitz, M.
Source: Journal of Applied Physics 114 (4), 044305 (2013)
Subject Terms: Condensed Matter - Materials Science, Physics - Plasma Physics
Access URL: http://arxiv.org/abs/1302.2595
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4Conference
Authors: Kovacevic, E., Hussain, S., Berndt, J., Pattyn, C., Strunskus, T., Ammar, M. R., Canizarès, A., Simon, P., Tatarova, E., Dias, A.
Source: ECS transactions. 77(3):37-40
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5Periodical
Authors: Schröder, S., Ababii, N., Lupan, O., Drewes, J., Magariu, N., Krüger, H., Strunskus, T., Adelung, R., Hansen, S., Faupel, F.
Source: Materials today chemistry. 23
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6Academic Journal
Authors: Sharma, S. K., Strunskus, T., Ladebusch, H.
Source: Journal of Materials Science; Aug2008, Vol. 43 Issue 16, p5495-5503, 9p
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7Academic Journal
Authors: Schneider, V., Strunskus, T., Elbahri, M., Faupel, F.
Source: In Carbon August 2015 90:94-101
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8Conference
Authors: Rosenthal, L., Strunskus, T., Faupel, F., Abraham, J.W., Bonitz, M.
Source: SPRINGER SERIES ON ATOMIC. 82:321-372
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9Conference
Authors: Faupel, F., Strunskus, T., Kiene, M., Thrun, A., Bechtolsheim, C.V.
Source: 1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105) Solid-state and integrated circuit technology Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on. :206 1998
Relation: Proceedings of Fifth International Conference on Solid-State and Integrated Circuit Technology-ICSICT'98
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10Periodical
Authors: Schneider, V., Polonskyi, O., Strunskus, T., Elbahri, M., Faupel, F.
Source: Scientific reports. 7(1):1-9
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11Periodical
Authors: Xiong, J., Ghori, M. Z., Henkel, B., Strunskus, T., Schürmann, U., Deng, M., Kienle, L., Faupel, F.
Source: APPLIED PHYSICS A MATERIALS SCIENCE AND PROCESSING. 123(7):1-11
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12Conference
Authors: Hasegawa, T., Strunskus, T., Zaporotjenko, V., Faupel, F., Mizuhata, M.
Source: ECS TRANSACTIONS. 41(30):9-18
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13Conference
Authors: Neubert, T., Vergohl, M., Strunskus, T., Faupel, F.
Source: PROCEEDINGS OF THE ANNUAL TECHNICAL CONFERENCE- SOCIETY OF VACUUM COATERS. CONF 55:274-277
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14Academic Journal
Authors: Ebbert, C., Alissawi, N., Somsen, C., Eggeler, G., Strunskus, T., Faupel, F., Grundmeier, G.
Source: In Thin Solid Films 28 November 2014 571 Part 1:161-167
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15Periodical
Authors: Henkel, B., Neubert, T., Zabel, S., Lamprecht, C., Selhuber-Unkel, C., Ratzke, K., Strunskus, T., Vergohl, M., Faupel, F.
Source: APPLIED CATALYSIS B. 180:362-371
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16Conference
Authors: Biswas, A., Marton, Z., Kanzow, J., Kruse, J., Zaporojtchenko, V., Strunskus, T., Czank, M., Faupel, F.
Source: DIFFUSION AND DEFECT DATA PART B SOLID STATE PHENOMENA. 94:285-294
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17Conference
Authors: Erichsen, J., Gunther-Schade, K., Dolgner, K., Strunskus, T., Zaporojtchenko, V., Faupel, F.
Source: MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS. 710:259-264
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18Conference
Authors: Zaporojtchenko, V., Erichsen, J., Strunskus, T., Behnke, K., Faupel, F., Baklanov, M., Maex, K.
Source: MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS. 714:52-57
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19Conference
Source: BOOK- INSTITUTE OF MATERIALS. 772/REV:135-147
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20Periodical
Authors: Veziroglu, S., Hwang, J., Drewes, J., Barg, I., Shondo, J., Strunskus, T., Polonskyi, O., Faupel, F., Aktas, O.C.
Source: Materials today chemistry. 16