37.1 IBM Telum II Processor Design-Technology Co-Optimizations for Power, Performance, Area, and Reliability

Authors: Wolpert, David, Strevig, Gerry, Berry, Chris, Sigal, Leon, Huott, Bill, Cichanowski, Mark, Pflanz, Matthias, Werner, Tobias, Salz, Philipp, Jinq, Nick, Romain, Michael, Leefken, Iris, Serton, Richard, Veerabhadraiah, Rajesh, Chidambarrao, Dureseti, Arelt, Robert, Angyal, Matt, Trombley, Ben, Haran, Arvind, Hougardy, Stefan, Klotz, Ben, Rao, Rahul

Source: 2025 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2025 IEEE International. 68:606-608 Feb, 2025

Relation: 2025 IEEE International Solid-State Circuits Conference (ISSCC)