Discussion of the height scan introduced in CISPR 32 for measuring emissions above 1 GHz

Authors: Battermann, S., Hemmerlein, K., Stecher, M.

Source: 2023 International Symposium on Electromagnetic Compatibility – EMC Europe Electromagnetic Compatibility – EMC Europe, 2023 International Symposium on. :1-6 Sep, 2023

Relation: 2023 International Symposium on Electromagnetic Compatibility – EMC Europe

Modeling the lifetime of a lateral DMOS transistor in repetitive clamping mode

Authors: Riedlberger, E., Keller, R., Reisinger, H., Gustin, W., Spitzer, A., Stecher, M., Jungemann, C.

Source: 2010 IEEE International Reliability Physics Symposium Reliability Physics Symposium (IRPS), 2010 IEEE International. :175-181 May, 2010

Relation: 2010 IEEE International Reliability Physics Symposium (IRPS)

Physical models for smart-power devices

Authors: Rudan, M., Reggiani, S., Gnani, E., Baccarani, G., corvasce, C., Ciappa, M., Stecher, M., Pogany, D., Gornik, E.

Source: Proceedings of the International Conference Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006. Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006. Proceedings of the International Conference. :28-33 2006

Relation: Proceedings of the International Conference Mixed Design of Integrated Circuits and System

Research for EMI basic standards

Authors: Stecher, M.

Source: 2006 17th International Zurich Symposium on Electromagnetic Compatibility Electromagnetic Compatibility Electromagnetic Compatibility, 2006. EMC-Zurich 2006. 17th International Zurich Symposium on. :144-147 2006

Relation: 17th International Zurich Symposium on Electromagnetic Compatibility

Improved reproducibility of conducted emission measurements

Authors: Stecher, M.

Source: 2006 17th International Zurich Symposium on Electromagnetic Compatibility Electromagnetic Compatibility Electromagnetic Compatibility, 2006. EMC-Zurich 2006. 17th International Zurich Symposium on. :509-512 2006

Relation: 17th International Zurich Symposium on Electromagnetic Compatibility

Possible effects of spread-spectrum-clock interference on wideband radiocommunication services

Authors: Stecher, M.

Source: 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Electromagnetic Compatibility Electromagnetic Compatibility, 2005. EMC 2005. 2005 International Symposium on. 1:60-63 2005

Relation: 2005 IEEE International Symposium on Electromagnetic Compatibility

Analysis and modeling of DMOS FBSOA limited by n-p-n leakage diffusion current

Authors: Denison, M., Pfost, M., Stecher, M., Silber, D.

Source: Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005. Power semiconductor devices & ICs Power Semiconductor Devices and ICs, 2005. Proceedings. ISPSD '05. The 17th International Symposium on. :331-334 2005

Relation: Proceedings of the 17th International Symposium on Power Semiconductor Devices & ICs

Algorithm for the automatic verification of complex mixed-signal ICs regarding ESD-stress

Authors: Morgenstern, H., Groos, G., Kohne, H., Stecher, M., John, W., Reichl, H.

Source: Research in Microelectronics and Electronics, 2005 PhD Microelectronics and Electronics Research in Microelectronics and Electronics, 2005 PhD. 1:213-216 vol.1 2005

Relation: 2005 PhD Research in Microelectronics and Electronics

Predictive device simulation for ESD protection structures validated with transient interferometric thermal-mapping experiments

Authors: Reggiani, S., Gnani, E., Rudan, M., Baccarani, G., Bychikhin, S., Kuzmik, J., Pogany, D., Gornik, E., Denison, M., Jensen, N., Groos, G., Stecher, M.

Source: Proceedings of 35th European Solid-State Device Research Conference, 2005. ESSDERC 2005. Solid-State Device Research Conference Solid-State Device Research Conference, 2005. ESSDERC 2005. Proceedings of 35th European. :411-414 2005

Relation: Proceedings of ESSDERC 2005. 31st European Solid-State Device Research Conference

Experimental validation of a new analytical model for the position-dependent Hall voltage in semiconductor devices

Authors: Rudan, M., Reggiani, S., Gnani, E., Baccarani, G., Corvasce, C., Barlini, D., Ciappa, M., Fichtner, W., Denison, M., Jensen, N., Groos, G., Stecher, M.

Source: Proceedings of 35th European Solid-State Device Research Conference, 2005. ESSDERC 2005. Solid-State Device Research Conference Solid-State Device Research Conference, 2005. ESSDERC 2005. Proceedings of 35th European. :565-568 2005

Relation: Proceedings of ESSDERC 2005. 31st European Solid-State Device Research Conference

A new test circuit for the matching characterization of npn bipolar transistors

Authors: Einfeld, J., Schaper, U., Kollmer, U., Nelle, P., Englisch, J., Stecher, M.

Source: Proceedings of the 2004 International Conference on Microelectronic Test Structures (IEEE Cat. No.04CH37516) Microelectronic test structures Microelectronic Test Structures, 2004. Proceedings. ICMTS '04. The International Conference on. :127-131 2004

Relation: Proceedings of the 2004 International Conference on Microelectronic Test Structures

Experimental extraction of the electron impact-ionization coefficient at large operating temperatures

Authors: Reggiani, S., Gnani, E., Rudan, M., Baccarani, G., Corvasce, C., Barlini, D., Ciappa, M., Fichtner, W., Denison, M., Jensen, N., Groos, G., Stecher, M.

Source: IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004. Electron devices meeting Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International. :407-410 2004

Relation: 2004 International Electron Devices Meeting

Influence of inhomogeneous current distribution on the thermal SOA of integrated DMOS transistors

Authors: Denison, M., Pfost, M., Pieper, K.-W., Markl, S., Metzner, D., Stecher, M.

Source: 2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs Power semiconductor devices and ICs Power Semiconductor Devices and ICs, 2004. Proceedings. ISPSD '04. The 16th International Symposium on. :409-412 2004

Relation: Proceedings of the 16th International Symposium on Power Semiconductor Devices & IC's

Improvements in conducted emission measurements

Authors: Stecher, M.

Source: 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) Electromagnetic compatibility Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on. 1:191-196 vol.1 2004

Relation: 2004 International Symposium on Electromagnetic Compatibility

Hot spot dynamics in quasivertical DMOS under ESD stress

Authors: Denison, M., Blaho, M., Silber, D., Joos, J., Jensen, N., Stecher, M., Dubec, V., Pogany, D., Gornik, E.

Source: ISPSD '03. 2003 IEEE 15th International Symposium on Power Semiconductor Devices and ICs, 2003. Proceedings. Power semiconductor devices and IC's Power Semiconductor Devices and ICs, 2003. Proceedings. ISPSD '03. 2003 IEEE 15th International Symposium on. :80-83 2003

Relation: IEEE International Symposium on Power Semiconductor Devices and Integrated Circuits

A weighting detector for the effect of interference on digital radiocommunication services

Authors: Stecher, M.

Source: 2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03. Electromagnetic compatibility Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on. 1:449-452 Vol.1 2003

Relation: 2003 IEEE International Symposium on Electromagnetic Compatibility (EMC)

Moving current filaments in ESD protection devices and their relation to electrical characteristics

Authors: Pogany, D., Bychikhin, S., Gornik, E., Denison, M., Jensen, N., Groos, G., Stecher, M.

Source: 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual. Reliability physics symposium Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International. :241-248 2003

Relation: International Reliability Physics Symposium

Pulsed THz emission from low temperature grown Be-doped InGaAs/InAlAs photoconductive switches at 1030 nm excitation

Authors: Dietz, R. J. B., Wilk, R., Globisch, B., Roehle, H., Stanze, D., Ullrich, S., Schumann, S., Born, N., Voss, N., Stecher, M., Koch, M., Sartorius, B., Schell, M.

Source: 2012 37th International Conference on Infrared, Millimeter, and Terahertz Waves Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), 2012 37th International Conference on. :1-3 Sep, 2012

Relation: 2012 37th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz 2012)

Automated measurement of emissions from equipment and systems

Authors: Stecher, M.

Source: 2002 IEEE International Symposium on Electromagnetic Compatibility Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on. 2:593-598 vol.2 2002

Relation: 2002 IEEE International Symposium on Electromagnetic Compatibility

A Method for Extraction of Power Dissipating Sources from Interferometric Thermal Mapping Measurements

Authors: Pogany, D., Litzenberger, M., Bychikhin, S., Gornik, E., Groos, G., Stecher, M.

Source: 32nd European Solid-State Device Research Conference Solid-State Device Research Conference, 2002. Proceeding of the 32nd European. :243-246 2002

Relation: 32nd European Solid-State Device Research Conference